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Conductive Inks in printed and additive electronics: Copper inks, low-T sintered nano silver, high-temperature pastes, stretchable inks, etc

In this newsletter, you can learn about the following technologies in the field of printed electronics, additive electronics and conductive inks and conductive pastes. We will have the opportunity to download the full slides.


  1. Copprint | Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics

  2. Namics Technologies Inc | Low-temperature sintering nano silver paste

  3. Elantas | Overview Of ELANTAS High Potential Functional Inks And Application Cases

  4. Celanese Micromax | Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

  5. ACI Materials | Breakthrough Conductivity and Sensing With Semi­-Sintered Silver Ink

 

The Future of Electronics RESHAPED Europe is the flagship TechBlick event. This event will take place at the Estrel Hotel and Convention Center (ECC) in Berlin on 23-24 October 2024. Explore the preliminary agenda here.


Future of Electronics RESHAPED Conference and Exhibition covering Additive Electronics and Conductive Inks and Printed Electronics
 

1. Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics

Copprint | April 2024


In these slides you will learn about the following:

  • Background to the history behind calling PCBs "Printed" Circuit Boards

  • Example of the first printed conductive line

  • Printed proximity fuses in 1943!

  • Disadvantages of etched Cu

  • Advantages of printed copper for PCBs

  • Comparing printed silver vs printed copper

  • Application examples include RFID tags, IBC Si solar cells, greener double-sided PCBs with printed copper lines and vias

  • Benchmarking Copprint's screen printable copper inks on various substrates (PET, PC, FR4, PV, Glass, Aluminium PI, etc=vs other silver inks on the basis of conductivity vs sintering time.



Conductive Copper Inks Enabling Sustainable PCBs and Printed Electronics  Copprint | April 2024  In these slides you will learn about the following:  Background to the history behind calling PCBs "Printed" Circuit Boards   Example of the first printed conductive line   Printed proximity fuses in 1943!   Disadvantages of etched Cu   Advantages of printed copper for PCBs   Comparing printed silver vs printed copper   Application examples include RFID tags, IBC Si solar cells, greener double-sided PCBs with printed copper lines and vias    Benchmarking Copprint's screen printable copper inks on various substrates (PET, PC, FR4, PV, Glass, Aluminium PI, etc=vs other silver inks on the basis of conductivity vs sintering time.

Future of Electronics RESHAPED Conference and Exhibition covering Additive Electronics and Conductive Inks and Printed Electronics

 

2. Low-temperature sintering nano silver paste

Namics Technologies Inc |  December 2022


In this presentation you will learn the following:

  • Low-temperature sintering pastes based on nanosilver

  • Technical features including sintering conditions, viscosity, printing width, resistivity, adhesion, thickness, flex test, shelf life, etc

  • Sinterability and conductivity of sintering paste vs conventional Ag pastes (comparing resistance and particle packing)

  • Flex resistance (resistance change with bending cycle with repeated bending at various radii of curvature)

  • Adhesion results on PC, PET, PI, CNT Film, ITO Film, etc

  • Screen printing results

  • Fineline printing (60um lines)

  • Reliability tests

  • Detailed application example: Heaters

  • Results of printed heaters (temperature vs voltage, uniformity, stability, etc)



Low-temperature sintering nano silver paste  Namics Technologies Inc |  December 2022  In this presentation you will learn the following:  Low-temperature sintering pastes based on nanosilver   Technical features including sintering conditions, viscosity, printing width, resistivity, adhesion, thickness, flex test, shelf life, etc   Sinterability and conductivity of sintering paste vs conventional Ag pastes (comparing  resistance and particle packing)   Flex resistance (resistance change with bending cycle with repeated bending at various radii of curvature)   Adhesion results on PC, PET, PI, CNT Film, ITO Film, etc    Screen printing results  Fineline printing (60um lines)   Reliability tests   Detailed application example: Heaters   Results of printed heaters (temperature vs voltage, uniformity, stability, etc)   Download Presentation Slides
Future of Electronics RESHAPED Conference and Exhibition covering Additive Electronics and Conductive Inks and Printed Electronics


3. Overview Of ELANTAS High Potential Functional Inks And Application Cases

Elantas |  June 2023


In this presentation you can learn the following:

  • Printed heaters on 3D thermoformed smart surfaces made with InMold Electronics

  • Processing parameters and properties of various formable inks including silver, insulating and carbon inks

  • Results: Adjusting conductivity of heater inks with graphite loading

  • Screen printable inks (conductive + insulating) for HIGH TEMPERATURE applications on substrates like Kapton



Overview Of ELANTAS High Potential Functional Inks And Application Cases  Elantas |  June 2023  In this presentation you can learn the following:  Printed heaters on 3D thermoformed smart surfaces made with InMold Electronics   Processing parameters and properties of various formable inks including silver, insulating and carbon inks   Results: Adjusting conductivity of heater inks with graphite loading   Screen printable inks (conductive + insulating) for HIGH TEMPERATURE applications on substrates like Kapton
Future of Electronics RESHAPED Conference and Exhibition covering Additive Electronics and Conductive Inks and Printed Electronics

 

4. Silver Sintering Pastes - Improved Bond Performance and Simplified Handling

Celanese Micromax | October 2023


In this presentation, you will learn about sintering pastes, especially for power electronic applications. In particular, you can learn the following:

  • A short introduction to wide bandgap semiconductors

  • SiC power inverters and how silver paste sintering is used on Si MOSFET power devices

  • Processing conditions from stencil printing to drying to sintering

  • Process flexibility including impacts of pressure, temperature, time, etc

  • Paste properties including solid content, viscosity, particle size, volume resistivity, thermal conductivity, etc

  • Cross-sectional SEM images of sintered surfaces

  • Reliability results and stability data

  • Working time on screen under various conditions

  • Properties after drying



Silver Sintering Pastes - Improved Bond Performance and Simplified Handling  Celanese Micromax | October 2023  In this presentation, you will learn about sintering pastes, especially for power electronic applications. In particular, you can learn the following:  A short introduction to wide bandgap semiconductors   SiC power inverters and how silver paste sintering is used on Si MOSFET power devices   Processing conditions from stencil printing to drying to sintering  Process flexibility including impacts of pressure, temperature, time, etc   Paste properties including solid content, viscosity, particle size, volume resistivity, thermal conductivity, etc   Cross-sectional SEM images of sintered surfaces  Reliability results and stability data   Working time on screen under various conditions   Properties after drying

Future of Electronics RESHAPED Conference and Exhibition covering Additive Electronics and Conductive Inks and Printed Electronics

 

5. Breakthrough Conductivity and Sensing With Semi­-Sintered Silver Ink

ACI Materials |  April 2024


In this presentation, you can learn about semi-sintered silver inks including:

  • Ability to use finer meshes with 20um openings

  • Application in additively manufactured PCBs as a replacement for etched Cu



Breakthrough Conductivity and Sensing With Semi­-Sintered Silver Ink  ACI Materials |  April 2024  In this presentation, you can learn about semi-sintered silver inks including:  Ability to use finer meshes with 20um openings  Application in additively manufactured PCBs as a replacement for etched Cu
Future of Electronics RESHAPED Conference and Exhibition covering Additive Electronics and Conductive Inks and Printed Electronics


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