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Digital & 3D Additive Manufacturing of Electronics, Sensors, Photovoltaics, Displays, etc

29-30 March 2023
11:30am - 8pm

CET:

Virtual Event
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Confirmed speakers:
NASA
SAULE Technologies
Ntrium
Trinity College Dublin
University of Michigan
Nanyang Technological University
Celanese Micromax Microcircuit and Component Materials
IMTEK - University of Freiburg
Elephantech
Exaddon
Fraunhofer ENAS
University of Montreal
TCL Corporate Research
Syenta
NRCC
Fraunhofer IKTS
FUJI CORPORATION
Centre de Transfert de Technologies Ceramiques
FTMC
ImageXpert
Essemtec AG
Electroninks
Grenoble INP-Pagora
Domicro
XTPL S.A.
ETSMTL
Hummink
Seoul National University
Dracula Technologies
Quantica
HighLine Technology
North Carolina State University
Lithoz
Humboldt-Universität zu Berlin -
University of Texas
Fraunhofer IAP
Notion Systems
J.A.M.E.S GmbH
Aix-Marseille Université
Neotech AMT
Cicor Group
University Paris Cité

TechBlick’s event on 29-30 March 2023 focuses on all technology and applications aspects of digital and 3D additive manufacturing electronics. It is a unique curated event covering the full spectrum of manufacturing technologies, frontier innovations, and existing and emerging applications from around the world. The event uniquely brings together material suppliers, technology developers, equipment manufacturers, and OEMs. 


On the technology front we will cover all the key technologies of the present and future including inkjet, microdispensing, direct wiring, direct plating, aerosol, jetting and spraying, aerosol, electrohydrodynamic printing, laser induced forward transfer, etc.


The technology will be covered for both flat 2D, 2.5, and even free form 3D printing on complex 3D objects. The agenda will cover printing of all manners of functional materials including conductive materials, ceramics, quantum dots, OLEDs, high--frequency insulators, 

PEDOT, organic semiconductor, solder resist, high viscosity pastes, and many more.


On the application side we seek to cover most key existing and emerging applications including photovoltaics, mmWave devices, OLEDs, QD-OLED, QLEDs, photodetectors and LEDs, quantum dots, antennas, functional 3D devices, circuits, PCBs, EMI shielding, semiconductor packaging, microLEDs, batteries, and beyond. 


This conference focuses also on  advancing the art, addressing long-standing technical limitations, and pushing forward manufacturing technologies. It is a must-attend event for those interested in digital and 3D additive manufacture of electronics.

Themes: Inkjet | Aerosol | Electrohydrodynamic Printing | Advanced Dispensing | 3D Printing | LIFT | MID | LDS | Selective Plasma | Digital Plating | Direct Wire | Robotic Platforms | Ink-Less Printing | Path Planning and Control | Selective Jetting | Lighting | 3D Printed Electronics | PCB Production | Semiconductor Packaging | EMI Shielding | Microwave and mmWave Devices | Semiconductor Production | Photovoltaics | Photodetectors | Quantum Dots | QLEDs | OLED-QLED | MicroLEDs | Circuit and/or PCB Design and Prototyping | Ceramic (HTCC/LTCC) | Batteries | and Many More

Full Agenda

The times below is Central European Times (CET). On the platform the times will automatically be changed to your time zone
Track 1
Track 2

CONTACT US

KGH Concepts GmbH

Mergenthalerallee 73-75, 65760, Eschborn

+49 17661704139

​chris@techblick.com

TechBlick is owned and operated by KGH Concepts GmbH

Registration number HRB 121362

VAT number: DE 337022439

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