Free seminar An Introduction to Printed Electronics & Thick Film Technology May 22nd & 23rd, 2024 With Dinner on Wednesday, May 22nd Join us to hear leading industry experts provide a comprehensive overview of Printed Electronics/Thick Film materials and processing during this TWO DAYS / TWO TRACKS IN PERSON seminar. The seminar is designed for professionals and engineers who are new to Printed Electronics & Thick Film Technology or would like to learn more about its art and science. The program also comprises talks from external speakers as well as a tour of our European Technology Center (ETC) for Engineering Polymers. In addition, we will display and discuss Printed Electronics/Thick Film applications. The event runs from 8:30 am to approximately 5 pm each day. Lunch, coffee and light snacks will be provided during the seminar. Please refer to the attached preliminary agenda Seminar Location Celanese Performance Solutions Switzerland Sàrl Route du Nant-d’Avril 146 1217 Meyrin, Switzerland

Click HERE to register for the Seminar

Recommended Hotel Mercure Geneva Airport (10 min walk to the Seminar location) 3B Rue de la Bergère, 1217 Meyrin, Geneva A contingent number of rooms are pre-reserved to ensure availability. Please book prior 15th April 2024 by sending an email to: mercure-geneva-airport@accor.com and refer to: “Celanese Group as of May 2024” Additional Hotels (not pre-reserved) Hotel NH Geneva Airport, Av. De Mategnin 21, 1217 Meyrin, Geneva Hotel NH Genev...

Authors: Daan de Kubber , Jurgen Westerhoff , Ben Robesin SPGPrints b.v., Raamstraat 1-3, 5831 AT, Boxmeer, the Netherlands Printed electronics have gained significant attention for their potential to revolutionize various industries through cost-effective and scalable manufacturing processes. However, a critical challenge within this domain lies in the transition from lab-scale and pilot equipment to industrial-scale production. We want to shed light on the implications of this transition, emphasizing its impact on cost reduction, repeatability, and time to market. The initial stages of printed electronics development predominantly occur on lab and pilot equipment, where researchers and innovators prototype new applications. As these applications progress towards commercialization, the shift to industrial-scale equipment becomes inevitable. Rotary screen printing emerges as a prominent technique, providing high-throughput capabilities essential for large-scale production. We are Speaking at the Free-To-Attend On-Line Innovations Festival on 25 April 2024.
Register to hear our talk, and meet us during the virtual networking. We have looked critically at this transition. Investments in Industrial-scale equipment, though substantial, ultimately leads to significant cost reductions in large-scale production. This is essential if manufacturers want to achieve sustainable, cost-effective printed electronics. Moreover, the transition to industrial-scale equipment like Rotary Scr...

How to extend the pot life of silicone to several months without changing its material properties? Ulrich Trog [ Ulrich.Trog@joanneum.at | JOANNEUM RESEARCH] explains in this article how this is possible JOANNEUM RESEARCH offers the formulation of the appropriate compound based on feasibility studies of the silicones used by its customers. Licences for the Supresil™ technology are available. Platinum (Pt)-cured silicones are gaining in popularity, emphasising addition curing over traditional peroxide methods. This process ensures purity and efficacy, resulting in products with increased strength and superior aesthetics. The rise of Pt-curing marks a significant shift in silicone manufacturing techniques, promising unmatched quality and durability in a variety of applications. When crosslinking is initiated, the curing process starts almost immediately and the resulting silicone typically has a pot life limited to a maximum of a few hours at room temperature. This places significant practical and technological limitations on its use: short processing time manufacturing waste difficult reproducibility inflexible manufacturing process Our patented formulation greatly increases pot life via reversible inhibition of the crosslinking via hydrosilylation . After deposition, the inhibitors evaporate easily. Normal crosslinking occurs at mild temperatures, even below 80 °C, leading to a fast and complete curing. Join the Future of Electronics RESHAPED event in Boston on 12 & 13 Ju...

Disrupting Printed Electronics with a Dry Multimaterial Printing Technology? Author: Masoud Mahjouri-Samani, PhD | NanoPrintek | info@nanoprintek.com Modern technology and the move toward the Internet of Things have escalated the demand for innovative and efficient printing techniques, particularly in electronics and functional devices. Traditional ink-based printing methods have long been the standard, but now NanoPrintek’s dry multimaterial printing technology has emerged as a disruptive alternative, offering numerous advantages over its ink-based counterparts. The technology’s on-demand and in-situ nanoparticle generation and real-time sintering capability allow the printing of various electronics and functional devices with pure, multifunctional, hybrid materials printing. This thus opens the path to electronics printing and other applications ranging from energy and health to sensing devices. Figure 1. Dry printing process. On-demand/ in-situ nanoparticle generation and real-time laser sintering that enables the printing of various electronics and functional materials and devices. Unveiling a Universe of Materials Beyond the Limitations of Ink: Traditional inks can be restrictive regarding the materials they can accommodate. Dry printing, on the other hand, opens doors to a wider range of possibilities. From semiconductors and conductors to insulators and nanocomposites, dry printing can handle a broader spectrum of functional materials rapidly, enabling the creation ...

UJIWARA REI | Panasonic Electronic Materials Business Division | fujiwara.rei@jp.panasonic.com High-frequency devices, such as those used in beyond 5G and 6G technologies, require precise and reliable signal transmission for optimal performance. High-frequency signals are more susceptible to noise interference, which can degrade the quality and integrity of the transmitted data. Noise mitigation is crucial to ensure that the intended signal is accurately received and interpreted.
Traditionally, noise-absorbing materials have been used as an effective method of making noise. Noise absorbing materials are generally sheet or sponge type. However, these types are difficult to apply beyond5G/6G devices which become smaller and more complicated. We are speaking in Boston on 12-13 June 2024 at The Future of Electronics RESHAPED USA
Register now and come to hear our talk To solve this problem, we propose a noise-absorbing paste. Dispensable material can be easily installed in narrow spaces, suppressing noise inside electronic devices used in beyond 5G/6G, and contributing to improved quality and performance. Features: Dispensable Good conformability High frequencies over 100GHz Figure 1 Paste Noise Absorber Table 1 Properties Figure 2 Absorption vs frequency
Case 1: For solving cavity resonance. Figure 3 MMIC on antenna module. The radiation noise of MMIC resonating in the cavity affects the antenna characteristics.  (Figure.3) Noise absorbing paste can be installed on small sp...

Authors: Mike Simmons, Matthew Kleyn, Joseph Vlach, Liz Josephson; Intellivation LLC ljosephson@intellivation.com | Intellivation The demand for high-performance devices with enhanced functionalities continues to grow. Materials, such as graphene and MoS2, exhibit unique electrical and mechanical properties making them ideal for flexible electronic applications. To meet the rising demand and requirements for flexible 2D microelectronics devices manufactured using Roll to Roll technology, we use innovative manufacturing techniques including vacuum coatings in combination with laser technology. Laser patterning of sputtered coatings provides the ability to achieve high-volume production with precision, functionality and efficiency for a wide range of flexible applications. Sputter deposition is a widely used technique for depositing thin films onto substrates. For flexible 2D microelectronics, sputtered coatings serve as the foundation for building functional devices. Sputtering involves bombarding a target material with ions to eject atoms or molecules, which then deposit onto a substrate to form a thin film. This process allows for precise control over the thickness and composition of the deposited film, making it a preferred method for creating uniform and reproducible coatings. Sputtered layers were deposited using Intellivation’ s R2R Lab system. Sputtering provides an excellent method for depositing coatings uniformly over large areas, while laser patterning can create...

On 25 April, we will hold our  FREE-TO-ATTEND  online Innovations Festival, focusing on aspects of additive, sustainable, flexible, hybrid, wearable, and 3D electronics.   Attendee places will be limited and assigned on a first-come, first-served basis. At our last Winter Festival, we had 700 unique actual attendees, so book now to secure your place. As always, this festival will take place on the unique TechBlick platform. You can use your avatar to meet the speakers, visit the exhibition, and network with fellow participants.  Agenda Track 1 1:00pm | Hangzhou LinkZill Technology | Innovating with TFT technology in both optoelectronic and biological ways 1:15pm | Smartkem | Organic Thin-Film Transistor Technology – from Lab to Fab 1:30pm | DoMicro | Inkjet Printed Interconnects on Bare Dies for Hybrid Electronics* 2:00pm | Fraunhofer IAP | Polymeric solid electrolytes* 2.00PM | Break/Exhibition 2:50pm | VTT | R2R Manufacturing of Flexible Electronics with Integrated Pick-and-Place* 3:05pm | Linxens | Scalable, customizable, multimodal electrode platform for biosensors and sensors 3:20pm | TNO | Advancing Medical Technology: Printed Electronics and Hybrid Integration Pave the Way for Next-Generation Medical Devices. 3:35pm | 3E Smart Solutions | Driving Reliability and Scalability in E-Textiles and Wearables via Embroidery Technology 3:50pm | Metafas | Going from Screen Printed Human Machine Interfaces to 3D Multi-Layer Electronics* 4:05 PM | Break/Exhibition 4:55pm |...

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