00:16:48.368 - 00:19:31.176
Other snippets from this talk
Summary of the clip:
How do we mitigate the compounding failure modes of in-mold electronics during high-strain thermoforming and harsh thermal cycling?
The thermoforming process in printed electronics introduces severe geometric and mechanical challenges, most notably trace cracking and resistance drift. As conductive traces are stretched during forming, volume conservation dictates a reduction in cross-sectional area, which directly drives up electrical resistance. To ensure functional stability, designers must precisely model this deformation and account for these predictable resistance shifts during the initial layout phase.
Interfacial debonding and delamination present further hurdles due to the stark mismatch in material properties across the stackup. The substrate, conductive inks, and dielectric layers each possess distinct elastic moduli and elongation limits, causing them to deform at different rates under thermoforming stresses. This mismatch not only threatens the physical adhesion of the layers but also risks creating moisture ingress pathways that compromise the encapsulated circuitry during its operational lifespan.
Once deployed, these assemblies must withstand cyclic stress accumulation driven by both power cycling and environmental thermal swings. In automotive applications, the most critical thermal spikes often occur immediately after a vehicle stops, as the loss of convective airflow causes ambient temperatures to rise by 15 to 25 degrees. Managing this post-operation heat rise and the resulting I-squared-R heating is essential for preventing premature fatigue and securing long-term reliability.
In this short video, you can learn:
* The physical mechanisms behind resistance drift and trace cracking during thermoforming.
* How mechanical property mismatches between inks and substrates drive interfacial debonding.
* Why post-operation thermal spikes in automotive environments pose a critical threat to circuit reliability.
π **Clip Abstract** The speaker outlines the primary failure modes in thermoformed printed electronics, focusing on trace cracking, resistance drift from cross-sectional reduction, and interfacial debonding caused by mismatched material properties. He also explains how cyclic stresses accumulate during operation, highlighting how the loss of convective cooling after a vehicle stops drives critical temperature spikes.
π€ Speaker: Pradeep Lall
π’ Company: Auburn University
π
Event: Future of Electronics RESHAPED USA 2026
π Location: Computer History Museum, Mountain View, California, USA
π Learn more at the next TechBlick event: https://www.techblick.com
#SlotDieCoating, #PerovskiteTandem, #FlexibleSubstrates, #RollToRollProcessing, #PrintedElectronics, #Optoelectronics
This is a highlight of the presentation:
In-Mold Electronics (IME): Reliability, Design Rules, and Harsh-Environment Performance
Future of Electronics RESHAPED USA 2026
10-11 June 2026
Computer History Museum, Mountain View, California, USA
Organised By:
TechBlick
More Highlights from the same talk.
00:01:50.000 - 00:03:58.100
Can we eliminate planar circuit boards by turning structural automotive panels into active electronics?
Can we eliminate planar circuit boards by turning structural automotive panels into active electronics?
The electronics industry is actively transitioning from planar, rigid printed circuit boards to three-dimensional, structurally integrated form factors. By embedding electronic functionality directly into non-linear, curved plastic structuresβsuch as automotive door panelsβmanufacturers can achieve radical weight reduction and aesthetic flexibility. This integration demands entirely different manufacturing processes than traditional subtractive PCB fabrication.
In-mold electronics (IME) combines three distinct, sequentially executed manufacturing domains to achieve this 3D structural integration. The process relies on thermoforming a planar plastic substrate to establish the physical 3D geometry, applying in-mold decoration for graphic and functional labeling, and using injection molding as an encapsulant to physically protect the embedded circuitry.
Selecting the foundational substrate is critical, with polycarbonates often favored for high-heat automotive cabin environments over lower-temperature alternatives like PET or TPU. Engineers must balance substrate thermal properties with conductive, dielectric, and graphical inks to ensure the entire multi-material system survives subsequent fabrication steps without delaminating.
In this short video, you can learn:
* The mechanical transition from planar PCB architecture to 3D structurally integrated electronics.
* The three foundational process steps of IME: thermoforming, decoration, and injection molding encapsulation.
* Why polycarbonate substrates are preferred over PET and TPU in high-temperature automotive applications.
π **Clip Abstract** This clip details the paradigm shift from traditional planar printed circuit boards to structurally integrated 3D in-mold electronics. Dr. Lall explains the mechanics of combining thermoforming, in-mold decoration, and injection molding into a cohesive, multi-material manufacturing process.
π Link in comments π
#InMoldElectronics, #StructuralElectronics, #PolycarbonateSubstrates, #Thermoforming, #AutomotiveElectronics, #PrintedElectronics
00:00:27 - 00:00:44
How does the technology maturation process bridge the gap between fundamental research and practical application in automotive systems?
How does the technology maturation process bridge the gap between fundamental research and practical application in automotive systems?
The presentation will cover the technology maturation process, starting from fundamental process development and culminating in a functional system integrated into an automotive platform. The discussion will include the steps taken to advance the technology from its initial stages to a point where it can be effectively used in a real-world automotive setting. This maturation process involves addressing various challenges and optimizing the technology for the specific requirements of the automotive industry.
The focus is on demonstrating the progression from basic research to a tangible, working system. This includes not only the creation of the system but also its integration into an existing automotive platform. The presentation will highlight the practical considerations and adaptations necessary to make the technology viable for automotive applications.
Furthermore, the presentation will showcase the reliability data obtained from testing the functional system. This data is crucial for validating the performance and durability of the technology in an automotive environment. The reliability data provides evidence of the technology's ability to withstand the rigors of automotive use and ensures its long-term viability.
In this short video, you can learn:
* The end-to-end process of technology maturation.
* Integration of functional systems into automotive platforms.
* The importance of reliability data in validating technology performance.
π **Clip Abstract** The speaker outlines the scope of the presentation, focusing on the technology maturation process from fundamental development to functional automotive system integration, including reliability data. This sets the stage for a detailed exploration of additive electronics in automotive applications.
π Link in comments π
#TechnologyMaturation, #AutomotiveIntegration, #SystemReliability, #ProductValidation, #AdditiveElectronics, #AutomotiveSystems
00:06:11.536 - 00:08:14.536
Could we slash vehicle wiring weight by 70% by printing wire harnesses directly onto structural parts?
Could we slash vehicle wiring weight by 70% by printing wire harnesses directly onto structural parts?
Modern vehicles carry over two hundred pounds of heavy, complex wiring harnesses, representing a massive weight penalty and a major assembly bottleneck. Each physical wire requires dedicated connectors, metal receptacles, and plastic latches, creating a complex logistical tail and introducing hundreds of potential mechanical failure points.
In-mold electronics addresses this engineering challenge by consolidating hundreds of discrete mechanical parts into a single molded structural component. By printing the electrical traces directly onto the structural plastic panels themselves, the need for bulky physical copper cabling is completely eliminated.
This structural integration yields up to a 70 percent reduction in wiring weight, significantly boosting fuel and battery efficiency. Furthermore, by removing mechanical connectors and solder jointsβthe primary areas where traditional electronics failβsystem reliability is dramatically improved.
In this short video, you can learn:
* How printed traces on structural plastics replace hundreds of pounds of copper wire harnesses.
* The commercial benefits of part-count consolidation on automotive assembly lines and supply chains.
* Why removing physical connectors and solder joints improves overall system reliability.
π **Clip Abstract** Dr. Lall analyzes how in-mold electronics solves the weight and complexity issues of traditional vehicle wiring harnesses. By integrating conductive traces directly into structural panels, manufacturers can achieve up to a 70% reduction in cabling weight while eliminating key failure-prone mechanical interfaces.
π Link in comments π
#InMoldElectronics, #StructuralElectronics, #PrintedWireHarnesses, #PartCountConsolidation, #AutomotiveElectronics, #AdditiveElectronics