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ALL PAST & FUTURE EVENTS AS WELL AS MASTERCLASSES WITH A SINGLE ANNUAL PASS

Electronics Packaging Symposium

4-5 November 2021
10am - 5pm

CET

Virtual Event

This is a virtual symposium with live presentations. Binghamton University  State University of New York

This event will be available as on-demand talks only. This was originally organized by the Integrated Electronics Engineering Center (IEEC) of Binghamton University. Topics covered include Future of Semiconductor Technology | Heterogeneous Integration | AI Hardware | Supercomputers | Quantum Computing | On-Package Integration | Panel Level Packaging | Chiplets and Die Block Assembly | 5G Architectures and Packaging| Materials for Neuromorphic Computing | Photonic Packaging | Printed Microwave Packaging | Future of Semiconductors | High Density Fan-Out Packages | Chiplets and SiP | Liquid Metal | 3D Printed Electronics | Printed Electronics | Energy Storage E-Textiles | Interconnects and Die Attach Technologies | Scaling in interconnects | E-Textiles | Wearable Sensors

Leading global speakers include:
GE Research
ASE
NC State University
NC State University
University at Buffalo
Fraunhofer IZM
IBM Research
HP Labs
Intel
GE Research
Fraunhofer IZM
Tampere University of Technology
Raytheon Missiles and Defense Systems
Prismark Partners
NSWC Crane Division
NSWC Crane Division
Rochester Institute of Technology
Binghamton University
Lockheed Martin
Defense Advanced Research Projects Agency (DARPA)
Auburn
IBM
University of Minnesota
Corning Incorporated
Griffis AF Base
SUNY Polytechnic Institute
Binghamton University
Łukasiewicz - ITR
ASE
US Army Research Laboratory
IBM
Georgia Institute of Technology
Binghamton University
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Full Agenda

The times below is Central European Times (CET).
On the platform the times will automatically be changed to your time zone

Track 1
Track 2
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