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Additive Electronics in Semiconductor Packaging and PCBs

29-30 March 2023
11:30am - 8pm

CET:

Virtual Event
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Confirmed speakers:
NASA
SAULE Technologies
Ntrium
Trinity College Dublin
University of Michigan
Nanyang Technological University
Celanese Micromax Microcircuit and Component Materials
IMTEK - University of Freiburg
Elephantech
Exaddon
Fraunhofer ENAS
University of Montreal
TCL Corporate Research
Syenta
NRCC
Fraunhofer IKTS
FUJI CORPORATION
Centre de Transfert de Technologies Ceramiques
FTMC
ImageXpert
Essemtec AG
Electroninks
Grenoble INP-Pagora
Domicro
XTPL S.A.
ETSMTL
Hummink
Seoul National University
Dracula Technologies
Quantica
HighLine Technology
North Carolina State University
Lithoz
Humboldt-Universität zu Berlin -
University of Texas
Fraunhofer IAP
Notion Systems
J.A.M.E.S GmbH
Aix-Marseille Université
Neotech AMT
Cicor Group
University Paris Cité

TechBlick’s event on 29-30 March 2023 focuses on all additive technologies used and/or suited to prototyping and manufacturing of semiconductor packaging - from sub-micro to macro scale - from low-frequency to mmWave - from 2D to 2.5D and 3D.


Additive electronics can not only replace subtractive processes based on cost and green credentials but can also enable truly novel designs, components, and manufacturing processes in semiconductor packaging and PCBs.


In this unique conference - colocated online with TechBlick’s event “Digital & 3D Additive Manufacturing of Electronics, Displays, Photovoltaics, and Beyond” - you will learn about all the key additive electronics technology - both mature and emerging ones and both prototyping and manufacturing ready ones - being developed and/or deployed for various use cases in the semiconductor packaging and PCBs industries


The applications covered are numerous covering EMI shielding, HTCC/LTCC printing, wirebond replacement, solder mask, on-demand PCB production, 2.5-3D circuits, novel component geometries and designs, mmWave and 5G circuits, etching masks, post-production repair, multi-layer interpose development and beyond. 

Themes: Inkjet | Aerosol | Electrohydrodynamic Printing | Advanced Dispensing | 3D Printing | LIFT | Digital Plating | Direct Wire | Robotic Platforms | Ink-Less Printing | Path Planning and Control | Selective Jetting | 3D Printed Electronics | PCB Production | Semiconductor Packaging | EMI Shielding | Microwave and mmWave Devices | Semiconductor Production | Wirebond Replacement | 2.5-3D circuits | On-Demand PCB Prototyping | LDS | MID | Selective Metallization | Multilayer Interposers | HTCC/LTCC, and beyond

In the parallel conference, you will also hear about digital and 3D printing in Lighting, Photovoltaics | Photodetectors | Quantum Dots | QLEDs | OLED-QLED | MicroLEDs | Batteries | and Many More

Full Agenda

The times below is Central European Times (CET). On the platform the times will automatically be changed to your time zone
Track 1
Track 2

CONTACT US

KGH Concepts GmbH

Mergenthalerallee 73-75, 65760, Eschborn

+49 17661704139

chris@techblick.com

TechBlick is owned and operated by KGH Concepts GmbH

Registration number HRB 121362

VAT number: DE 337022439

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