Ryojiro Tominaga | Fuji Corporation: How does the low-temperature sintering process impact the choice of conductive inks and substrate materials?
00:03:56 - 00:04:13
Other snippets from this talk
Summary of the clip:
How does the low-temperature sintering process impact the choice of conductive inks and substrate materials?
The HPM-300DI system utilizes a two-module approach, integrating pick-and-place functionality with a printing module. The printing module initially deposits a UV-curable dielectric material using a 600 DPI inkjet system, followed by UV exposure for hardening. Subsequently, the same inkjet system prints a silver conductive ink onto the dielectric surface.
The printed silver ink undergoes a drying and sintering process at a relatively low temperature. This low-temperature sintering is a critical aspect of the process, enabling the creation of conductive circuits on the substrate. The process is repeated to build up multi-layer circuits.
This additive manufacturing approach allows for the creation of material circuits through a fully digital process. The system's capabilities are being evaluated with partners to explore various applications, including 2D substrate prototyping and the fabrication of novel 3D geometry devices.
In this short video, you can learn:
* The two-module architecture of the HPM-300DI system.
* The process of printing dielectric and conductive layers.
* The importance of low-temperature sintering for circuit formation.
π **Clip Abstract** The clip details the core printing and curing process of the HPM-300DI, highlighting the use of UV-curable dielectrics and low-temperature sintered silver conductive inks. It emphasizes the system's ability to create multi-layer circuits through a fully additive digital manufacturing process.
π Link in comments π
#LowTempSintering, #ConductiveInk, #UVCurableDielectric, #AdditiveManufacturing, #PrintedElectronics, #SemiconductorManufacturing
This is a highlight of the presentation:
Additively manufactured multi-layer and stacked circuits with embedded electronics components
More Highlights from the same talk.
02:57 - 05:07
Can you build fully functional hybrid electronics in a single machine without traditional PCB etching or soldering?
How can electronics manufacturers consolidate multi-layer circuit fabrication and surface-mount assembly into a single, seamless additive manufacturing workflow?
Traditional printed circuit board assembly relies on discrete, sequential steps that separate substrate fabrication from component mounting. By integrating high-precision material deposition and component placement within a unified modular platform, manufacturers can eliminate these process silos. This hybrid approach combines inkjet printing, dispensing, and robotic pick-and-place technologies to build functional electronic assemblies from the ground up on a single stage.
The additive build-up process relies on the precise, iterative deposition of both dielectric and conductive phases. Inkjet heads deposit specialized resins to form insulating layers, which are immediately cured via integrated ultraviolet exposure. Subsequently, silver nanoparticle inks are inkjet-printed to define conductive traces, followed by in-situ drying and sintering using infrared heaters. This layer-by-layer iteration enables the rapid fabrication of complex, multi-layer circuit architectures without chemical etching.
To transition from passive circuitry to fully active systems, the platform seamlessly bridges additive printing with component assembly. Air dispenser systems deposit silver conductive paste and structural epoxy glue to prepare the mounting sites. The build stage then transitions to a component mounting module for precise pick-and-place alignment, followed by a localized heat-press step that applies simultaneous thermal energy and high pressure to cure the paste, ensuring robust, stable electrical and mechanical connections.
In this short video, you can learn:
* How modular additive systems combine inkjet printing, UV curing, and infrared sintering to fabricate multi-layer circuits.
* The role of integrated air dispensing systems in depositing conductive pastes and structural adhesives for component integration.
* How localized heat-press curing under high pressure ensures stable electrical connections for surface-mounted components.
π **Clip Abstract** The speaker explains the process flow of a hybrid additive manufacturing machine that integrates inkjet printing, UV curing, infrared sintering, and fluid dispensing with component pick-and-place assembly. He details how the system iterates these steps to fabricate multi-layer build-up circuits and secure surface-mounted components using a pressurized heat-press module.
π€ Speaker: Ryojiro Tominaga
π’ Company: FUJI CORPORATION
π
Event: Additive, Sustainable or 3D Electronics Innovations Day 2025
π Location: TechBlick Online Platform
π Learn more at the next TechBlick event: https://www.techblick.com
#AdditiveManufacturingElectronics, #SilverNanoparticleInk, #LowTemperatureSMT, #DirectWriteElectronics, #StructuralElectronics, #HybridElectronics
16:32 - 19:22
How does direct-write electronics handle clogged nozzles in production without ruining the circuit?
How does direct-write electronics handle clogged nozzles in production without ruining the circuit?
Achieving sub-100 micrometer line widths and spaces with inkjet printing is highly challenging due to nozzle clogging and droplet deviation. While Fuji's current production standards target 140 micrometer traces and 200 micrometer spaces, their latest internal evaluations demonstrate successful fabrication at sub-100 micrometer resolutions. However, maintaining high yields at these dimensions requires active mitigation of printhead instability.
Instead of relying solely on traditional downstream automated optical inspection (AOI) or electrical testing to catch errors post-fabrication, Fuji's system addresses defects in real-time. The machine features an integrated monitoring system that inspects jetting behavior, droplet accuracy, and nozzle health during the printing process itself.
If a nozzle clog or drop deviation is detected, the printhead's digital control system automatically compensates by adjusting the printing image on-the-fly. This real-time print correction maintains overall circuit integrity and process stability, paving the way for reliable industrial production of highly dense, additive electronics.
In this short video, you can learn:
* The current standard and developmental limits of fine-line trace resolution and pitch down to sub-100 micrometers.
* Why traditional post-process AOI is insufficient for high-yield additive electronics manufacturing.
* How automated real-time drop monitoring and digital print image compensation prevent failures caused by clogged nozzles.
π **Clip Abstract** This segment covers the resolution capabilities of Fuji's inkjet system and their unique real-time quality control methodology. It explains how the machine automatically compensates for nozzle failures on-the-fly to ensure process stability and high production yields.
#ActiveNozzleCompensation, #RealTimeDropMonitoring, #DigitalPrintCompensation, #FineLineInkjet, #AdditiveElectronics, #DirectWriteElectronics
11:31 - 13:20
Why use expensive and damaging lasers to drill microvias when you can print them natively?
Why use expensive and damaging lasers to drill microvias when you can print them natively?
Standard fabrication of embedded components often relies on subtractive steps like laser drilling or mechanical routing to expose sensors or create vertical interconnects. Fuji Corporation bypasses these steps entirely by utilizing an additive printing approach to build selective openings directly during the resin deposition phase. This eliminates the risk of laser-induced thermal or physical damage to sensitive embedded silicon.
This capability is especially critical for rugged IoT sensor modules that require absolute waterproofing but must also maintain open access to the environment. For example, a temperature sensor can be fully encapsulated in a protective 3D printed resin block while keeping a precise, open window exposed to receive external infrared radiation.
Additionally, this native patterning process allows for complex multi-layer component stack-ups where microvias are built additively during the filling stage. By avoiding post-processing steps like etching or drilling, the design-to-production workflow is simplified into a single digital process.
In this short video, you can learn:
* The mechanism of forming precise via holes and selective window openings natively without subtractive laser or etching steps.
* How to achieve complete waterproof encapsulation of IoT modules while keeping sensing elements exposed to the environment.
* The layout advantages of building multi-layer component stack-ups using continuous digital resin printing.
π **Clip Abstract** This clip explains how additive manufacturing enables the creation of selective open structures and vias around embedded components without laser drilling. It showcases the practical application of this technology in fabricating protected yet functional waterproof IoT sensor modules.
#AdditiveMicrovias, #ResinEncapsulation, #WaterproofIoT, #LaserFreePatterning, #3DPrintedElectronics, #StructuralElectronics