Roberta Greco | Exxelia Micropen: Can you achieve a 2:1 aspect ratio on 50-micron printed lines using fluid-dynamic dispensing?
03:56 - 05:15
Other snippets from this talk
Summary of the clip:
Can you achieve a 2:1 aspect ratio on 50-micron printed lines using fluid-dynamic dispensing?
Achieving narrow, high-aspect-ratio traces in printed electronics requires precise fluid-dynamic control within the print nozzle. By utilizing dual-orifice tips that transition from a larger inner diameter to a smaller inner diameter, the print system linearizes the ink upstream before it reaches the substrate.
This geometric transition, coupled with highly controlled surface-tension interactions, allows the nozzle to "ride" the printed layer during deposition. As a result, the process consistently yields a 2:1 aspect ratio, enabling 50-micron line widths with narrow 25-micron spacing.
To scale this capability for industrial production, the direct-write pen is increasingly integrated with conventional flat or rotary screen printing processes. This hybrid approach uses screen printing for bulk layers while leveraging the micro-pen's fine-feature precision to meet challenging electronic geometry constraints.
In this short video, you can learn:
* The fluid dynamics of ink linearization using variable-diameter orifice tips to control deposition.
* How to achieve high-resolution 50-micron line widths and 2:1 aspect ratios via surface-interaction control.
* Strategies for hybridizing direct-write micro-pen technologies with rotary and flat screen printing.
๐ **Clip Abstract** This clip explains how dual-orifice dispensing tips linearize ink flow to achieve precise 50-micron line widths with a 2:1 aspect ratio. It also highlights how combining this micro-pen technology with screen printing optimizes manufacturing for complex electronics.
#FluidDynamicDispensing, #DualOrificeNozzles, #HighAspectRatioPrinting, #HybridScreenPrinting, #PrintedElectronics, #AdditiveElectronics
This is a highlight of the presentation:
More Highlights from the same talk.
01:43 - 02:38
How can you print high-performance electronics onto fragile, highly irregular 3D surfaces without damaging them?
How can you print high-performance electronics onto fragile, highly irregular 3D surfaces without damaging them?
Standard microfabrication techniques often struggle when transitioning from planar silicon wafers to highly irregular, soft, or flexible three-dimensional substrates. Direct-write, additive manufacturing platforms resolve this bottleneck by operating entirely in a non-contact mode, safeguarding delicate materials from mechanical stress.
The key mechanical advantage of this direct-write approach is its unprecedented viscosity tolerance. While traditional inkjet and dispensing methods are tightly restricted to narrow viscosity ranges, this system successfully deposits fluids ranging from water-like low viscosities up to high-viscosity pastes exceeding one million centipoise.
This extreme material versatility allows engineers to deposit highly filled conductive inks, specialized dielectrics, and complex composite materials onto the same substrate. By eliminating the mask requirements of subtractive processes, this additive method streamlines rapid prototyping and high-mix manufacturing of complex medical and aerospace sensors.
In this short video, you can learn:
* The mechanical design rules governing non-contact, direct-write additive printing on non-planar 3D surfaces.
* How the platform achieves an ultra-wide viscosity printing range spanning from below water up to one million centipoise.
* The strategic shift from subtractive photolithography to material-agnostic, multi-layer additive deposition.
๐ **Clip Abstract** This clip explores the mechanical capabilities of a non-contact, direct-write printing system designed for highly irregular and fragile 3D substrates. It details how the technology accommodates an ultra-wide range of material viscosities to print conductors, dielectrics, and filled composites seamlessly.
#DirectWritePrinting, #ConformalElectronics, #HighViscosityPrinting, #3DPrintedElectronics, #StructuralElectronics, #PrintedElectronics
06:45 - 08:15
Why are aerospace engineers replacing traditional alumina ceramic substrates with printed PTFE nanocomposites?
How can RF designers bypass the costly machining constraints of alumina while maintaining precise dielectric performance on non-conforming 3D substrates?
The integration of additive dispensing with advanced fluoropolymer chemistry is redefining the fabrication of high-frequency components. By leveraging a polytetrafluoroethylene (PTFE) matrix enhanced with engineered nanocomposites, developers can now bypass the mechanical and economic limitations of traditional alumina substrates. This composite approach allows for the precise tailoring of dielectric constants across a range of material thicknesses, offering a highly adaptable alternative for complex RF designs.
Unlike rigid ceramics that require expensive, subtractive machining to achieve non-planar geometries, this nanocomposite PTFE material is inherently formable. It supports the creation of conformal flat structures, complex 3D shapes, and advanced laminates, including copper-clad configurations. This geometric versatility, paired with additive dispensing technology, enables direct-write deposition of conductive and dielectric features onto non-conforming surfaces.
This material synergy is particularly suited for demanding high-reliability sectors where weight, form factor, and high-frequency performance are critical. Target applications span next-generation communications, specialized antennas, RF lenses, and discrete components designed for the rigorous environments of space, aerospace, and defense. By combining additive manufacturing agility with customizable dielectric properties, designers can realize complex electromagnetic structures that were previously impossible or too costly to produce.
In this short video, you can learn:
* How nanocomposite-filled PTFE serves as a highly machinable, cost-effective alternative to alumina.
* The role of additive dispensing partners in commercializing novel dielectric and sealing material technologies.
* The primary target markets for these formable dielectric laminates, including aerospace, defense, and antenna systems.
๐ **Clip Abstract** The speaker introduces a nanocomposite-filled PTFE dielectric material designed as a formable, cost-effective alternative to alumina for non-conforming substrates. She explains how additive dispensing technology enables this material to be shaped into 3D laminates and copper-clad components for aerospace, defense, and communication applications.
๐ค Speaker: Roberta Greco
๐ข Company: Exxelia Micropen
๐
Event: Printed Electronics Innovation Day 2024
๐ Location: TechBlick | Online Platform
๐ Learn more at the next TechBlick event: https://www.techblick.com
#PTFENanocomposites, #TunableDielectrics, #ConformalRF, #FlexibleRFSubstrates, #PrintedElectronics, #AerospaceElectronics