top of page

Printed, Flexible, Hybrid, & InMold Electronics

580b57fcd9996e24bc43c545.png
MAR 2021
5 Minute preview of all the event presentations

TechBlick members can watch all these presentations in full. Register to get access.

* Members only

Annika Müller

Arburg

Annika Müller

Application Engineering

Arburg
Automated IMSE Mass Production

Nowadays, finishing and functionalisation of the surface of high-quality plastic parts is a crucial topic and has a big influence on the industry.
To achieve this in a economically efficient and standardised manner, it is important to combine all the necessary steps in the perfect way.
In this presentation, we will have a look at each of these steps and how they are connected in a fully-automated production cell.
In the end, the plastic part is made out of a printed and functionalized foil – ready to use.

Video https://www.youtube.com/watch?v=azzLwrlO4vU

David Lim

Australian Advanced Materials (AAM)

David Lim

Business Development Manager

Australian Advanced Materials (AAM)
Nanocube Ink Nanomaterial

Australian Advanced Materials (AAM) is an Australian start-up company established to develop and commercialise revolutionary materials technology being developed in Australia. AAM is a wholly owned subsidiary of Strategic Elements Ltd. AAM is currently
developing a printed memory technology for the printed/flexible electronics sector based on its Nanocube Ink technology. This presentation will cover the current status of the printed memory development by AAM.

Ken Klapproth

CHASM Advanced Materials

Ken Klapproth

Marketing Executive

CHASM Advanced Materials
Why your next automotive heater will be a CNT hybrid

Bio

With more than 25 years of success matching technically advanced products to market demand, Mr. Klapproth has helped companies small and large achieve double-digit growth. He joined CHASM in 2019 bringing global expertise from leading sales and marketing organizations at companies including Desalitech, Elsevier, IHS, Entuity, Proficiency, and Siemens. Results-oriented and data-driven, Ken is fanatical about accelerating sales traction for technically complex products, cutting edge demand generation, is the holder of two U.S. patents, and believes electronics should be intuitive, integrated, organic, and – most importantly – NOT seen. Ken holds a BS in Mechanical Engineering from the University of Connecticut and began his professional career at Pratt & Whitney designing jet engines found under the wing on many of today’s modern aircraft including the Boeing 777. In his spare time, Ken is an avid woodworker, photography and video enthusiast, and runner.

Thomas Kolbusch

COATEMA Coating Machinery GmbH

Thomas Kolbusch

Vice President

COATEMA Coating Machinery GmbH
New & Digital Production Methods For Printed Electronics

Coatema Coating Machinery GmbH is a market leader in R2R equipment for printing, coating and laminating. Working in PE for nearly 20 years the company specialized in the scale up from innovative products and technologies from Lab2Fab. The speaker describes the strategy and the shift into digital fabrication, moving from analog printing systems into inkjet and other digital methods. This approach is combined in the semi digitalization of standard systems like slot die coating. The overall umbrella on all activities is the industry 4.0 approach with the focus on inline control of processes, products and equipment by sensors, camera systems and other tools. Combining the data out of these processes with artificial intelligence and big data to make the digitalization of the processes possible.

Thomas Kolbusch
Vice President @ Coatema® Coating Machinery GmbH

Bio

Thomas Kolbusch is Vice President of Coatema Coating Machinery GmbH, an equipment manufacturing company for coating, printing and laminating solutions located in Dormagen, Germany.
He is member of the board of the OE-A (Organic Electronic Association) in Germany, a global association for printed electronics.
He serves in the advisory board of Fraunhofer ITA institute.
He served as member of the board of COPT.NRW, a local association in Germany, as well as exhibition chair of the LOPEC in Munich for five years. Thomas is active in the field of fuel cells, batteries, printed electronics, photovoltaics and medical applications. He organizes the international Coatema Coating Symposium for over 19 years and represents Coatema in a number of public funded German and European projects. Thomas Kolbusch studied Business Economics at the Niederrhein University of Applied Sciences and got his degree as business economist in 1997. He started his career at 3M, Germany. Since 1999 he is working for Coatema Coating Machinery in different positions.

Mari Makkonen

Canatu

Mari Makkonen

Marketing Director

Canatu
CNB Film Heaters for ADAS Sensors to Enable Any-Weather Safe Autonomous Driving

The presentation focuses on CNB film heaters for ADAS camera and LiDAR sensors, covering ADAS market evolution, constraints to ADAS uptake, side effects of fair weather on LiDAR and camera systems, challenges associated with the conventional heating wires and the limitations can be overcome to improve safety and reliability. During the presentation, optical test results and integration possibilities will also be shared.
CNB heaters help vehicles “see” better and provide clear field of vision for ADAS systems to operate. These wire-free film heaters provide even heating and low optical distortion enabling accurate object detection. They can be 3D formed and either laminated or injection molded to provide a robust structure. Join our session to learn more!

Mari Makkonen
Marketing Director @ Canatu Oy

Bio

Marketing Director of Canatu, a carbon nanomaterial company, with extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries. Extensive experience in global B2B technology marketing from nanomaterial, health tech, fire suppression and IT industries.

Chris Booher

ChemCubed

Chris Booher

Chief Marketing Officer

ChemCubed
Multi-material /Multi-layer Solutions for Additively Manufactured Electronics/ Printed Electronics (AME/PE)

ChemCubed, a U.S. based manufacturer of materials and printing solutions for 3D printing / Additive Manufacturing, will present their ElectroJet brand solutions for AME/PE covering the offerings of materials (silver conductive and dielectric insulating inks), equipment (electroUV3D inkjet printer for electronics), and processes. The multi-faceted portfolio will be highlighted for differentiation in performance, economics, flexibility, compatibility and benefits to key applications and market segments. ChemCubed will also present examples of the ElectroJet brand’s resulting solutions to date by application, further understandings of unmet needs within the industry and emerging technology to address the needs in the future developments of materials and equipment.

Christopher Booher
Chief Marketing Officer @ ChemCubed

Bio

Chris Booher holds a BBA in marketing with over 25 years of business experience in the packaging and materials industry and is committed to growing ChemCubed’s leading technologies position in the 3D printing materials market. He has worked with multiple companies from privately owned expansions to Fortune 500s headquartered in the USA and Europe. His experience ranges from full P&L general management, sales and business development for application-specific technologies in paper, films, adhesives, specialty coatings and printing inks. Chris is focused on partnering with customers to fully embrace target driven solutions tailored to each company’s unique end-use applications and needs.

Ofer Shochet

Copprint

Ofer Shochet

CEO

Copprint
Copper pastes that outperform silver – make the switch: Higher conductivity, lower cost, and superior sustainability

The future of printed electronics is Copper. Conductive Copper inks are ushering in a new era of printed electronics, empowering ubiquitous conductivity.
In this presentation, we will review Copper pastes, which are superior to silver pastes and to etching techniques. These pastes are suitable for various substrates such as Paper, PET, PI, Glass, Aluminum, Alumina, FR4, silicon wafers and photovoltaic wafers. We will review different applications such as printed antennas, heaters, flexible circuits, PCBs, and displays. We will demonstrate that a very high level of conductivity can be obtained with Copprint’s Nano-Copper pastes while dramatically reducing costs and using simple, low-cost equipment and under-air processing. All our Copper inks are commercially available for purchase.

John Skabardonis

Covestro

John Skabardonis

Technical Marketing

Covestro
Exposing The Anatomy Of Functional Surfaces

Driven by the desire for ever more compact and sophisticated devices, increasing demands for improved functionality and for more customization options, OEMs are turning to functional integration. Thin, three-dimensional parts which were previously simply thought of as covers, or “skins” can now incorporate diverse functionality. This presentation will explore different means of achieving the above goals through the use of materials from Covestro.

John Skabardonis
High-Tech Materials for Electronics @ Covestro

Bio

John Skabardonis is a Chemist-turned-Marketer-Communicator in the Polycarbonates business unit at Covestro, LLC. He is responsible for technical marketing for electronics, electrical and appliances in the Americas region. John is fascinated by the rapid evolution of technology and is focused on materials and techniques which enable this evolution. He is also intensely interested in social media as a means of helping make information easily accessible. John received a Ph.D. in Physical/Organic Chemistry from Case Western Reserve University. He is a design advocate & a member of the Industrial Designers Society of America, a Distinguished Toastmaster and a chairholder in the Color Marketing Group.

André Bausch

Dr. Jean Bausch GmbH

André Bausch

Managing Director

Dr. Jean Bausch GmbH
High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing

Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.

Bio

Mr. André Bausch was born 1969 in Cologne
Since 1987 shareholder and marketing manager of Dr. Jean Bausch GmbH & Co. KG
Since 1998 until today Managing Partner of Dr. Jean Bausch GmbH & Co. KG
Since 2007 Director of Bausch Articulating Papers Japan K. K.
André Bausch has been awarded the "Cellerant Best of Class Technology Awards" for the newly developed OccluSense® system during the "ADA FDI World Dental Congress" in San Francisco in September 2019 .

Since 1953, the company Dr. Jean Bausch GmbH & Co. KG has been manufacturing occlusion test materials for dentistry since 1953. Bausch products are being used in more than 120 countries and sold through specialized dealers and Bausch’s subsidiaries in the United Staed, Australia, Japan, Korea and Brazil.

Carolyn Ellinger

Eastman Kodak Company

Carolyn Ellinger

General Manager (PE)

Eastman Kodak Company
Advantages of High-Resolution Flexography for Functional Printing

Print technologies are being used today in the manufacture of consumer products, including flexible electronics and optics. There are multiple available printing technologies that offer a range of addressable resolutions and obtainable throughputs (i.e. print speed). Resolution and speed are only part of the story, one also needs to understand the latitude for useable inks and the volume of those inks that can be deposited at speed in a single-pass process with good pattern fidelity.

EKTAFLEX functional printing solutions enable flexographic processes to achieve sub-10-micron on-substrate features. This talk will focus on the advantages of high-resolution flexography, and how these small features sizes can be used to create advantaged products. Included will be a review of both the innate capabilities of flexography and application specific benefits over other print technologies, such as drop-on-demand inkjet.

Examples of both additive and subtractive processing via high resolution flexography will be discussed. Real case studies will be presented, including Kodak’s own additive, roll-to-roll (R2R) manufacturing process for copper micro-wire patterns on flexible substrates used for transparent RF devices, such as antennas and EMI shields. In addition, success cases from partners’ use of Kodak’s EKTAFLEX plates for functional printing will also be shared – illustrating not just the benefit of the technology but Kodak’s dedication to enabling partners to achieve their product and performance milestones.

Carolyn Ellinger
General Manager Printed Electronics & V.P. Kodak PE Tech, LLC @ Eastman Kodak Company

Bio

Carolyn Ellinger is General Manager, Printed Electronics at Eastman Kodak Company and V.P. Kodak PE Tech, LLC, a subsidiary of Eastman Kodak Company. She received a B.S. degree in chemical engineering from the State University of NY at Buffalo, and an M.S. degree in chemical engineering from the University of Rochester. In her 25+ years at Kodak, she has held technical positions in film systems, flexible displays, nanotechnology and semiconductor devices, MEMS-based devices, spatial ALD, and printed electronics. Her research has resulted in peer-reviewed journal articles, multiple contributed and invited presentations, over 70 Granted US Patents, and numerous improvements to Kodak products.

Carolina Gioscio

Evonik

Carolina Gioscio

Marketing Manager

Evonik
TAeTTOOz® Battery Materials: The Next Thin Thing

TAeTTOOz® is a new technology development from the strategic innovation unit of Evonik Operations. Based on redox-polymers, it allows for ultra-thin printed batteries that can be directly integrated into sensors and IoT devices. The new proprietary TAeTTOOz® technology enables new applications in the IoT field, promoting more accurate health monitoring, more efficient logistics and smarter infrastructure. Completely polymer-based, this new materials are environmentally benign and can be processed via printing technologies. This allows for a seamless integration of the battery into the production process, creating new dimensions of design freedom.

Carolina Gioscio
Marketing Manager Sustainable Solutions @ Evonik Creavis

Bio

As the Marketing Manager Sustainable Solutions at Creavis, the strategic innovation unit of Evonik, Carolina Gioscio brings her passion for developing strong relations to engage manufacturers and developers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, Carolina holds over 15 years of experience in the field of specialty chemicals in different marketing and sales roles across regions in Asia, South America and Europe.

Carolina Gioscio is the Marketing Manager at the Sustainable Solutions unit of Creavis, the strategic innovation unit of Evonik, where she brings her passion for developing strong relations to engage manufacturers of IoT devices with TAeTTOOz® printable battery technology. With a MSc in Chemistry and a certificate in Business, holds over 15 years of experience in specialty chemicals in different marketing, sales and business development roles in South America, Asia and Europe.

Nello Li Pira

FIAT Research Centre

Nello Li Pira

Head of Materials Labs

FIAT Research Centre
Materials Meets Electronics: A New Paradigm for Automotive Components

This work discusses one of the main future challenge in automotive materials addressing the integration of embedded electronic functionalities and sustainability.

The cars of the future will have an elegant and ergonomic design with embedded sensors, touch surfaces and biomimetic multi-coloured components. E-mobility and autonomous driving are becoming fundamental demands in vehicles but at the same time, they have to merge with sustainability introducing biomaterials and strengthening the circular economy. This implies a continuous development of current products with increase of electronics contents meeting in parallel the main issues of economy of the future: limiting the presence of hazardous chemicals, increase uptake of recycled materials and developing bio-based plastics.

Nello Li Pira
Head of Materials Labs @ FIAT Research Centre

Bio

Nello Li Pira, Dr. General Physics, University of Torino, 2000. He obtained a PhD degree at the Polytechnic of Turin in 2010. He currently works as Global Materials R&I manager in FCA Material Engineering and additionally he is in charge of Electrics/Electronics and Multi-functional materials department in EMEA. He is the global manager of Advanced & Aesthetics Materials managing within the internal FCA Innovation Master plan on the development of novel innovative trims/solutions for different FCA projects including Alfa Romeo, Maserati, FIAT, and JEEP brands. He was involved in the development of interior trims and display materials for several FCA brands. Currently he is the reference for materials and optical assessment of display in FCA. He masters in surface and coating metrology and plastic electronics since 2009. He has international experiences in European projects as project coordinator: FP7 ICT PRIAM and scientific responsible in ICT, FOF and NMPB projects in the frame of H2020 and FP7 programs. He is inventor of more than 10 industrial patents and author of more than 10 international publications.

David Dewey

Fujikura Kasei

David Dewey

Marketing Manager

Fujikura Kasei
Materials With High Magnetic Permeability For RFID And Automotive Battery Case Applications

Nancy Stoffel

GE Research

Nancy Stoffel

Platform Leader for FHE at GE

GE Research
Flexible Hybrid Electronics Applications for the Industrial World

This presentation overviews GE’s vision of the digital industrial challenges in manufacturing. It does this in the context of opportunities for sensors, and communication elements made using flexible hybrid electronics, for smart manufacturing, structural health monitoring, and for improved worker safety and productivity.

Nancy Stoffel
Platform Leader for FHE @ GE Research

Bio

Nancy Stoffel specializes in design and manufacturing of printed embedded systems and electronics packaging. She serves as GE’s representative on the Nextflex consortia Board of Governors and was recognized for her technical contributions by being named a Next Flex Fellow. Nancy holds a PhD in Materials Science from Cornell University. Her career has focused on materials and process development for electronics integration. During her 30+ industry career, she was Director of Microsystems Integration at STC MEMS & Technical Manager at Xerox Corp in-charge of inkjet device fluidic design, materials technology and process development for next generation product. During her time at IBM she developed new materials and process technology to create co-fired glass-ceramic multichip modules. She has been with GE Research for 9 years where her work has focused on the integration of sensors and electronics for power electronics, wearables and asset monitoring. She is active in the IEEE, and is the 2021 General Chair of the IEEE ECTC, the premier electronics packaging conference.

Andreas Friedrich

Geely

Andreas Friedrich

Chief Designer

Geely
Challenges & Opportunities with Printed Electronics in Automotive

Printed Electronics is one of the game changing technologies that will be a design enabler for future lightweight and smart solutions in many areas of Automotive. In this presentation we look at some of those, with the viewing angle of a designer and see what opportunities they might bring us and what challenges are still left to be solved.

Andreas Friedrich
Chief Designer @ Geely Design
Bio

Andreas Friedrich has a long track record in the automotive industry. He has worked with various customers, amongst others 8 years with Volvo Interior design during his 20 years with Consultancy company Semcon. Since 2013 he is part of Lynk & Co Design in Sweden where they design the Lynk & Co cars. There he has been working with Interior Design of the first car and was employed in 2016 as Chief Designer for Advanced Interior. Now he is Chief Designer for New Tech & Innovation and supports the whole GeelyDesign community of brands. As a trained Architect and Industrial Designer he has always had a big interest in New Technologies and how that can be used to enhance the user experience.

Franz Vollman

Heraeus

Franz Vollman

Head of Printed Electronics

Heraeus
Conformal EMI Shielding - Heraeus Intergrated Solution Platform

Electromagnetic interference (EMI) is increasingly becoming a problem in design of electronic devices – especially in 5G mobile phones. Higher frequencies, reduced height and real estate in the phone and increasingly dense packaging of sensitive components causes interferences and requires new solutions.
To meet this challenge Heraeus now offers an innovative digital system solution based on a particle-free Ag-ink and inkjet printing technology. This provides excellent shielding performance, high thru-put on mass manufacturing equipment, the possibility to apply selective shielding without the need for any masking and thus the most cost effective EMI shielding solution.

Michael Petersen

Information Mediary Corporation

Michael Petersen

CEO

Information Mediary Corporation
Real World Smart Packaging For Pharmaceuticals

Bio

Michael is a sought after presenter at conferences and has taught master class sessions on digital health transformation, NFC/RFID, coldchain, and printed electronics, smart packaging in Europe, Asia and North America.

Michael has co-founded and shaped IMC (Information Mediary Corp) into the world’s leading smart-package and medication adherence solutions provider.

Experience the power of convergence with our connected smart packaging and innovative, patient centric adherence solutions. Our solutions run over global health platforms to connect patients and their data directly with their care teams to assist in behavioural modification and support both AI and human clinical decisions.

www.informationmediary.com

Florian Ullrich

InnovationLab GmbH

Florian Ullrich

Business Development

InnovationLab GmbH
High-Volume of Printed Electronics: The LAB-2-FAB concept and industrial R2R printing

Roll-2-Roll production of Printed Electronics enables unprecedented throughput and breakthrough price levels. With the so-called LAB-2-FAB concept, InnovationLab provides the possibility to benefit from these advantages by a smooth transition from development of tailor-made integrated sensor systems over upscaling to an industrial production in cooperation with world market leader for printing presses Heidelberger Druckmaschinen AG.
The concept is exemplified by a medical product grade 1, the OccluSense® by Bausch. This first digital articulating paper was nothing but an idea some years ago and is now produced in millions.

Thomas Morel

JCDecaux

Thomas Morel

R&D Director

JCDecaux
Technologies For Out-Of-Home & New Applications

Girish Wable

Jabil

Girish Wable

Sensior Manager, Strategic Capabilities

Jabil
Bringing Flexible Hybrid Electronics to the Market

Bio

With a Bachelor of Science in Mechanical Engineering and a Master of Science in Industrial Engineering, Girish Wable is a technology, operations, sourcing and business solutions strategist for Jabil. With more than 25 years of global experience in electronics manufacturing, high performance coatings, material handling, automation, additive manufacturing, printed electronics and digital transformation, Girish leads up strategic business and technical initiatives for Jabil. Girish, who started as an intern with Jabil, has authored several engineering publications, received multiple patents and enjoys engaging with ecosystem partners and research institutions to further the technology. Girish regularly contributes to engineering articles, reviews technical proposals, serves as advisory board, write blogs for Jabil.com and has been a keynote speaker at multiple conferences.

James Lee

Jones Healthcare Group

James Lee

Director

Jones Healthcare Group
Improving Medication Adherence with Packaging

This talk will discuss how an intelligent package using printed electronics can be used to improve medication adherence with patients. Those outside of the medical field are unaware of the impacts of low medication adherence, James will define medication adherence and studies performed by Jones to improve adherence among patients.

Alfred Zinn

Kuprion Inc

Alfred Zinn

President

Kuprion Inc
Innovative Thermal Vias: Meeting the Power Dissipation and Thermal Management Needs of Today’s Advanced High Performance Systems

In today’s market, electronic systems have become ever more complex while current design methods for PCBs are limiting and inadequate. New approaches are needed to meet reliability demands for increased power dissipation and thermal management of advanced high performance systems. In this presentation, Kuprion, a spinout of Lockheed Martin, will not only detail these challenges, but demonstrate how new, innovative technologies like Active Cu (ActiveCopper™) filled thermal vias are addressing the requirements for more robust interconnect structures to enable thinner, cooler, more compact and reliable operating devices.

Florian Roick

LPKF

Florian Roick

Business Development Manager

LPKF
Active Mold Packaging – Additive IC Packaging For mmWave Applications

This presentation investigates the capabilities of Active Mold Packaging towards mmWave application. First the dielectric properties of three different AMP-EMCs are measured in the D-band. Second, the reflection coefficient S11, as well as the H- and E-plane radiation patterns are determined for a set of AMP manufactured 60 GHz bow-tie slot and dual dipole antennas. Where the measured results are compared to the design values and differences are discussed. And third, the D-band EMI shielding effectiveness of the electroless plated Cu/Ni/Au layer on the surface of three different AMP-EMCs is measured.

Florian Roick
Business Development Manager Active Mold Packaging @ LPKF

Bio

M. Sc. Florian Roick, Business Development Manager Active Mold Packaging. Born in 1981. He holds a degree as Bachelor of Science in Applied Physics from Dublin Institute of Technology. And a degree as Master of Science in Electrical Engineering with focus on laser systems, laser physics and microsystems engineering from Hochschule Bremen.
Since 2006 employed at LPKF Laser & Electronics AG, until 2008 as application engineer for the StencilLaser business unit. Between 2008 and 2019 strategic product manager responsible for aligning the product portfolio with the needs and requirements of the PCB and SMT markets.
Since 2019 Business Development Manager for LPKF’s Active Mold Packaging technology. That is to electrically functionalize the real-estate of the epoxy mold compound on the base of LPKF’s patented Laser Direct Structuring (LDS) technology. Co-inventor of the parametric stick-in and co-author of a variety of publications.

Mathias Rönnfeldt

Lightworks

Mathias Rönnfeldt

Technical Director

Lightworks
Technical & Styling Approaches For Intelligent Surface Illumination

Current light system development is much more than the sum of the right light source, the material setup and light output. Together with our customers Lightworks GmbH is creating more and more user-oriented lighting experiences. Main focus is the seamless combination of innovative lighting technologies like IMSE as well as advanced surfaces, materials and processes out of our network. This approach allows maximum design freedom during concept and series development for our customers and their clients.

Kimmo Pernu

Movesense by Suunto Oy

Kimmo Pernu

Innovation Architect

Movesense by Suunto Oy
In-mold Electronics Add Context Awareness to Smart Apparel

Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.

Terho Lahtinen

Movesense by Suunto Oy

Terho Lahtinen

Senior Manager, Future Concepts

Movesense by Suunto Oy
In-mold Electronics Add Context Awareness to Smart Apparel

Movesense is an open sensor platform for creating new solutions to track motion, heart rate and ECG. Movesense is used for building wearable sensor concepts and for integrating sensors with apparel. To enable smooth apparel integration and to provide context information for the sensor, Movesense team of the Finnish sports watch expert Suunto worked together with TactoTek, another Finnish tech company specialized in IME, to develop a flexible connector element that includes in-molded electronics and can be applied to clothing with typical textile industry methods. The presentation describes the project background and steps in practice.

Valentin Storz

NanoDimension

Valentin Storz

General Manager EMEA

NanoDimension
Current Applications and Outlook of 3D Printed Electronics

The presentation discusses current applications and outlook for the new production technology with focus on Nano Dimensions AME Technology. Nano Dimension (Nasdaq: NNDM) is a provider of intelligent machines for the fabrication of Additively Manufactured Electronics. Customer cases form Hensoldt (DE), CBN-IIT (IT), L3Harris (US), Rehau (DE), UTS (AU) with Applications in the field of Rapid Prototyping of complex PCB, 3D Electronics, Sensors, Heterogeneous Integration and SiP and RF applications are presented.

Patrick Malenfant

National Research Council Canada (NRCC)

Patrick Malenfant

Director of Research Development

National Research Council Canada (NRCC)
R2R Printed Carbon Nanotube TFT Sheets

This presentation covers our progress in high purity semiconducting single-walled carbon nanotube (sc-SWCNT) enrichment and transistor fabrication via solution based processes. I will highlight our recent progress in understanding sc-SWCNT enrichment using conjugated polymers (isolation of high purity sc-SWCNT), with special consideration given to the effects of solvent parameters and doping on the yield/purity of the final product. Fully printed transistors combining R2R gravure and inkjet-printing will be described as well as our recent progress in realizing “limitless” R2R gravure printed TFT backplanes capable of driving an e-paper display.

Patrick R. L. Malenfant*(1), Jianfu Ding(1), Jianying Ouyang(1), Zhao Li(1), Chang Guo(1), Jacques Lefebvre(1), Paul Finnie(1), Francois Lapointe(1), Gyoujin Cho(2)
(1)National Research Council Canada, 1200 Montreal Road, Ottawa, ON, K1A 0R6, Canada.
(2)Dept. of Biophysics, Sungkyunkwan University (SKKU), South Korea

Patrick Malenfant
Director of Research Development @ National Research Council Canada (NRCC)

Bio

Dr. Patrick Malenfant studied chemistry at the University of Ottawa (BSc 1995), Cornell University (MSc 1997), and the University of California - Berkeley (PhD 2000). He has 10 years of industrial R&D experience including a one year postdoc at IBM's TJ Watson Research Center and 9 years at the GE Global Research Center where he developed nanomaterials for Aerospace, Healthcare, and Organic Electronics applications. He joined the National Research Council of Canada in 2010 as a Senior Research Officer. He is currently the Director of R&D in the Security and Disruptive Technologies Research Center overseeing activities in Quantum Science, Printed Electronics and Structural Materials.

Martin Hedges

Neotech AMT GmbH

Martin Hedges

MD

Neotech AMT GmbH
Scalable 3D Printed Electronics - from “Fully Additive” to High Volume

This presentation will review the state-of-the-art related to the production of 3D mechatronic systems using Additive Manufacturing (AM) and review developments for scaling the processes through all stages, from one off prototyping to high volume manufacture.

A reconfigurable array of structural and electronics printing, pre- and post processing techniques are combined with SMD technologies to enable digitally driven 3D electronics manufacturing. The resultant flexible process chains can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. Selection of the most appropriate print, pre- and post-processing methods with the subsequent effect on process speed and cost will be discussed.

A brief review of current applications, spanning 3D electronic circuits, antenna, sensor and heater patterns will be conducted along with an update on the progression to First Time Right manufacture of complex devices.

Stan Farnsworth

NovaCentrix

Stan Farnsworth

Chief Marketing Officer

NovaCentrix
Innovation in a Pandemic

Even with the challenges of the past year, innovation has moved forward. Stan will take a look at how a few of the key tech trends have fared in the past year, such as 5G, AI, and IoT. He will also connect those to the printed and flexible electronics space, and why we should pay attention to those universal trends. Finally, he will touch on his own experiences with innovation at NovaCentrix, and consider aspects of sustaining innovation versus true disruption.

Bryan Germann

Optomec

Bryan Germann

Product Manager

Optomec
Printed Interconnects & RF Devices for High Frequency Applications

Microwave & RF devices generally are not small, cheap or lightweight. Printed electronics has an opportunity to change this stigma, enabling the creation of smaller, lower mass, cheaper and in some cases higher performance devices than current manufacturing methodologies. Enabling unique & even mainstream applications in field of defense, automotive and even consumer grade electronic devices to advance. Optomec’s Bryan Germann will share details of device geometries, characterized performance as well as materials information and reliability data in order to showcase the success of using Optomec’s Aerosol Jet printed electronics platform for developing all manner of RF devices and structures for real world applications. Primary applications will include printed 3D RF microwave circuit elements, 3D & 2.5DIC chip interconnect methodologies, even some 3D conformal, multi-layered circuitry over complex surfaces for Optomec customers.

Bryan Germann
Product Manager @ Optomec

Bio

Optomec’s Aerosol Jet technology has a unique solution to enable panel front to backside connections without glass vias or vacuum processes. Aerosol Jet’s ability to print at high resolution, down to 10 μm, and at a high aspect ratio, as high as 5mm from the substrate regardless of topology, make it the ideal solution for both manufacturing and repair of metallization on glass edges. Demonstration of high speed, high density printing of connections from the front side of a panel to the backside will be shown along with repair of existing metallization created by other methods.

Richard Kirk

PolyPhotonix

Richard Kirk

CEO

PolyPhotonix
Saving Sight With OLED Light

Bio

Whilst Richard had an early career as a successful artist based in France he is now known for his pioneering work in material science and bio-photonic medical research.
He has focused on biophotonic therapeutics to develop unique and novel approaches to the treatment of macular eye disease. The launch of the Noctura 400 Sleep Mask, a non-invasive and ground-breaking treatment for diabetic eye disease, has changed the paradigm of how this sight threatening disease is managed, it offers a cost-effective option for both late and early-stage prevention of this common but very serious complication of diabetes.

Sagi Daren

PrintCB

Sagi Daren

CEO

PrintCB
Next-Generation Multi-Functional Copper Inks

The race for Electric Vehicles (EVs) and sustainable energy resources creates big opportunities for advanced materials. Copper, although a widely used material in electronics, has not played a major role in car manufacturing, mainly due to its tendency to oxidize fast when printed, thus losing its conductivity.

PrintCB has developed a novel copper-based, materials platform that enables straightforward use of copper in various applications while maintaining stable electric and thermal conductivity. During the presentation, the technology will be reviewed alongside new solutions developed to address real-life challenges in vehicle electrification.

Zheng Cui

Printable Electronics Research Center China

Zheng Cui

Director

Printable Electronics Research Center China
Embedded Metal Mesh as Highly Transparent Conductive Film and Heaters

A hybrid printing approach is presented for making embedded metal mesh as transparent conductive film, with the lowest sheet resistance of 0.03ohm/sq. while still maintaining 86% transparency. Roll-to-roll mass manufacturing of the metal mesh transparent conductive films have been realized for touch panels which have been commercialized in a number brand name display devices. The high surface conductivity of embedded metal mesh also opened up a number other applications in addition to touch panels, such as transparent EMI shielding, transparent heating, wearable thermal healing and high density flexible circuits, etc.

Rafael Michalczuk

SWAROVSKI

Rafael Michalczuk

Senior Technology & Funding Manager

SWAROVSKI
Reinventing the Wheel? Printing (R)Evolution For A Luxury Brand

Swarovski is innovating since decades in the additive manufacturing domain and printing technologies form an important puzzle piece in the manufacturing processes. But is it now time to reinvent Gutenberg´s invention? As proof-of-concept Swarovski will showcase in the talk different innovations – ranging from additive manufacturing in jewelry, 3D glass printing to 2D/3D printed electronics applications and nano-imprint lithography in various application areas for the luxury brand.

Rafael Michalczuk
Senior Technology & Funding Manager @ SWAROVSKI

Bio

Rafael Michalczuk, Senior Technology & Funding Manager at Swarovski, is supporting research, development and innovation projects within interdisciplinary and cross-functional teams at Swarovski, especially with key enabling technologies involved (e.g. additive manufacturing, printed electronics, artificial intelligence, robotics). Additionally he is founder of the innovation & funding consulting agency InnoPotentials. In this capacity he serves a broad portfolio of clients (from startups, SMEs to large companies and R&D institutions) to develop innovative business ideas, secure funding and support the overall innovation journey of the customers.

Dávid Forgács

Saule Technologies

Dávid Forgács

Director of Knowledge Management"

Saule Technologies
First Commercial Applications of Flexible Printed Perovskite Solar Modules

Perovskite solar cell technology is fast approaching its first commercial deployment, with multiple companies working on the technology promising to offer their first products in the coming years. Conventional photovoltaic (PV) markets, such as utility scale PV, are quite rigid and very demanding for a new entrant. Perovskites offer several new value propositions, which offer monetization prospects in the near future, if properly used. In particular, functionalities such as flexibility, high specific power, and good low-light performance enable new applications and broadening of the conventional PV usage. The presentation will review the development of Saule Technologies, and demonstrate the go-to-market strategy of the company.

Dave Rice

TactoTek

Dave Rice

SVP Marketing

TactoTek
Realizing Smart Surfaces with In-Mold Electronics

Brands increasingly use electronic functions and styling to delight their customers and reflect their design language. However, conventional electronics assemblies often come with design constraints and integration challenges that limit innovation. TactoTek develops and licenses in-mold structural electronics (IMSE™) technologies that merge mechanics and electronics into smart molded structures. IMSE parts deliver electronic functions in light, thin, 3D structures that are economically mass produced and environmentally friendly. TactoTek will introduce IMSE technology, discuss functional capabilities and key processes for making IMSE parts.

Dave Rice
SVP Marketing & Business Development @ TactoTek

Bio

Dave Rice leads marketing and product management at TactoTek®. He has built a career of transforming technology innovation into high value solutions for electronics and software markets for start-ups and mature public companies. He and his team engage prospects to identify market needs aligned with TactoTek’s in-mold structural electronics (IMSE™) technology, help focus internal technology development and collaborate with ecosystem partners for a full product solution.

bottom of page