Ryojiro Tominaga | Fuji Corporation: How does the low-temperature sintering process impact the choice of conductive inks and substrate materials?

Can you build fully functional hybrid electronics in a single machine without traditional PCB etching or soldering?

Fuji Corporation's integrated f-maternity machine breaks the traditional barrier between additive printing and surface-mount technology (SMT) by combining them into a single, unified dual-module system. The first module handles the rapid, high-precision placement of active components, while the second module runs the jet printing processes for insulating resin and conductive silver nanoparticle inks.

The fabrication process sequence alternates dynamically to build up 3D electronic structures layer-by-layer. UV exposure immediately cures the inkjet-printed dielectric resin, followed by infrared-driven drying and sintering of the silver nanoparticle traces. To establish reliable interconnects, the machine dispenses a specialized silver paste onto the contacts before placing and heat-pressing components into place.

This streamlined process allows for the creation of complex multi-material build-up circuits and surface-mount assemblies within a highly compact 120 by 120 millimeter build envelope. It provides developers with the capability to move from design to a fully populated, functional 3D circuit board in less than a day, eliminating external assembly steps.

In this short video, you can learn:
* How the dual-module system combines automated component placement with direct multi-material inkjet printing.
* The exact thermal and optical curing sequence used for dielectric resins and silver nanoparticle conductive inks.
* The role of localized heat-pressing to guarantee stable, low-temperature electrical connections.

📋 **Clip Abstract** This video details Fuji's integrated additive manufacturing system that merges direct inkjet circuit printing with low-temperature surface-mount assembly. It walks through the step-by-step layer build-up, material curing, and automated part-placement sequence that delivers completed hybrid boards in 24 hours.

How does direct-write electronics handle clogged nozzles in production without ruining the circuit?

Achieving sub-100 micrometer line widths and spaces with inkjet printing is highly challenging due to nozzle clogging and droplet deviation. While Fuji's current production standards target 140 micrometer traces and 200 micrometer spaces, their latest internal evaluations demonstrate successful fabrication at sub-100 micrometer resolutions. However, maintaining high yields at these dimensions requires active mitigation of printhead instability.

Instead of relying solely on traditional downstream automated optical inspection (AOI) or electrical testing to catch errors post-fabrication, Fuji's system addresses defects in real-time. The machine features an integrated monitoring system that inspects jetting behavior, droplet accuracy, and nozzle health during the printing process itself.

If a nozzle clog or drop deviation is detected, the printhead's digital control system automatically compensates by adjusting the printing image on-the-fly. This real-time print correction maintains overall circuit integrity and process stability, paving the way for reliable industrial production of highly dense, additive electronics.

In this short video, you can learn:
* The current standard and developmental limits of fine-line trace resolution and pitch down to sub-100 micrometers.
* Why traditional post-process AOI is insufficient for high-yield additive electronics manufacturing.
* How automated real-time drop monitoring and digital print image compensation prevent failures caused by clogged nozzles.

📋 **Clip Abstract** This segment covers the resolution capabilities of Fuji's inkjet system and their unique real-time quality control methodology. It explains how the machine automatically compensates for nozzle failures on-the-fly to ensure process stability and high production yields.

Why use expensive and damaging lasers to drill microvias when you can print them natively?

Standard fabrication of embedded components often relies on subtractive steps like laser drilling or mechanical routing to expose sensors or create vertical interconnects. Fuji Corporation bypasses these steps entirely by utilizing an additive printing approach to build selective openings directly during the resin deposition phase. This eliminates the risk of laser-induced thermal or physical damage to sensitive embedded silicon.

This capability is especially critical for rugged IoT sensor modules that require absolute waterproofing but must also maintain open access to the environment. For example, a temperature sensor can be fully encapsulated in a protective 3D printed resin block while keeping a precise, open window exposed to receive external infrared radiation.

Additionally, this native patterning process allows for complex multi-layer component stack-ups where microvias are built additively during the filling stage. By avoiding post-processing steps like etching or drilling, the design-to-production workflow is simplified into a single digital process.

In this short video, you can learn:
* The mechanism of forming precise via holes and selective window openings natively without subtractive laser or etching steps.
* How to achieve complete waterproof encapsulation of IoT modules while keeping sensing elements exposed to the environment.
* The layout advantages of building multi-layer component stack-ups using continuous digital resin printing.

📋 **Clip Abstract** This clip explains how additive manufacturing enables the creation of selective open structures and vias around embedded components without laser drilling. It showcases the practical application of this technology in fabricating protected yet functional waterproof IoT sensor modules.