Johannes Hörber | Neotech AMT: Your CAD file is ready, but how do you translate a complex 3D mechatronic design into an automated, multi-process manufacturing sequence?
00:09:01 - 00:10:17
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Your CAD file is ready, but how do you translate a complex 3D mechatronic design into an automated, multi-process manufacturing sequence?
The manufacturing process begins with the import of an external 3D design into Neotech's specialized software environment. This software serves as the critical bridge between the digital design and the physical manufacturing hardware. It provides the tools necessary to prepare the complex geometry for a multi-step production sequence involving both additive manufacturing of the structure and the subsequent addition of electronic functionality.
A key step in the workflow is the intelligent segmentation of the component. Instead of just slicing the model geometrically, the software allows the operator to define and separate blocks based on functional or material requirements. This means grouping features that will become conductive traces, dielectric layers, or locations for specific components, which is a more sophisticated approach than simple geometric decomposition and is essential for programming hybrid manufacturing processes.
Once the component is segmented, the software enables the assignment of specific manufacturing processes to each distinct geometry or functional block. For example, one block might be assigned to a fused filament fabrication process, another to an aerosol jet printing process for traces, and another to a pick-and-place routine. The software then compiles these individual process steps into a single, synchronized G-code file for fully automated execution on the machine.
In this short video, you can learn:
* The digital workflow for programming a multi-process 3D electronics manufacturing system.
* How to segment a 3D model based on functional and material properties, not just geometry.
* The process of assigning different manufacturing technologies (e.g., FFF, jetting, pick-and-place) to different parts of a design to generate a unified G-code.
📋 **Clip Abstract** This clip outlines the crucial software workflow for turning a 3D design into a manufacturable mechatronic device. Learn how the system segments a component based on function and material, assigns the appropriate manufacturing processes, and generates a single G-code for automated, multi-tool execution.
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#FunctionalSegmentation, #MultiProcessManufacturing, #GCodeAutomation, #3DMechatronics, #AdditiveElectronics, #3DElectronics
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00:02:50 - 00:04:11
How do you combine jetting, dispensing, pick-and-place, and laser processing on a single 5-axis platform for 3D printed electronics?
How do you combine jetting, dispensing, pick-and-place, and laser processing on a single 5-axis platform for 3D printed electronics?
Neotech AMT's approach to 3D printed electronics is built on a multi-process, integrated system. The foundation is a 5-axis CNC platform, specifically chosen for true 3D processing on complex, non-planar surfaces, rather than simple 2.5D or layered approaches. This kinematic system allows for precise manipulation of both the tool head and the part, enabling conformal deposition and component placement on curved and intricate geometries.
The system's versatility comes from the integration of a wide array of process modules. This includes various deposition technologies like piezo and aerosol jetting for fine-feature printing, as well as traditional ink jetting and dispensing. Crucially, it also incorporates standard SMT pick-and-place capabilities for hybrid electronics and a suite of pre- and post-processing tools, such as plasma surface treatment, UV/IR curing, and laser systems for both curing and high-precision ablation.
The key to managing this complexity is a unified software package. This software acts as the central nervous system, providing the operator with a single interface to program, sequence, and control all the disparate processes. The goal is to create a seamless workflow from digital design to the final, functional mechatronic part, abstracting the complexity of coordinating multiple tool heads and process parameters.
In this short video, you can learn:
* The core components of a hybrid 5-axis system for 3D Molded Interconnect Devices (3D-MID).
* Which printing, assembly, and curing technologies can be integrated into a single machine.
* The critical role of a unified software platform in enabling multi-process additive manufacturing.
📋 **Clip Abstract** Discover the architecture of a versatile 5-axis manufacturing platform that combines multiple printing technologies, SMT pick-and-place, and various curing/ablation methods. This system is designed to produce fully integrated 3D mechatronic devices through a unified software-driven workflow.
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#5AxisAdditiveManufacturing, #MultiProcessIntegration, #HybridElectronics, #ConformalElectronics, #3DMoldedInterconnectDevices, #MechatronicDevices
00:11:56 - 00:12:58
What if your 3D electronics printer could not only build a device, but also inspect it, repair it, and even disassemble it for recycling?
What if your 3D electronics printer could not only build a device, but also inspect it, repair it, and even disassemble it for recycling?
To enable a circular economy for embedded electronics, where repair is often impossible, Neotech AMT is developing advanced inline process monitoring. This system uses a neural network-based tool to inspect each layer of the printed device during fabrication. By comparing the actual print against the G-code, the system can detect defects like short circuits or broken traces in real-time, preventing waste by catching errors before the component is fully encapsulated and becomes a throwaway item.
Once a defect is identified, the system can trigger automated repair sequences using the multiple tools available on the platform. For open circuits, the machine can use its printing heads to deposit additional conductive material to bridge the gap. Conversely, for short circuits or excess material, an integrated laser ablation tool can be used to precisely remove the unwanted material, ensuring the circuit's integrity and dramatically increasing production yield.
This multi-tool approach extends beyond fabrication and repair to end-of-life disassembly, a critical step for sustainability. The concept involves using the system's G-code in reverse, employing an "inverted pick and place" process to remove valuable components for reuse. Combined with laser ablation to de-bond adhesives or cut away materials, this facilitates the recovery of high-value components and materials, moving beyond simple repair to true remanufacturing and recycling.
In this short video, you can learn:
* How to use neural networks for real-time, in-situ quality control during 3D electronics printing.
* The concept of automated repair using both additive (re-printing) and subtractive (laser ablation) processes.
* A forward-looking vision for end-of-life disassembly using "inverted pick and place" and laser de-bonding.
📋 **Clip Abstract** This clip outlines a groundbreaking approach to sustainable electronics manufacturing, focusing on in-process quality control and end-of-life management. Learn how AI-driven monitoring, automated repair via printing and laser ablation, and novel disassembly techniques can create a truly circular economy for 3D printed electronics.
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#NeuralNetworkMonitoring, #AutomatedRepair, #LaserAblation, #InvertedPickAndPlace, #3DElectronics, #CircularElectronics