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Nextflex
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About
NextFlex, together with our members, recognize that the Hybrid Electronics technology base presents critically important opportunities for U.S. manufacturing. Novel additive technologies are significant and complementary to current advanced packaging trends. Additive technologies can facilitate convergence between advanced packaging and circuit board manufacturing, enabling further miniaturization and system level integration. A diverse and interdisciplinary effort, including novel approaches like additive electronics, is required for the U.S. to lead in the next generation of semiconductor packaging.
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This page was last updated:
8 January 2026
