Robert Wilson | Tatsuta: How can additive screen printing cut PCB carbon emissions by 80% and copper usage by over 90% compared to traditional subtractive etching?
00:05:35 - 00:06:56
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Summary of the clip:
How can additive screen printing cut PCB carbon emissions by 80% and copper usage by over 90% compared to traditional subtractive etching?
Traditional subtractive PCB fabrication is notoriously resource-intensive, relying on multiple steps of copper lamination, masking, exposure, developing, and wet chemical etching. This complex pipeline generates massive amounts of liquid waste, hazardous chemical sludge, and consumes considerable energy.
Transitioning to an additive dry-printing process radically alters these thermodynamics and resource metrics. Real-world analysis shows that screen-printed circuit boards generate just 19 kilograms of CO2 per square meter, compared to 104 kilograms for standard subtractive processes.
Furthermore, material utilization is optimized dramatically, reducing copper consumption from 206 grams per square meter down to a mere 19 grams. The dry process also slashes liquid waste volumes from 1.5 cubic meters to just 0.1 cubic meters, presenting a compelling sustainable and economic alternative for next-generation electronic manufacturing.
In this short video, you can learn:
* The exact sustainability and material utilization metrics comparing printed and subtractive circuit board manufacturing.
* How dry printing methods reduce liquid waste and carbon footprint across the production lifecycle.
* Why additive printing dramatically lowers capital investment requirements and processing time for PCBs.
š **Clip Abstract** This clip compares the environmental and resource metrics of traditional subtractive PCB etching against additive dry screen-printing. It highlights how printing achieves an 80% reduction in CO2 emissions, slashes copper consumption by over 90%, and nearly eliminates liquid waste.
š Link in comments š
#AdditiveScreenPrinting, #AdditivePCB, #DryPrinting, #CopperReduction, #PrintedElectronics, #SustainableElectronics
This is a highlight of the presentation:
Silver-Coated Copper Particle Circuit Trace Conductive Pastes
Future of Electronics RESHAPED USA 2026
10-11 June 2026
Computer History Museum, Mountain View, California, USA
Organised By:
TechBlick
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00:00:02 - 00:00:58
Can we bypass the high cost of silver in conductive inks without suffering from copper's extreme oxidation issues?
Can we bypass the high cost of silver in conductive inks without suffering from copper's extreme oxidation issues?
The electronic packaging industry faces an urgent material challenge due to the skyrocketing cost of silver, driving a transition to lower-cost conductive metals like copper. However, copper readily oxidizes in fine particle form, which degrades electrical performance and ruins long-term reliability in high-density interconnects.
To solve this trade-off, Tatsuta has developed silver-coated copper particles that leverage a core-shell architecture. This morphology combines the low bulk resistivity of a copper core with the excellent oxidation resistance and surface contact stability of a thin silver shell.
By engineered control of the particle coating, this paste overcomes the historical limitations of conventional copper and silver inks. It delivers a stable, cost-effective conductive path suited for high-density electronic packaging and flexible printed circuits.
In this short video, you can learn:
* Why the transition to pure copper inks is historically bottlenecked by particle oxidation at small scales.
* How core-shell silver-coated copper particles balance high conductivity with economic viability.
* The impact of material design on resolving the reliability failures typical of conventional metallization pastes.
š **Clip Abstract** This clip introduces Tatsuta's innovative silver-coated copper particles designed to replace expensive silver in conductive inks. It explains how this hybrid material successfully prevents the rapid oxidation of copper while maintaining superior electrical conductivity and reliability.
š Link in comments š
#SilverCoatedCopper, #CoreShellParticles, #ConductivePastes, #CopperOxidation, #ElectronicPackaging, #PrintedElectronics
00:14:00 - 00:15:28
Why does pure silver fail catastrophically under bias in humid environments, and how do core-shell particles suppress dendritic migration?
Why does pure silver fail catastrophically under bias in humid environments, and how do core-shell particles suppress dendritic migration?
Ion migration remains a critical failure mechanism for silver-based circuitry, where moisture and electrical bias cause silver ions to migrate and form short-circuiting dendrites. To characterize this behavior under harsh conditions, researchers use a water drop test with a six-volt DC bias across electrodes on a glass substrate.
Under these test conditions, pure silver traces demonstrate rapid and massive dendritic growth, leading to premature circuit failure. While standard silver-copper alloy pastes reduce this migration to some extent, they still suffer from electrical leakage and instability over time.
Tatsuta's specialized silver-coated copper paste (RSW180L) dramatically suppresses ion migration, significantly outperforming both pure silver and alloyed alternatives. This core-shell approach restricts silver ion mobility, ensuring high-reliability performance even in moisture-exposed microelectronic and display applications.
In this short video, you can learn:
* The physical mechanism of silver ion migration and how it causes catastrophic electrical failures.
* How the water drop test acts as an accelerated reliability tool to evaluate electrode dendrite growth under DC bias.
* Why core-shell silver-coated copper structures outperform standard silver-copper alloys in preventing ion migration.
š **Clip Abstract** This clip explores the critical issue of silver ion migration in electronic circuitry and demonstrates how Tatsuta's paste suppresses this failure mechanism. Through water drop testing under a 6V DC bias, the speaker shows how their core-shell material vastly outperforms pure silver and competitor silver-copper alloys.
š Link in comments š
#SilverIonMigration, #SilverCoatedCopper, #ElectrochemicalMigration, #WaterDropTest, #PrintedElectronics, #ConductivePastes