ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Electronics Packaging Symposium

4-5 November 2021
Virtual Event Platform

About the Event

This is a virtual symposium with live presentations. Binghamton University State University of New York

Topics Covered

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

Join next event on this topic

Leading global speakers include:

Full Agenda

The times below is Central European Times (CET).

On the platform the times will automatically be changed to your time zone

Coming Soon
TechBlick-favicon.png
4 November 2021

Binghamton University

Thursday

Opening Remarks

More Details

10:00am

joint-presentations.png
TechBlick-favicon_edited.png

Bahgat Sammakla

Vice President for Research

All, Semiconductor Packaging