MC 2: Enabling solutions for mass-transfer of microLEDs

Manufacturing microLED-based displays involves the precise assembly of millions of pixels onto a backplane. For a 4K display, approximately 20 million microLEDs must be accurately positioned and bonded to the target substrate. The display technology is highly demanding, as even a single malfunctioning pixel can be noticeable to the end user. Effectively handling a large quantity of small microLED chips while maintaining accuracy across expansive display areas poses a significant manufacturing challenge. The challenge lies in handling a large quantity of small microLED chips while maintaining accuracy across expansive display areas. With many distinct components, achieving a high yield is crucial to delivering a fully operational microLED display. Therefore, developing a transfer method for assembling microLED displays that is both rapid and precise on an industrial scale while enabling efficient rework is paramount. Various innovative solutions, pushing the boundaries of what is possible, have been developed by the academic community and industry, falling into two broad categories: mass-transfer technology and monolithic integration, each presenting unique advantages and challenges.

In this masterclass, we will delve into an overview of prevalent and advanced mass transfer technologies, including micro-transfer printing, diverse laser-assisted transfer techniques, and fluid self-assembly approaches, will be provided. A comparative analysis will be conducted to assess the advantages and challenges of these technologies, focusing on transfer throughput and yield, compatibility with manufacturing full-color displays, and enabling cost-effective rework.