Ryan Banfield | Heraeus Electronics: How does the temperature limitation of existing polymer thick films restrict design capabilities in printed electronics?
00:03:33 - 00:03:52
Other snippets from this talk
Summary of the clip:
How does the temperature limitation of existing polymer thick films restrict design capabilities in printed electronics?
The speaker identifies a major industry gap concerning the temperature limitations of solderable-based materials, specifically in polymer thick films. Many of these materials degrade at temperatures around 200 degrees Celsius, making them unable to withstand traditional solder reflow processes. This limitation significantly restricts design capabilities, preventing the full utilization of the advantages offered by soldering techniques.
Furthermore, the speaker addresses issues related to silver migration and the oxidation of copper particles in older solderable polymers. Copper particles, when used in these polymers, tend to oxidize during the reflow process, especially without an inert gas environment. This oxidation can lead to the softening and reflowing of the polymer matrix, causing the inks to flow out and resulting in poor bond quality.
These issues highlight the reasons why polymers have been historically unsuitable for solder reflow processes. Additionally, the high temperatures involved in soldering can damage certain substrates, which presents another limitation when using solder in specific applications. The speaker emphasizes that the missing link has been a polymer-based material capable of positively reacting with the solder reflow process, particularly the SAC305 process.
In this short video, you can learn:
* The temperature constraints of traditional polymer thick films.
* The problems associated with silver migration and copper oxidation in solderable polymers.
* The need for a polymer material that can withstand solder reflow processes without degradation.
π **Clip Abstract:** This section details the temperature-related challenges and material limitations that have historically hindered the use of solderable polymers in printed electronics, emphasizing the need for a more robust solution. It explains why existing materials fail under standard solder reflow conditions.
π Link in comments π
#PolymerThickFilms, #SolderReflowLimitations, #CopperOxidation, #SAC305Compatibility, #PrintedElectronics, #ElectronicPackaging
This is a highlight of the presentation:
Bridging the Gap Between Additive and Subtractive Technologies: the Solderable Polymer Revolution.
More Highlights from the same talk.
00:03:12 - 00:03:30
How does the solvent system contribute to the functionality of silver chloride ink?
How does the solvent system contribute to the functionality of silver chloride ink?
The speaker begins by outlining the composition of silver chloride ink, identifying the key components as silver flakes, silver chloride flakes, a resin system, and a solvent system. The solvent system's primary function is to liquefy the mixture, transforming it into a flowable material suitable for various printing processes. These processes include screen printing, aerosol jetting, and pad printing, among others.
The resin system serves as a binder, holding the silver and silver chloride particles together and adhering them to the substrate. While its main purpose is to ensure particle cohesion and substrate adhesion, it also contributes to the circuit's longevity and overall functionality. The speaker emphasizes that the resin is a necessary component, albeit with some limitations.
The speaker highlights that the solvent system is crucial for enabling the ink to be processed using different printing technologies. Without the solvent, the ink would not be flowable and could not be applied to the substrate in a controlled manner. The resin system, on the other hand, ensures that the conductive particles remain in place after the solvent has evaporated.
In this short video, you can learn:
* The role of solvents in ink flow and processability.
* The function of resins in particle binding and adhesion.
* The basic composition of silver chloride ink.
π **Clip Abstract** This segment details the fundamental components of silver chloride ink, emphasizing the roles of the solvent and resin systems in achieving desired flow properties and particle adhesion. It sets the stage for understanding the challenges associated with formulating these inks for specific applications.
π Link in comments π
#SilverChlorideInk, #InkProcessability, #ResinSystem, #PrintedElectronics, #FlexibleElectronics, #SemiconductorMaterials
00:10:00 - 00:10:20
Why is collaboration between ink manufacturers and end-users crucial for optimizing silver chloride ink formulations?
Why is collaboration between ink manufacturers and end-users crucial for optimizing silver chloride ink formulations?
The speaker emphasizes the importance of collaboration between pace manufacturers and end-users, particularly regarding the ratios of silver to silver chloride. He states that pace manufacturers often lack specific knowledge about the enzymes or solutions that end-users will be working with. This lack of information makes it difficult to tailor the ink formulation to the specific application.
The speaker stresses that it is imperative for end-users to communicate their requirements to pace manufacturers. This includes providing information about the desired ratios of silver to silver chloride, as well as the specific enzymes or solutions that the ink will be exposed to. This information is crucial for developing next-generation circuits with optimized performance.
By sharing this information, end-users can help pace manufacturers to fine-tune the ink formulation and ensure that it meets the specific requirements of the application. This collaborative approach is essential for driving innovation and developing new and improved printed electronic devices.
In this short video, you can learn:
* The limitations of pace manufacturers' knowledge regarding end-user applications.
* The importance of communicating specific requirements to ink suppliers.
* The role of collaboration in optimizing ink formulations for next-generation circuits.
π **Clip Abstract** This segment highlights the critical need for collaboration between ink manufacturers and end-users to optimize silver chloride ink formulations, particularly concerning silver to silver chloride ratios and compatibility with specific enzymes or solutions. It emphasizes that open communication is essential for developing advanced printed electronic devices.
π Link in comments π
#SilverChlorideInk, #InkFormulationOptimization, #PrintedCircuits, #ElectrochemicalSensing, #Biosensors, #FlexibleElectronics
00:05:19 - 00:05:30
What are the primary challenges in achieving stretchable electronics with silver chloride inks?
What are the primary challenges in achieving stretchable electronics with silver chloride inks?
The speaker identifies stretchable electronics as a primary challenge and a "holy grail" within polymer electronics. The core difficulty lies in maintaining conductivity during elongation. He uses an analogy of silly putty loaded with sand to illustrate the problem. Just as sand-filled silly putty loses its stretchability and snaps under tension, highly elastic polymers loaded with conductive flakes tend to fracture and break during elongation.
The speaker explains that high loading levels (60-70%) of conductive materials in elastic polymers lead to a loss of elasticity. This is because the conductive flakes disrupt the polymer matrix, causing fractures and breaks when the material is stretched. This was a significant hurdle in the development of stretchable electronics.
While the industry has made progress and found solutions, the speaker emphasizes the need for intimate marriages between specific substrate selections and processing conditions. This highlights the complexity of formulating stretchable conductive materials and the importance of considering the entire system, not just the ink itself.
In this short video, you can learn:
* The analogy of silly putty to explain the challenges of stretchable electronics.
* The impact of high conductive filler loading on polymer elasticity.
* The importance of substrate and processing considerations for stretchable inks.
π **Clip Abstract** This segment explains the challenges in creating stretchable electronics, focusing on the loss of elasticity due to high filler loading and the resulting fractures during elongation. It underscores the need for careful material selection and processing optimization.
π Link in comments π
#StretchableElectronics, #SilverChlorideInks, #ConductivePolymers, #PolymerElasticity, #FlexibleElectronics, #PrintedElectronics