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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Innovations Festival: Printed, Hybrid, 3D, InMold, Textile Electronics

24 June 2022
Virtual Event Platform

About the Event

This must-attend event showcases exciting and cutting-edge advances from across the world. It brings together more than 400+ participants, 45 speakers and 55+ live exhibitors. The audience is truly global, coming together across many different time zones. 


In this innovation festival, the speakers will present the latest advances and innovations in compact technology-focused 5-min speeches.  To continue the discussion, the participants can then visit the speakers in their virtual speaker corner or at their virtual booth.


This is a truly unique gathering in our special 'in-person virtual' platform. This environment is called 'in-person virtual' because it makes virtual interaction real, enabling spontaneous discussions, serendipitous meetings, and excellent networking. We promise- in many ways it is more effective and more fun than onsite in-person interactions.


Spaces are limited and will be assigned on a "first come first served" basis. Hurry up to secure your spot.

Topics Covered

R2R Nanolithography | Nano-Scale Wafer Printing | Smart Skin Patches | 3D Touch Surfaces | Quantum Dots | Stretchable Liquid Metal Inks | Jet Metallization | Laser Induced Forward Transfer | Fuel Cells | Printed Batteries | Organic Photovoltaics | R2R PCB Production | Hybrid Circuits | 3D Electronics | InMold Electronics | Smart Surfaces | Ultra Fine Line Printing | Novel Interconnect Technology | E-Textiles | Printed Displays | Printed Sensors | Printed Sensors | Innovative Paste Technologies | Smart Packaging | Additively Manufactured Electronics | OTFTs | Perovskites

Explore our past & upcoming events on this topic

Leading global speakers include:

Thanks to our sponsors, there are less than 50 FREE spots available, assigned on a first come first serve basis, for LIVE online participation. Please register now as spaces are limited and registration will close soon

Full Agenda

Coming Soon
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24 June 2022

Komori Corp

Micro bumps by gravure offset printing method

Friday

2.00PM

More Details

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Chisato Oyama

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.

All, Printed Electronics

Micro bumps by gravure offset printing method

More Details

2.00PM

We examined to utilize the gravure offset printing method to print high-precision micro bumps with various pastes.
For the flux paste, the precision of the printing position was ±5 μm on a 300 mm wafer.
We have also tried to print and reflow the solder paste.
Printing and reflow have been successful with minimum diameter of 6 μm and 15 μm, respectively.
We will report the details on the day.

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24 June 2022

Zinergy UK

Printed Batteries: Towards R2R Scale-up

Friday

2:05PM

More Details

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Dilek Ozgit Butler

Co-Founder and Chief Scientific Officer

All, Printed Electronics

Printed Batteries: Towards R2R Scale-up

More Details

2:05PM

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24 June 2022

DP Patterning

R2R FPCB production technology.

Friday

2:10 PM

More Details

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Tommy Höglund

Sales & Marketing Manager

All, Printed Electronics

R2R FPCB production technology.

More Details

2:10 PM

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24 June 2022

Leibniz Institute for New Materials

Flexible transparent conductive coatings by electrospinning

Friday

2:15PM

More Details

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Sabine Heusing

Transparent conductive coatings are widely used as transparent conductive electrodes in displays, touch screens, solar cells, antenna structures etc., and require a low sheet resistance combined with a high transmission. For wearable electronics and bendable displays, a flexibility of the electrode material is also required. Electrospinning was used as a facile method to produce very long and thin fibers, and in combination with silver, conductivity was introduced.
The properties of silver (Ag) nanoparticle-containing inks and coatings thereof, applied by electrospinning on PET and PC foil substrates were studied. The tested Ag nanoparticle-containing inks consisted of a commercial nanoparticulate silver ink and a polymeric binder in a suitable solvent. The electrospun fibers were fabricated using different spinning conditions and were then silver plated in an electroless process. The resulting coatings have been characterized with respect to their sheet resistance, transmission, and haze.
It was observed that with the electrospun polymer silver fibers, fibers with a diameter of about 1 to 3 µm and lengths of several cm could be obtained, ensuring a high percolation. By variation of the number and the diameter of the fibers, the conductivity and the optical properties could be improved, and coatings with a sheet resistance below 5 Ω/sq were obtained, showing a high transmission of up to 92 % and a low haze below 2 %.
The achieved sheet resistances in combination with the relatively high transmission are comparable to those of other transparent conductive coatings that are state of the art and available on the market, such as ITO coatings. In addition, the coatings produced by this electrospinning process are flexible and stretchable, which offers interesting new applications for wearable electronics and 3D-formable displays, for example. Other advantages of these coatings are the low-cost process for their production and the possibility of upscaling by a roll-to-roll process.

All, Printed Electronics

Flexible transparent conductive coatings by electrospinning

More Details

2:15PM

Transparent conductive coatings are widely used as transparent conductive electrodes in displays, touch screens, solar cells, antenna structures etc., and require a low sheet resistance combined with a high transmission. For wearable electronics and bendable displays, a flexibility of the electrode material is also required. Electrospinning was used as a facile method to produce very long and thin fibers, and in combination with silver, conductivity was introduced.
The properties of silver (Ag) nanoparticle-containing inks and coatings thereof, applied by electrospinning on PET and PC foil substrates were studied. The tested Ag nanoparticle-containing inks consisted of a commercial nanoparticulate silver ink and a polymeric binder in a suitable solvent. The electrospun fibers were fabricated using different spinning conditions and were then silver plated in an electroless process. The resulting coatings have been characterized with respect to their sheet resistance, transmission, and haze.
It was observed that with the electrospun polymer silver fibers, fibers with a diameter of about 1 to 3 µm and lengths of several cm could be obtained, ensuring a high percolation. By variation of the number and the diameter of the fibers, the conductivity and the optical properties could be improved, and coatings with a sheet resistance below 5 Ω/sq were obtained, showing a high transmission of up to 92 % and a low haze below 2 %.
The achieved sheet resistances in combination with the relatively high transmission are comparable to those of other transparent conductive coatings that are state of the art and available on the market, such as ITO coatings. In addition, the coatings produced by this electrospinning process are flexible and stretchable, which offers interesting new applications for wearable electronics and 3D-formable displays, for example. Other advantages of these coatings are the low-cost process for their production and the possibility of upscaling by a roll-to-roll process.

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24 June 2022

Fraunhofer IZM

E-Textiles: Adhesive Bonding for electronics integration in textiles

Friday

2:20PM

More Details

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Malte von Krshiwoblozki

Group Manager

Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics.
Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic.

All, Printed Electronics

E-Textiles: Adhesive Bonding for electronics integration in textiles

More Details

2:20PM

Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics.
Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic.

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24 June 2022

University of Coimbra

Stretchable Microchip-Integrated Electronics Based on Liquid Metal

Friday

2:25 PM

More Details

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Mahmoud Tavakoli

Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics.

All, Printed Electronics

Stretchable Microchip-Integrated Electronics Based on Liquid Metal

More Details

2:25 PM

Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics.

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24 June 2022

Fujikura Kasei

Creating Fully Stretchable Medical Devices with Silicone-based AgCl Inks

Friday

2:30PM

More Details

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David Dewey

Sales

As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes

All, Printed Electronics

Creating Fully Stretchable Medical Devices with Silicone-based AgCl Inks

More Details

2:30PM

As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes

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24 June 2022

Networking Break

Networking and Meet-the-Speaker

Friday

2.35PM

More Details

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The 'in-person virtual' networking space will open. You can mingle with the others and meet the speakers at 'speaker corners'

All, Printed Electronics

Networking and Meet-the-Speaker

More Details

2.35PM

The 'in-person virtual' networking space will open. You can mingle with the others and meet the speakers at 'speaker corners'

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24 June 2022

Fraunhofer IAP

Ultra precise EHD-Jet printing of quantum dots.

Friday

3.00PM

More Details

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Armin Wedel

Division Director Functional Polymers

All, Printed Electronics

Ultra precise EHD-Jet printing of quantum dots.

More Details

3.00PM

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24 June 2022

DoMicro

Perspectives For Electrohydrodynamic Printing On Nanoscale

Friday

3.05PM

More Details

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Aart-Jan Hoeven

Business Development Manager

DoMicro has developed a printer (the DM50-ENP) with a novel technology for printing wires with nanoscale dimensions. The technology is based on the electrohydrodynamic effect. This effect enables a submicron additive technology, in which an electric field is used for pulling an inkjet into a very narrow shape. The effect can reduce the line width from about 30 microns, as can be obtained with industrial inkjet technology, down to 1 micron or less.
Applications are in various fields, such as displays, micro fluidics, batteries and photo voltaics. The presentation highlights the opportunities in these application areas, as well as results from trials with the DoMicro printer.

All, Printed Electronics

Perspectives For Electrohydrodynamic Printing On Nanoscale

More Details

3.05PM

DoMicro has developed a printer (the DM50-ENP) with a novel technology for printing wires with nanoscale dimensions. The technology is based on the electrohydrodynamic effect. This effect enables a submicron additive technology, in which an electric field is used for pulling an inkjet into a very narrow shape. The effect can reduce the line width from about 30 microns, as can be obtained with industrial inkjet technology, down to 1 micron or less.
Applications are in various fields, such as displays, micro fluidics, batteries and photo voltaics. The presentation highlights the opportunities in these application areas, as well as results from trials with the DoMicro printer.

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24 June 2022

Coatema

The pathway to digital fabrication of printed electronic products

Friday

3:10PM

More Details

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Thomas Kolbusch

Director

All, Printed Electronics

The pathway to digital fabrication of printed electronic products

More Details

3:10PM

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24 June 2022

Keiron Printing Technologies

Digitally Printing Highly Viscous Contents with Laser-Induced Forward Transfer

Friday

3:15 PM

More Details

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Shahzad Khan

Senior Business Developer

Laser-Induced Forward Transfer could replace traditional digital printing methods such as Inkjet for printed electronics applications. Whereas materials must be tailored to Inkjet’s limited range of functionality, LIFT can work with commercially available inks typically known for screen printing. This feature reduces the cost of production and waste for a more sustainable and flexible electronics manufacturing plant.

All, Printed Electronics

Digitally Printing Highly Viscous Contents with Laser-Induced Forward Transfer

More Details

3:15 PM

Laser-Induced Forward Transfer could replace traditional digital printing methods such as Inkjet for printed electronics applications. Whereas materials must be tailored to Inkjet’s limited range of functionality, LIFT can work with commercially available inks typically known for screen printing. This feature reduces the cost of production and waste for a more sustainable and flexible electronics manufacturing plant.

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24 June 2022

Nano-Ops

The Future of Printed Electronics is Here; Print Electronic Components and ICs Using a Single Platform

Friday

3.20PM

More Details

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Ahmed Busnaina

CTO

Imagine if you can input your design and materials on one end and have your chips come out the other end using one machine? And do this on the same day as you finish the design? What if this machine could be installed in your, lab, or another secure location? We present a new purely additive manufacturing technique for nano and microscale integrated electronics systems manufacturing. This fully automated foundry-in-a-box tool takes less than 10 square meters of space and can be installed and used anywhere to ensure a secure operation independent of any semiconductor fab. The electronic development cycle would be in days instead of six to nine months, with prototyping taking a day or less. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoparticles at room temperature and atmospheric pressure. This technology can be used to make transistors, diodes, or logic gates using a purely additive (directed assembly enabled) process utilizing semiconductors, metals, and dielectric nanoparticles suspended in a liquid. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of electronics and sensors at ambient temperature and pressure on rigid or flexible substrates. The technique has been used to make transistors, inverters, diodes, logic gates, displays, all carbon electronics, and sensors at the micro and nanoscale using inorganic and organic materials.

All, Printed Electronics

The Future of Printed Electronics is Here; Print Electronic Components and ICs Using a Single Platform

More Details

3.20PM

Imagine if you can input your design and materials on one end and have your chips come out the other end using one machine? And do this on the same day as you finish the design? What if this machine could be installed in your, lab, or another secure location? We present a new purely additive manufacturing technique for nano and microscale integrated electronics systems manufacturing. This fully automated foundry-in-a-box tool takes less than 10 square meters of space and can be installed and used anywhere to ensure a secure operation independent of any semiconductor fab. The electronic development cycle would be in days instead of six to nine months, with prototyping taking a day or less. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoparticles at room temperature and atmospheric pressure. This technology can be used to make transistors, diodes, or logic gates using a purely additive (directed assembly enabled) process utilizing semiconductors, metals, and dielectric nanoparticles suspended in a liquid. The nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of electronics and sensors at ambient temperature and pressure on rigid or flexible substrates. The technique has been used to make transistors, inverters, diodes, logic gates, displays, all carbon electronics, and sensors at the micro and nanoscale using inorganic and organic materials.

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24 June 2022

Networking Break

LIVE Exhibition OPENS

Friday

3.25PM

More Details

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LIVE exhibition space opens. You can visit the exhibiting companies live to mingle with them
Exhibiting companies will come from TechBlick exhibitors and sponsorsMeta | NovaCentrix | Panasonic | Agfa | Brewer Science | Brilliant Matters | Coatema | DuPoint Teijin Films | DuPont | Binder ITZ | IDS | McDermid Alpha | Neotech AMT | Nippin Kayaku | Quad Industries | Sunray Scientific | Holst Centre | VTT | XTPL | ACTI Materials | Asada Mesh | Applied Materials | Asahi Kasei | BeLink Solutions | Chasm | CPI | Cond Align | Copprint | Danish Technological Institute | DoMicro | e2IP | Elantas | Kodak | East Print | Electroninks | Epishine | Fraunhofer IAP | Front Edge | Fujifilm | Fujikura Kasei | GIS | Hamamatsu | Henkel | InnovationLab | Jet Metal | Joanneum Research | Kimoto | Keiron | Liquid Wire | Nagase Chemtex  Nani Ops | Rise | Panacol | Noctiluca | Raymore | Safi-Tech | Sateco XT | Sefar | Seriestampa | Sheldahl | Smartkem | Versarien | Ynvisible

All, Printed Electronics

LIVE Exhibition OPENS

More Details

3.25PM

LIVE exhibition space opens. You can visit the exhibiting companies live to mingle with them
Exhibiting companies will come from TechBlick exhibitors and sponsorsMeta | NovaCentrix | Panasonic | Agfa | Brewer Science | Brilliant Matters | Coatema | DuPoint Teijin Films | DuPont | Binder ITZ | IDS | McDermid Alpha | Neotech AMT | Nippin Kayaku | Quad Industries | Sunray Scientific | Holst Centre | VTT | XTPL | ACTI Materials | Asada Mesh | Applied Materials | Asahi Kasei | BeLink Solutions | Chasm | CPI | Cond Align | Copprint | Danish Technological Institute | DoMicro | e2IP | Elantas | Kodak | East Print | Electroninks | Epishine | Fraunhofer IAP | Front Edge | Fujifilm | Fujikura Kasei | GIS | Hamamatsu | Henkel | InnovationLab | Jet Metal | Joanneum Research | Kimoto | Keiron | Liquid Wire | Nagase Chemtex  Nani Ops | Rise | Panacol | Noctiluca | Raymore | Safi-Tech | Sateco XT | Sefar | Seriestampa | Sheldahl | Smartkem | Versarien | Ynvisible

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24 June 2022

Joanneum Research

R2R-NIL for realizing highly innovative use cases – from bionics to medical diagnostics

Friday

3:45PM

More Details

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Gregor Scheipl

Marketing Business Development Executive

Imprint lithography is a versatile technology for the replication of micro- and nanostructures. It is widely used in high-tech areas such as optics, electronics, photovoltaics, sensor technology, in the medical field ("lab-on-chip") or in surface finishing.
As a European pioneer, JOANNEUM RESEARCH Forschungsgesellschaft mbH operates a roll2roll (R2R) UV coating and imprinting system since 2010 and is developing and using resins that are biodegradable and thus sustainable. Required structures can be produced on a meter-per-minute scale, similar to newspaper printing. With a strong focus on the product, processes are developed and optimized for:
(i) Environmentally friendly production of high-resolution conductive structural elements for organic electronics (fine conductor paths, nanoscale electrodes for organic transistors)
(ii) Precise production of optical 2.5D structures for the management of light in films (coupling and decoupling, light conduction) for applications in photonics
(iii) Large-scale realization of 3D-structured bionic surfaces and complex nanostructures that make effects from nature technically usable (shark skin, lotus effect, gecko effect, structural colors)
(iv) Cost-effective production of complex microfluidic elements in foil as the basis of biosensors for lab-on-foil analysis systems
(v) Continuous production of refined high-tech film surfaces for packaging, decoration, security and labelling, which have improved optical, mechanical and chemical properties due to micro- and nanostructure

All, Printed Electronics

R2R-NIL for realizing highly innovative use cases – from bionics to medical diagnostics

More Details

3:45PM

Imprint lithography is a versatile technology for the replication of micro- and nanostructures. It is widely used in high-tech areas such as optics, electronics, photovoltaics, sensor technology, in the medical field ("lab-on-chip") or in surface finishing.
As a European pioneer, JOANNEUM RESEARCH Forschungsgesellschaft mbH operates a roll2roll (R2R) UV coating and imprinting system since 2010 and is developing and using resins that are biodegradable and thus sustainable. Required structures can be produced on a meter-per-minute scale, similar to newspaper printing. With a strong focus on the product, processes are developed and optimized for:
(i) Environmentally friendly production of high-resolution conductive structural elements for organic electronics (fine conductor paths, nanoscale electrodes for organic transistors)
(ii) Precise production of optical 2.5D structures for the management of light in films (coupling and decoupling, light conduction) for applications in photonics
(iii) Large-scale realization of 3D-structured bionic surfaces and complex nanostructures that make effects from nature technically usable (shark skin, lotus effect, gecko effect, structural colors)
(iv) Cost-effective production of complex microfluidic elements in foil as the basis of biosensors for lab-on-foil analysis systems
(v) Continuous production of refined high-tech film surfaces for packaging, decoration, security and labelling, which have improved optical, mechanical and chemical properties due to micro- and nanostructure

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24 June 2022

META (Metamaterial)

Multifunctional metasurfaces for everyday printed electronic functional films

Friday

3:50PM

More Details

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Jonathan Waldern

Chief Technology Officer

Meta Materials Inc. is developing discrete platform specific proprietary technologies for large-surface-area lithography, allowing the manufacture of nanostructures to be carried out in a cost-effective manner. Each platform employs a massively parallel patterning scheme, designed to be scalable to large areas of either rigid substrate materials and rolls of flexible films. In certain cases we use a phase-shift mask approach and in others, cast plasmonic printing – all allowing the creation of structures with feature sizes down to 50 nm.

All, Printed Electronics

Multifunctional metasurfaces for everyday printed electronic functional films

More Details

3:50PM

Meta Materials Inc. is developing discrete platform specific proprietary technologies for large-surface-area lithography, allowing the manufacture of nanostructures to be carried out in a cost-effective manner. Each platform employs a massively parallel patterning scheme, designed to be scalable to large areas of either rigid substrate materials and rolls of flexible films. In certain cases we use a phase-shift mask approach and in others, cast plasmonic printing – all allowing the creation of structures with feature sizes down to 50 nm.

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24 June 2022

PulseForge

Use of Photonic Soldering to Enable High Quality Connections on Temperature Sensitive Substrates

Friday

3:55PM

More Details

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