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Stefan Bendig

Würth Elektronik Group

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Stefan Bendig | Würth Elektronik Group: Your stretchable PCB substrate is biocompatible and flexible, but what's the one critical property that could melt your entire project?

00:06:16 - 00:07:19

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Summary of the clip:

Your stretchable PCB substrate is biocompatible and flexible, but what's the one critical property that could melt your entire project?

The substrate material, Thermoplastic Polyurethane (TPU), is chosen for its excellent properties for wearable and medical applications. The material itself is biocompatible, and when processed into a final PCB (with copper traces), it is considered skin-friendly, making it suitable for direct contact with the human body. It is also highly flexible, durable, and resistant to abrasion, allowing it to withstand the rigors of being worn, twisted, and stretched.

Despite these advantages, the TPU substrate has one critical limitation: its thermal performance. The material has a very low softening area and a melting point below 190°C. This characteristic is a major constraint that dictates the entire downstream assembly and integration process, as it is far below the temperatures used in conventional electronics manufacturing.

The direct consequence of this low melting point is the incompatibility with standard soldering processes. A typical lead-free solder reflow profile reaches temperatures around 260°C, which would completely melt the TPU substrate, destroying the circuit. Therefore, any component assembly must be performed using specialized low-temperature soldering (LTS) pastes or conductive adhesives that cure at temperatures safely below the 190°C threshold of the TPU.

In this short video, you can learn:
* The key material properties of the TPU substrate, including its skin-friendly nature.
* The critical thermal limitation of TPU: a softening point below 190°C.
* Why standard soldering is impossible and the necessity of using low-temperature assembly materials.

📋 **Clip Abstract**
This clip details the properties of the TPU substrate used in stretchable PCBs, highlighting its benefits like skin-friendliness and flexibility. However, it crucially points out the material's low melting point (<190°C), which prohibits standard soldering and dictates the entire component assembly strategy.
🔗 Link in comments 👇

#StretchablePCB, #TPUSubstrate, #LowTemperatureSoldering, #FlexibleElectronicsAssembly, #WearableElectronics, #FlexibleElectronics

This is a highlight of the presentation:

The Future of Electronics RESHAPED 2024

23-24 OCT 2024

Estrel Congress Centre, Berlin, Germany

Organised By:

TechBlick

More Highlights from the same talk.

00:03:54 - 00:05:17

How do you make a rigid material like copper stretchable without changing your entire PCB manufacturing line?

How do you make a rigid material like copper stretchable without changing your entire PCB manufacturing line?

The core technology for creating these stretchable circuits involves laminating a standard copper foil onto a thermoplastic polyurethane (TPU) substrate. The key to achieving stretchability is not in the material itself, but in its geometric structure. The copper is etched into a specific meandering pattern, which allows the overall circuit to elongate by deforming the shape of the meanders, much like a spring, rather than stretching the rigid copper material itself.

A significant commercial and manufacturing advantage of this approach is its compatibility with existing PCB production infrastructure. Because the process starts with a copper-laminated substrate, it can be fed into a normal manufacturing line without requiring a complete overhaul of the equipment or process flow. This enables faster, more cost-effective production compared to methods that require entirely new fabrication techniques.

Once the basic stretchable PCB is produced, it can undergo various secondary processes to suit specific applications. The thermoplastic nature of the TPU substrate allows for thermoforming into 3D shapes. Furthermore, the board can be laminated directly onto textiles, with the TPU itself acting as a hot-melt adhesive, eliminating the need for extra glue layers. However, component assembly requires special consideration, specifically the use of low-temperature soldering pastes or conductive adhesives due to the thermal limitations of the TPU.

In this short video, you can learn:
* The fundamental principle of using meandering copper structures on a TPU substrate.
* How this method integrates seamlessly into standard PCB manufacturing flows.
* Post-processing options like thermoforming, textile lamination, and low-temperature assembly.

📋 **Clip Abstract**
This clip explains the core manufacturing principle behind stretchable PCBs, which uses geometrically structured copper on a TPU substrate to achieve flexibility. This innovative approach allows for integration into existing production lines and enables further processing like thermoforming and lamination.
🔗 Link in comments 👇

#MeanderingCopper, #TPUSubstrate, #StretchablePCBs, #PCBManufacturingIntegration, #FlexibleElectronics, #WearableElectronics

00:17:36 - 00:18:42

You've designed the perfect stretchable circuit, but how do you attach components without creating a rigid, breakable failure point?

You've designed the perfect stretchable circuit, but how do you attach components without creating a rigid, breakable failure point?

The primary challenge in assembling components on stretchable PCBs is the inherent mechanical mismatch between rigid components and their interconnects versus the flexible, dynamic substrate. Standard solders, even low-temperature variants, become rigid once cooled. When the circuit is stretched or bent, this rigid solder joint cannot deform with the substrate, creating a high-stress concentration point that is extremely prone to cracking and electrical failure.

To mitigate this, several interconnection strategies are considered, each with its own trade-offs. While low-temperature solder is a necessity due to the substrate's thermal limits, its rigidity remains a problem for dynamic applications. Wire bonding is another potential technique, but the very thin wires are fragile and can easily break under repeated strain. A common design solution is to incorporate small, rigid FR-4 "islands" into the flexible circuit, providing a stable platform for soldering components without subjecting the joints to mechanical stress.

Conductive adhesives are presented as a highly promising alternative for creating more robust interconnects. Unlike solder, certain conductive adhesives are formulated to remain flexible after curing. These "bending" adhesives can better accommodate the mechanical stress of stretching and flexing, maintaining a reliable electrical connection without creating a brittle failure point. This makes them a superior solution for applications requiring high dynamic reliability.

In this short video, you can learn:
* The problem of mechanical mismatch between rigid solder joints and flexible substrates.
* The pros and cons of different interconnect methods like soldering, wire bonding, and using rigid islands.
* Why flexible conductive adhesives are a strong solution for maintaining circuit integrity during flexing.

📋 **Clip Abstract**
Attaching components to stretchable PCBs is a major challenge, as traditional rigid solder joints create failure points under stress. This analysis explores the trade-offs between low-temperature soldering, wire bonding, and the use of flexible conductive adhesives to create robust and reliable interconnects.
🔗 Link in comments 👇

#StretchablePCBs, #FlexibleInterconnects, #ConductiveAdhesives, #SolderJointReliability, #FlexibleElectronics, #WearableElectronics

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