Jonas Deitschun | Fraunhofer IFAM: Why is the century-old method of making circuit boards inherently wasteful, and how can additive printing flip the script?
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Summary of the clip:
Why is the century-old method of making circuit boards inherently wasteful, and how can additive printing flip the script?
Conventional multilayer PCB manufacturing has a significant environmental impact due to its subtractive nature. The process starts by laminating a full sheet of copper onto a substrate like FR-4, completely covering the surface. This method ensures a uniform base layer but sets the stage for a resource-intensive removal process.
The desired circuit pattern is then created by etching away all the unwanted copper. This subtractive approach generates a massive amount of waste, not only in the form of dissolved metal but also the harsh chemicals required for the etching process. Essentially, the majority of the initial high-value material is removed and discarded to create the final product.
Hybrid electronics, utilizing additive printing techniques, offers a more sustainable alternative. Instead of removing material, these processes deposit conductive material only where it is needed, drastically reducing metal and chemical waste. This additive-by-design approach fundamentally lowers the overall environmental footprint of electronics manufacturing.
In this short video, you can learn:
* The fundamental difference between subtractive (etching) and additive (printing) electronics manufacturing.
* The primary sources of waste in conventional PCB production.
* How hybrid electronics provides a more resource-efficient manufacturing pathway.
π **Clip Abstract** This clip explains the inherent wastefulness of the traditional subtractive etching process used to make PCBs. It then introduces hybrid electronics as an additive alternative that significantly reduces metal and chemical waste.
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#AdditiveManufacturing, #SubtractiveManufacturing, #PrintedElectronics, #EtchingWaste, #SustainableElectronics, #FlexibleElectronics
This is a highlight of the presentation:
Hybrid electronics compared to conventional PCBs: their advantages and challenges
More Highlights from the same talk.
00:04:11.485 - 00:05:32.545
Can simply switching from etching to printing electronics really slash their environmental impact, even when using more precious metals like silver?
Can simply switching from etching to printing electronics really slash their environmental impact, even when using more precious metals like silver?
A life cycle analysis study provides compelling evidence for the environmental benefits of printed electronics. The study compares a conventional etched copper PCB on an FR-4 substrate with two screen-printed alternatives: one on the same FR-4 and another on a flexible PET substrate. This direct comparison allows for a clear quantification of the process and material changes.
The results show that switching from a subtractive etching process to an additive screen-printing process dramatically reduces environmental impact. Key metrics like Global Warming Potential and Human Toxic Potential are significantly lowered across the board. This demonstrates a clear, data-backed advantage for the printing-based approach to circuit fabrication.
Interestingly, these benefits hold true even when using silver paste for the printed circuits instead of copper. Because the additive process is so efficient, it uses only a tiny fraction of the metal compared to the subtractive method, where most of the copper is etched away. This massive reduction in material consumption far outweighs the higher impact of the silver itself, making it a far more sustainable option overall.
In this short video, you can learn:
* How a life cycle analysis quantifies the environmental impact of different PCB manufacturing methods.
* The significant reduction in Global Warming Potential and Human Toxicity achieved by screen printing.
* Why using a small amount of silver in an additive process is more sustainable than wasting large amounts of copper in a subtractive one.
π **Clip Abstract** This segment presents data from a study comparing conventional and printed PCBs, quantifying the dramatic reduction in environmental impact. It highlights how additive manufacturing's material efficiency outweighs the use of silver over copper.
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#PrintedElectronics, #LifeCycleAssessment, #ScreenPrinting, #AdditiveManufacturing, #FlexibleElectronics, #SustainableElectronics
00:07:50.105 - 00:08:28.765
What's the trickiest part of printing a complex, multilayer circuit board, and how does it all come down to the properties of the ink?
What's the trickiest part of printing a complex, multilayer circuit board, and how does it all come down to the properties of the ink?
A primary technical challenge in creating multilayer printed electronics is the via filling process. Vias are the conductive holes that connect different layers of the circuit, and ensuring a reliable, low-resistance connection is absolutely critical for the device's function and long-term reliability.
Successfully depositing the conductive paste into these small, high-aspect-ratio holes is a delicate balancing act. The process parameters must be precisely controlled, as the thickness of the printed layer itself is limited by the need to fill the vias effectively. If the paste is not deposited correctly, it can lead to open circuits and device failure.
The key to success lies in rheologyβthe flow properties of the conductive paste. The viscosity of the paste must be perfectly matched to the specific dimensions of the vias, the mesh size of the printing screen, and the overall circuit layout. This ensures the material flows into the vias completely without voids, creating a robust and reliable interlayer connection.
In this short video, you can learn:
* Why via filling is a critical and challenging step in producing multilayer printed PCBs.
* The relationship between printable layer thickness and the ability to fill vias.
* The crucial role of paste viscosity and its interplay with screen and layout dimensions.
π **Clip Abstract** This clip details a key manufacturing hurdle in printed electronics: filling the vias that connect different circuit layers. Success depends on precisely matching the conductive paste's viscosity to the physical dimensions of the vias and the screen.
π Link in comments π
#ViaFilling, #ConductivePasteRheology, #MultilayerPrintedCircuits, #ScreenPrinting, #AdditiveElectronics, #FlexibleElectronics