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Stephan Harkema | Maarten Cauwe

Holst Centre | imec

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Stephan Harkema | Maarten Cauwe | Holst Centre | imec: Are your design engineers unknowingly sabotaging your sustainability goals by choosing the 'best' materials?

12:27 - 14:01

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Summary of the clip:

Are your design engineers unknowingly sabotaging your sustainability goals by choosing the 'best' materials?

A significant and often hidden factor driving environmental impact in electronics is over-specification by designers. In both PCB and printed electronics design, there is a tendency to push technological limits by using the finest line widths, smallest vias, and top-tier surface finishes, even when the application doesn't require such high performance. This culture of over-specification leads to products being built to a higher, more resource-intensive standard than necessary, increasing waste and energy consumption.

A prime example is the common use of Electroless Nickel Immersion Gold (ENIG) as a standard surface finish for prototyping PCBs. While it offers excellent performance, it is often unnecessary for the application, and the environmental impact of gold mining and processing is immense—far exceeding that of materials like silver. This choice, often made by default, carries a massive and avoidable environmental cost that is not immediately visible to the designer.

The solution is to empower designers with immediate, actionable data at the point of decision-making. The goal is to integrate environmental impact models directly into the design software for both PCB and printed electronics workflows. This would provide designers with direct feedback on how their choices—from material selection to feature size—affect the overall environmental footprint, enabling them to make more sustainable decisions without compromising necessary performance.

In this short video, you can learn:
* How the engineering culture of "over-specification" creates a hidden source of environmental waste.
* Why the default choice of high-performance materials, like gold surface finishes, has a disproportionately large negative impact.
* The strategic importance of integrating real-time environmental impact feedback into the electronic design process.

📋 **Clip Abstract** This clip exposes how over-specification in electronic design—choosing higher-performance materials and features than needed—is a major hidden driver of environmental impact. The solution proposed is to integrate sustainability models directly into design tools, giving engineers real-time feedback on the consequences of their choices.
🔗 Link in comments 👇

#ENIG, #PrintedElectronicsDesign, #PCBDesign, #DesignForSustainability, #AdditiveElectronics, #SustainableElectronics

This is a highlight of the presentation:

The Future of Electronics RESHAPED 2024

23-24 OCT 2024

Estrel Congress Centre, Berlin, Germany

Organised By:

TechBlick

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07:40 - 09:15

How can you accurately quantify the environmental footprint of a complex PCB before it's even manufactured?

How can you accurately quantify the environmental footprint of a complex PCB before it's even manufactured?

A major challenge affecting both printed electronics and traditional PCBs is the lack of reliable data to quantify environmental impact. This data is increasingly demanded by end-users for regulatory and marketing reasons, putting pressure on the entire supply chain. To address this, imec has developed a sophisticated "virtual fab model" specifically for PCB manufacturing, moving beyond generic estimates to provide precise, design-specific analysis.

This model is parametric, meaning it directly links the specific design of a circuit board to its manufacturing footprint. It takes into account critical design aspects such as the board's size, the number of layers, the specific component layout, and the types of materials used. This level of detail allows for a granular and accurate assessment that reflects the unique characteristics of each product, rather than relying on industry averages.

For every step in the manufacturing process flow, the model calculates the resources consumed. It determines which equipment is used and quantifies its energy and water consumption. Furthermore, it tracks the generation of waste and the use of auxiliary materials, such as photoresists and other chemicals. The final output provides a comprehensive inventory of the total energy, water, waste, and chemicals required to produce that specific PCB design.

In this short video, you can learn:
* The critical need for accurate data to quantify the environmental impact of electronics manufacturing.
* How a parametric "virtual fab model" simulates the entire PCB production process based on design inputs.
* The key parameters the model uses, from board size and layer count to the specific energy, water, and chemical consumption at each process step.

📋 **Clip Abstract** This clip details a parametric "virtual fab model" developed by imec to address the lack of reliable sustainability data in electronics. The model quantifies the precise environmental impact of PCB manufacturing by linking specific design parameters to resource consumption at every process step.
🔗 Link in comments 👇

#VirtualFabModel, #PCBManufacturing, #EnvironmentalFootprint, #ParametricModeling, #PrintedElectronics, #ElectronicsManufacturing

05:00 - 06:26

Printed electronics is hailed as the sustainable alternative, but what are the hidden environmental trade-offs?

Printed electronics is hailed as the sustainable alternative, but what are the hidden environmental trade-offs?

While printed electronics offers many sustainability benefits, it's crucial to acknowledge its own set of environmental challenges. A key material, silver, is not environmentally benign; it is ecotoxic and can be used as a disinfectant, posing risks if not handled properly at its end-of-life. Although its value as a precious metal creates a strong incentive for recycling, its inherent toxicity is a factor that must be considered in a full life-cycle analysis.

From a manufacturing perspective, printed electronics processes are still maturing compared to the highly optimized, decades-old PCB industry. This can result in lower production yields and challenges with material recovery. A significant issue is the limited shelf life and work life of many conductive inks and adhesives. These materials expire after a certain period, leading to waste if not used in time, which adds to the overall environmental impact of the process.

Furthermore, a major challenge exists at the end of the product's life. Unlike traditional electronics, there is no dedicated waste stream for printed and flexible electronics. These products typically enter the general e-waste stream, which is optimized for recovering materials from conventional PCBs. The unique materials and construction of printed electronics may not be recycled efficiently in these existing systems, leading to potential resource loss and environmental contamination.

In this short video, you can learn:
* The environmental concerns associated with silver, a primary conductive material in printed electronics, due to its ecotoxicity.
* How manufacturing challenges like production yield and the limited shelf life of inks contribute to material waste.
* The critical end-of-life problem caused by the lack of a dedicated recycling stream for printed electronic devices.

📋 **Clip Abstract** This clip provides a balanced technical analysis of the environmental challenges facing printed electronics. It highlights issues such as the ecotoxicity of silver, process inefficiencies related to ink shelf life, and the critical lack of a dedicated end-of-life recycling stream.
🔗 Link in comments 👇

#SilverEcotoxicity, #PrintedElectronicsYield, #ConductiveInkShelfLife, #PrintedElectronicsRecycling, #FlexibleElectronics, #SustainableElectronics

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