Pascal Boncenne | Hummink: Can printed silver ink reliably repair open-circuit defects in advanced 3D semiconductor packaging?
00:05:48 - 00:07:43
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Summary of the clip:
Can printed silver ink reliably repair open-circuit defects in advanced 3D semiconductor packaging?
As the semiconductor industry advances beyond Moore's Law, chipmakers are increasingly turning to 3D chip stacking and panel-level packaging to boost density and computing power. However, these complex architectures suffer from yield-killing open defects in their copper redistribution layers (RDLs). This makes physical circuit repair an invaluable strategy for salvaging high-cost, multi-die packages.
In collaboration with Hanyang University, a highly precise solution was demonstrated using capillary-printed silver ink to mend broken copper RDLs. This additive process deposits silver directly into the open defects with sub-10 micron resolution, bridging the electrical gap without risking thermal damage to surrounding active components.
Rigorous thermal cycling tests have confirmed the structural and electrical reliability of these repaired RDL traces. The microscopic repairs show virtually no difference in electrical performance compared to the original, undamaged copper traces, paving the way for high-yield panel-level packaging.
In this short video, you can learn:
* The economic and technical drivers behind repairing advanced 3D stacked chips and panel-level packaging.
* How sub-10 micron silver ink printing successfully bridges open-circuit defects in copper redistribution layers (RDLs).
* Reliability data from thermal cycling tests demonstrating seamless electrical integration post-repair.
📋 **Clip Abstract** This clip covers the application of capillary printing to advanced semiconductor packaging repair, specifically highlighting a partnership with Hanyang University. It details the thermal and electrical performance of silver-ink-repaired copper redistribution layers (RDLs) designed to salvage high-value multi-chip modules.
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#CapillaryPrinting, #RDLRepair, #SilverConductiveInk, #PanelLevelPackaging, #AdvancedPackaging, #AdditiveElectronics
This is a highlight of the presentation:
HPCaP (High Precision Capillary Printing) : A Technology for Advanced Packaging
Future of Electronics RESHAPED USA 2026
10-11 June 2026
Computer History Museum, Mountain View, California, USA
Organised By:
TechBlick
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00:03:07 - 00:04:22
How can we bypass the physical limits of extrusion and electrohydrodynamic printing for sub-5 micron line deposition?
How can we bypass the physical limits of extrusion and electrohydrodynamic printing for sub-5 micron line deposition?
Traditional high-throughput print technologies struggle when scaled down to sub-5 micron resolutions. Extrusion-based printing hits a physical wall due to the immense pressure required to force viscous ink through microscopic nozzles. Electrohydrodynamic (EHD) printing offers a finer alternative but introduces a risk of electrostatic damage by requiring a high-voltage electrical field between the nozzle tip and the substrate.
High Precision Capillary Printing (HPCap) overcomes these challenges by utilizing an AFM-style glass pipette attached to a micro-resonator. Rather than relying on external pressure or voltage, this method uses high-frequency mechanical vibration to precisely initiate and control a liquid meniscus between the pipette tip and the surface.
By operating purely on capillary action, this system dynamically adapts to substrate topography in real-time. This fluidic control allows display and semiconductor manufacturers to print perfect dots and ultra-fine continuous lines without generating overspray, splashes, or satellite droplets.
In this short video, you can learn:
* The mechanics of AFM-derived capillary printing using pipettes and micro-resonators.
* Why traditional extrusion and electrohydrodynamic (EHD) technologies face limitations at sub-5 micron scales.
* How meniscus control enables precise, continuous line printing on irregular topographies without satellites or splashes.
📋 **Clip Abstract** This clip explains the physics behind High Precision Capillary Printing (HPCap) and how it utilizes AFM-derived micro-resonators to print sub-5 micron features. It compares this capillary-driven approach with extrusion and EHD methods, highlighting its ability to form stable liquid meniscuses without pressure or voltage.
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#HighPrecisionCapillaryPrinting, #MicroResonatorDeposition, #MeniscusControl, #SubFiveMicronPrinting, #PrintedElectronics, #MicroLEDManufacturing
00:09:36 - 00:12:26
How do sub-10 micron printed repairs handle trace oxidation and material interfaces at the microscale?
How do sub-10 micron printed repairs handle trace oxidation and material interfaces at the microscale?
When repairing micro-scale circuit defects in high-end displays or semiconductor substrates, precision is only half the battle. Engineers must define a "comfort zone" where additively printed traces can reliably bridge open defects. The primary sweet spot for capillary repair is between 1 and 10 microns, where traditional repair technologies fail but defect rates remain high.
A major concern when depositing printed silver onto exposed copper traces is the risk of copper oxidation prior to repair. To prevent poor contact, the capillary printing module is designed to integrate into larger manufacturing cluster tools that handle automated pre-processing and post-processing steps.
Furthermore, interface reliability between different metals, such as copper and silver, is verified through thermal stress tests. Additive capillary printing systems can easily interchange specialized inks, opening up pathways to use printable copper inks to eliminate bi-metal interface mismatches altogether.
In this short video, you can learn:
* The sweet-spot range for microscale defect repairs and why the 1-to-10 micron zone is critical.
* Strategies for managing trace oxidation through integrated pre-processing and post-processing steps.
* How interchangeable micro-inks help optimize the physical and electrical interface at the contact site.
📋 **Clip Abstract** During this technical Q&A, experts dive into the practical challenges of microscale repairs, including trace oxidation and metallic interface reliability. The discussion outlines the target 1-to-10 micron defect range and describes how capillary printing tools handle silver-to-copper material transitions.
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#CapillaryPrinting, #MicroscaleDefectRepair, #BimetallicInterfaces, #PrintableCopperInks, #MicroLEDDisplays, #AdvancedPackaging