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Flexible thin film transistors (TFT) attract a lot of attention due to its applicability to foldable smartphones, IoT sensors, and photodetectors. For this application, organic TFT had been regarded as a most promising candidate thanks to its soft nature of the component materials. However, organic TFT suffers from its low mobility, poor stability and immature production process.
In this talk, we would like to introduce our highly bendable IGZO TFT. Without employing the neutral plane concept, the TFT can withstand one million times bending tests at a curvature radius of 1 mm for the first time. After one million times bending tests, any noticeable deterioration in device characteristics are not observed. We see a big potential for the application for flexible sensor devices.

Functional integration requires more and more interconnects to be realized in smallest space. 3D-MID offers solutions meeting both interconnect and space requirements.

The 3D-MID technology is currently in a phase of transformation; it just makes the jump from the usual conductor track widths of 100 to 200 micro-meters in the direction of 10 to 20 micro-meters. 100 to 10 isn’t an improvement, that’s a giant leap. This leap will allow to use 3D-MID on Chip- and IC-Substrate level for mass production and at lower costs.

The current status and new developments of 3D-MID technology at Sunway Communication will be shown in this presentation"

Elephantech Inc. is a start-up that manufactures and sells Flex PCB that are manufactured in an environmentally friendly manner by utilizing inkjet printing and copper plating under the mission of “Making the world sustainable with new manufacturing technologies”.
Moving forward, we will work not only on Flex PCB manufacturing but also on printing a wide variety of functions such as 3D wiring formation or sensor production through a method in which digital data is used to layer various materials only on necessary parts.
We will realize a sustainable future by spreading our environmentally friendly technology that has been optimized by digital technologies.

In this presentation, I would like to introduce our newly developed interconnections using nickel nano-ink, show the progress of EMI shield manufacturing technology for electronic components, and present the results of our fine-line fabrication trials combined with laser ablation and optical patterning.

Plastronics is a new branch of the electronics industry, setting the electronic circuitry directly at the surface of plastic parts, or inside its structure.
The different processes of the plastronics (LDS, 2K molding, IME, …) gives possibilities to designers and engineers, depending upon the kind of application: antenna, HMI, lighting, sensors etc.
For customers and users, it permits new experience: surfaces, shapes, and aspects.
After highlighting some key manufacturing processes and their possibilities and limits, this presentation will show potential or existing applications. As a conclusion, we will raise some key challenges and hard points the plastronics is facing, such standardization, recycling, …

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While stretchable electronics is most commonly realized by printing, this presentation shows an alternative approach using proven elastomer molding technology. The design and manufacturing of a soft capacitive sensor is shown which can continuously measure both touch and compressive force. It can be shaped three-dimensionally, and is suitable for various applications such as automotive, VR, AR, gaming, robotics, medical technology and general industry.

The sensor is made of silicone. It's footprint and dimensions can be freely designed. This enables an ergonomic design of input devices, prostheses and exoskeletons both on small and large surfaces. Silicone is gentle on the skin, and is chemical and temperature-resistant with regard to food.

Validation of the sensor is performed by durability tests including up to 500,000 load cycle and rough environmental conditions of +85°C and -40°C. Various use cases towards commercial use are under way, of which some can be communicated here. Samples including evaluation electronics are available in a starter kit and enable a quick and uncomplicated start into the new technology for everyone.

Piezoelectric polymers are the most promising electroactive materials with outstanding properties that can be integrated into a variety of flexible electronic devices. Their multifunctional capabilities, bending ability, ease of processing and chemical stability make them attractive for applications in sensors, actuators and energy harvesting. At Arkema, we synthesize piezoelectric fluoropolymers under the name Piezotech that offer endless possibilities to revolutionize our daily lives and make real advances in the electronics, medical, automotive and smart surfaces industries.
The presentation will provide an overview of Piezotech products and their capabilities with a focus on main applications.

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Smart packages as Enablers of digital therapy adherence
· Scaling up from manual to industrialized R2R manufacturing processes
· Standardized and highly efficient production platform for smart packages
· Most flexible designs for smart package solutions
· Smart packages as enablers of digital treatment adherence
· Establishing of a complete adherence monitoring system
· Starter Kit for PoCs and first pilot projects

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