Kyung Yul LEE | SamwonAct: Why does the cross-sectional shape of roll-to-roll printed metal traces dramatically reduce insertion loss at ultra-high frequencies?
08:09 - 09:34
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Why does the cross-sectional shape of roll-to-roll printed metal traces dramatically reduce insertion loss at ultra-high frequencies?
Conventional subtractive chemical etching produces metal traces with non-uniform, trapezoidal, or irregular cross-sections and rough sidewalls. These geometric imperfections are highly detrimental to high-frequency electrical signals due to the skin effect. SamwonAct's MPTP technology resolves this issue by ensuring pristine, uniform rectangular or arched cross-sections.
Surface roughness is also drastically minimized during the electroforming stage of MPTP. Because the metal is deposited directly onto a polished, micro-fabricated mold, the final contact surface achieves near-perfect smoothness. This structural uniformity translates directly into superior electromagnetic performance.
Empirical insertion loss measurements demonstrate a clear advantage for MPTP-produced signal lines over chemically etched counterparts. This makes the technology highly valuable for ultra-high-frequency applications, including high-speed communication cables and flexible flat antennas.
In this short video, you can learn:
* The physical differences in trace cross-sections between subtractive chemical etching and additive MPTP.
* Why surface smoothness in electroformed traces mitigates signal degradation at ultra-high frequencies.
* How optimized trace geometries directly translate into lower insertion loss in high-speed transmission lines.
📋 **Clip Abstract** This clip compares the cross-sectional geometry and surface quality of MPTP traces versus chemically etched circuits. It demonstrates how MPTP's superior surface smoothness and uniform arch shape dramatically reduce insertion loss for ultra-high-frequency applications.
#MetalPatternTransferPrinting, #Electroforming, #InsertionLossReduction, #FlexibleFlatAntennas, #PrintedElectronics, #HighFrequencyElectronics
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01:56 - 03:52
How can we replace chemical etching with a continuous, roll-to-roll additive pattern transfer process for ultra-thin metal circuits?
How can we replace chemical etching with a continuous, roll-to-roll additive pattern transfer process for ultra-thin metal circuits?
Micro metal Pattern Transfer Printing (MPTP) offers a disruptive additive manufacturing pathway for producing high-precision flexible flat cables and electronic components. The process bypasses traditional subtractive chemical etching, which is notorious for environmental waste, chemical hazards, and dimensional limitations. Instead, MPTP operates on a highly efficient bottom-up design.
The architecture relies on a continuous three-stage roll-to-roll system starting with high-precision mold fabrication. Electroforming is performed within a specialized plating solution tank using a continuous cylindrical metal mold. As the mold rotates, the metal electrodeposits directly into the micro-patterned features of the cylinder.
Once formed, these precise metal traces are continuously compressed and transferred onto a flexible polymer carrier. This enables continuous, high-throughput manufacturing of unrestricted length with minimal material waste and excellent dimensional fidelity.
In this short video, you can learn:
* How cylindrical metal molds and electroforming tanks facilitate continuous roll-to-roll additive trace creation.
* The critical role of the compression wall in transferring micro-metal patterns from molds to polymer sheets.
* Why bottom-up transfer printing dramatically reduces material waste compared to conventional subtractive chemical etching.
📋 **Clip Abstract** This clip details the mechanical flow of SamwonAct's Micro metal Pattern Transfer Printing (MPTP) technology. It explains how cylindrical molds, electroforming tanks, and compression transfer work in unison to print high-precision circuitry on flexible substrates.
#PatternTransferPrinting, #RollToRollElectroforming, #CompressionTransfer, #FlexibleFlatCables, #PrintedElectronics, #AdditiveElectronics
12:28 - 14:43
What are the physical and chemical limits of roll-to-roll electroformed transfer printing on flexible substrates?
What are the physical and chemical limits of roll-to-roll electroformed transfer printing on flexible substrates?
Scaling an electroforming-based transfer process for high-speed manufacturing requires balancing deposition rate, trace thickness, and substrate mechanical integrity. Practically, the optimal metal thickness for the MPTP process ranges between 10 to 30 microns. Going beyond these limits is possible but introduces a direct trade-off with line speed.
To combat this limitation, SamwonAct utilizes high-speed solid anode technology within the plating system. This optimization allows the line speed to scale up to target velocities of 1.5 meters per minute while maintaining strict control over the electrodeposited material. Currently, the process is optimized for copper and nickel alloys.
Substrate compatibility is highly versatile, enabling printing on standard polyimide (PI) and PET carriers. Tension and peel force during the continuous release must be strictly controlled according to the specific polymer's mechanical properties to pass rigorous ISO and IEEE bending and reliability standard testing.
In this short video, you can learn:
* The optimal thickness constraints for maintaining high roll-to-roll processing speeds during electroforming.
* How solid anode technology enhances deposition rates to target manufacturing speeds of 1.5 meters per minute.
* The engineering controls needed for tension adjustment across different polymer substrates like PET and Polyimide.
📋 **Clip Abstract** This Q&A session delves into the practical operating limits, material choices, and throughput optimization of the MPTP process. It explains how solid anode technology and tension management allow high-speed printing of reliable copper and nickel traces on polyimide and PET.
#RollToRollElectroforming, #MetalPatternTransferPrinting, #SolidAnodePlating, #TensionControlPeelForce, #FlexibleElectronics, #AdditiveMetallization