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Day 1 | 23 October

Keynote Presentations - Track 1 - Estrel Hall A
TechBlick
Khasha Ghaffarzadeh

TechBlick

Khasha Ghaffarzadeh

Welcome & Introduction

9:05 AM

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Forvia
Damien Bouisset

Forvia

Damien Bouisset

Strategy for interiors using printing electronics

9:10 AM

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Printed Electronics & In-Mold Electronics are two technologies with strong potential benefits for the automotive industry.

FORVIA and its Interior Business Group is investigating how to use this techno for different use cases, functionalizing standard interior plastic based components and bringing more value to their customers.

Interior Lighting is one of the most fast growing segment where new technologies such as Printed Electronics & IME enable to embed lighting elements to IP and DP.

However, there is still technical challenges to over come for those technologies to become a standard and replace existing solutions.

NextFlex
Scott Miller

NextFlex

Scott Miller

Hybrid Electronics Innovations and Ecosystem: A U.S. Perspective

9:30 AM

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Hybrid electronics are at an inflection point, with products currently on the market that rely on this manufacturing paradigm, many products in late-stage development, and even more opportunities poised to take-off. Applications in medical, aerospace, and consumer electronics, structurally integrated systems, and advanced packaging are all rapidly moving forward. As the U.S. Manufacturing Innovation Institute focused on Hybrid Electronics, NextFlex convenes a broad ecosystem of companies, universities, and government partners to advance technology, create and mature domestic manufacturing capabilities, and support the education and training of the workforce for this manufacturing sector. This talk will describe the Institute’s approach to carrying out its mission, provide examples of technical projects, and offer perspectives on exciting new opportunities for the ecosystem.

Air Force Research Laboratory
Christopher Tabor

Air Force Research Laboratory

Christopher Tabor

Liquid Metal Inks for Printed Stretchable Electronics

9:50 AM

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Liquid metal technologies are progressing at an increasing rate, opening up new capabilities, applications, and functionality at smaller dimensions. Most composite and thin film printed conductors must be geometrically engineered to tolerate excessive strain and remain conductive; however, liquid conductors take the volume of their encapsulation. Gallium specifically is of interest here as it forms its own insulating casing that allows it to be patterned at fine features and to generate stable colloidal suspensions used as inks for printing. Additionally, liquid gallium alloys are ideal for many of the extreme environments in which flexible hybrid electronics are being asked to operate, to include extreme mechanical loads as well as extreme cold and space conditions. In this talk, I will discuss the work done at the Air Force Research Laboratory within my group to understand the fundamental nature of gallium alloys used for stretchable electronics and how we have designed them to be used as a drop in replacement for more traditional printed electronic inks (e.g. silver, carbon) to be processed using screen printing, blade coating, extrusion, and material jetting techniques. While it is fairly straightforward to generate suspended gallium alloy particles in solution, the work that our team has done to engineer the surfaces of these particles, understand the thin oxide shell growth dynamics, control the oxide composition, and correlate these properties to mechanical properties that effect the final mechanically sintered conductive traces will be discussed. A few select applications will be briefly discussed, including soft electrodes for long term physiological monitoring, actively heated textiles, and stretchable data cables utilized in soft robotic inspection tools.

Yole Group
Gabriela Pereira

Yole Group

Gabriela Pereira

Advanced Packaging at a Glance: Market Trends, Technology, and Challenges

10:10 AM

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The advanced packaging market is rapidly gaining a larger share of the semiconductor packaging industry, with an expected growth rate of 12.9% CAGR over the next five years. This growth is primarily driven by the rise of generative AI and HPC megatrends. As system requirements for high performance increase, the semiconductor industry is exploring innovative manufacturing approaches, such as additive manufacturing, to enhance packaging density, thermal management, and cost-effectiveness. This presentation will provide an overview of the advanced packaging market and technology trends, highlighting new additive manufacturing techniques in the advanced packaging sector. Additionally, it will explore Europe's efforts to bolster its R&D capabilities and expand its manufacturing capacity.

Exhibition & Refreshment Break

10:30 AM

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Exhibition & Refreshment Break

10.30AM

Track 1
Flexoo
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Flexoo

Novel printed pressure sensors for mass customization.

11:20 AM

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Jean-Nicolas Tisserant

Jean-Nicolas Tisserant

Printed pressure sensors have been widely employed and mass-produced for several decades now. They find applications for example in medical applications, inventory control, video games, robotics, and athletic apparel and sports equipment. Most of these sensors are based on force sensing resistors (FSR), typically polymer-carbon or polymer-metal composite materials whose electrical resistance decreases with applied pressure. FSR-based sensors still suffer from strong limitations in terms of performance, regarding the ability to calibrate them towards quantitative pressure measurement. Such sensors are subject to two common errors which affect their accuracy and repeatability, hysteresis and drift. These are typically still so high that a quantitative measurement of weight and weight distributions using currently produced FSR sensors remains extremely challenging. We developed a novel, patented, FSR sensor configuration to overcome both hysteresis and drift to a very large extent, compared to competing FSR sensors with this new sensor, we can for the first time propose calibrated FSR-based printed pressure sensors in the range 1-103 N/cm2 with an accuracy of some %, depending on the pressure applied. This sensor configuration not only improves drastically the sensor performance but also loosens the alignment requirements between the two parts of the FSR sensors. These new sensors allow a tremendous number of applications in the field of quantitative pressure measurement. We illustrate their benefits in the form of a printed personal scale, a quantitative pressure mapping system for electric vehicle battery monitoring as well as other large-scale applications in logistics. These best-in-class sensors are printed continuously on a roll-to-roll machine, with loose alignment constraints, making them very competitive in terms of costs and manufacturing volumes.

Novel printed pressure sensors for mass customization.

11:20 AM

Beckermus Technologies
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Beckermus Technologies

Challenges of interconnections between chips and flex substrates

11:40 AM

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Aviv Ronen

Aviv Ronen

In this lecture I will give a short intro to bare die chips and their different interfaces to the outer world like mechanical interface, electrical interface, thermal interface and more. Some slides about different technologies of mounting chips to flexible substrates will be presented such as using wire bond, solder and electrical adhesives. In the last part of the lecture I’ll give some daily examples of challenges in implementing these interfaces between the chips and flexible substrates.

Challenges of interconnections between chips and flex substrates

11:40 AM

Avery Dennison Smartrac
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Avery Dennison Smartrac

Green Printing in the Digital Landscape - from fab to mass production

12:00 PM

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Tiina Vuorinen

Tiina Vuorinen

Green Printing in the Digital Landscape - from fab to mass production

12:00 PM

SPGPrints
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SPGPrints

The 3 C’s of de-risking industrialized Printed Electronics production

12:20 PM

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 Tom Overgoor

Tom Overgoor

In this talk we will take you through the journey of scaling up Printed Electronics production along the 3 C’s of de-risking industrialized production: Cost, Capacity and Certainty. Using real-life customer cases we will dive into the technical and application-design decisions you need to make to ensure steady and predictable production. We will share some of our experiences with finding the right balance between pattern design, inks, substrate and choosing the correct production method. Once the functionality of the application is proven, there are several scenarios to scale up to full production. We will explain how to choose the best scenario for your business while minimizing risk.

The 3 C’s of de-risking industrialized Printed Electronics production

12:20 PM

db-matik
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db-matik

From Printtronic to Assembly on Flex

12:40 PM

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Rafael M

Rafael M

db-matik AG offers turnkey production lines for the manufacturing of electronics on flexible substrates. Our portfolio includes printing lines and assembly lines that cover the entire production process – from printing circuits on films to component placement. Additionally, we provide comprehensive testing and singulation solutions to ensure the highest quality and efficiency. With our expertise and customized solutions, we support our clients in realizing innovative products in the field of printed electronics.

From Printtronic to Assembly on Flex

12:40 PM

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Lunch & Exhibition Break

1:00 PM

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Lunch & Exhibition Break

1:00 PM

Motherson Innovations
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Motherson Innovations

From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces

2:30 PM

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Thomas Nugraha

Thomas Nugraha

From Heating to Transparent Sensing to Lighting Elements in Smart Surfaces

2:30 PM

Würth Elektronik Group
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Würth Elektronik Group

State of the art of the industrial stretchable PCB and its potential for future development

2:50 PM

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Stefan Bendig

Stefan Bendig

In this lecture a short overview of the state of the art of the industrial stretchable PCB will be given.Starting with the basics of the stretchable printed circuit board, through its material properties to the basic design rules and possible applications. The conclusion is formed by further development possibilities that are currently being investigated in research projects.

State of the art of the industrial stretchable PCB and its potential for future development

2:50 PM

Metafas
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Metafas

Printing Electronics: Technical and Business Transition from the manufacturing of Membrane Switches to Printed Electronics, including smart textiles and smart plastics.

3:10 PM

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Luc van Neer

Luc van Neer

Metafas is a high level screen printing company with more than 30 years experience in printing electronics. We have developed from screen printing front foils and membrane switches to printing sensors on (non-)stretchable substrates, including connectors, pick-and-place, cutting and assembly. The company has transformed from a local build-to-print manufacturer for the machine- and electronics industry towards a supplier & partner for smart applications in the Automotive, Healthcare and Consumer electronics. In this presentation, Luc will guide you shortly through this journey, and explain how system integrators can benefit from this, and you will learn (both upsides and downsides) from various cases and projects.

Printing Electronics: Technical and Business Transition from the manufacturing of Membrane Switches to Printed Electronics, including smart textiles and smart plastics.

3:10 PM

KIMOTO
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KIMOTO

Adhesive carrier and protection films for advanced manufacturing

3:30 PM

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Christoph Bosshard

Christoph Bosshard

Advanced production processes require protection of sensitive surfaces and materials, while other processes require the fixation of parts or stretchable substrates for efficient processing. The challenge is to find the best possible combination of base film and adhesive for a given material combination and environmental condition. After processing, the film must be released without adhesive residue to prevent unnecessary process steps. In cooperation with our customers, we developed a wide range of different solutions with variable adhesive strength, that when combined with specific base films, allows to extend the application and temperature range. Our presentation will focus on typical examples as well as on some special use cases, that are currently under development for areas such as: Printed electronics, sensors, batteries, displays and micro LED’s.

Adhesive carrier and protection films for advanced manufacturing

3:30 PM

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Exhibition & Refreshment Break

3:50 PM

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Exhibition & Refreshment Break

3:50 PM

Track 2
Momentive | BSC Computer
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Momentive | BSC Computer

Sustainable Motion based on Silicone

11:20 AM

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Jan Geboers | Andreas Schneider

Jan Geboers | Andreas Schneider

Highly efficient, biocompatible linear actuators can be produced from silicones. Structures like artificial muscles that contract when an electrical voltage is applied and relax again just as quickly. In this presentation, the authors will discuss how bring this Dielectric Elastomer Actuator (DEA) technology is being brought to market maturity and can replace small motor-gear units with highly energy-efficient and maintenance-free DEA solutions.The DEAs are stacks of thousands of individual silicone layers with conductive coatings. The motion dynamics depend heavily on the silicone base material used and the dimensions of the stacks. Specific solutions are specified for a maximum force of up to 20N and a compression of up to 8% of their length at rest. The DEA’s electronic control unit generates and regulates the required high voltage of approx. 800 V, protects against overvoltage and takes care of charge, trickle charge and discharge management. The electronics are designed so that they can be used with standard supply voltages in battery operation and are extremely energy-efficient. This makes DEA technology easy to integrate into end products: The module and its interfaces fulfill the approval requirements in the voltage range used.In this presentation, we will provide background information on all the components for the use of DEA technology in real products. Sustainable motion through dielectric elastomer drives is becoming a reality, and the first end products will be launched on the market in the course of 2024.

Sustainable Motion based on Silicone

11:20 AM

X-Trodes
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X-Trodes

Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation

11:40 AM

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Yael Hanein

Yael Hanein

Soft electrode array for skin electro-physiology: New opportunities in sleep studies and rehabilitation

11:40 AM

Creative Materials
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Creative Materials

Advances in Materials for Additively Manufactured Electronics Skin Patches

12:00 PM

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Brian Violette

Brian Violette

Electronic skin patches have emerged as promising platforms for various biomedical applications, including healthcare monitoring, prosthetics, wound care, stimulation, rehabilitation, medicine delivery, and human-machine interfaces. Advances in flexible and strechable supporting films and compatible functional materials have enabled conformal integration of sensors onto the skin, facilitating real-time monitoring of vital signs, pressure profiles, motion, and environmental parameters.Careful selection of all materials of construction as well as the geometries of the patch are critical to ensure the maximum durability of the end device while maintaining user comfort. This includes consideration of the thicknesses and moduli for mechanical matching of substrates, functional, and decorative material features. The chemical compatibility of these materials, and design considerations with regards to the interfaces to conventional electronic devices are also important to be properly engineered for mechanical matching. A multivariable design of experiments is necessary to optimize the final device bill of materials and design for reliability, performance, and comfort.

Advances in Materials for Additively Manufactured Electronics Skin Patches

12:00 PM

Tecnalia Research & Innovation
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Tecnalia Research & Innovation

Composites functionalization via printing: adding even more value to fibre-reinforced plastics

12:20 PM

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Ibai Santamaría

Ibai Santamaría

Fibre-reinforced polymers (FRPs) are revolutionizing industries such as aerospace, automotive, and construction due to their exceptional strength-to-weight ratio and durability. The global composites market is steadily growing, driven by an increasing demand for lightweight, high-performance materials; but there is also an increasing interest in adding even more value by integrating new functionalities such as sensors or heaters.Embedding electronic functionalities into composite materials without impairing their outstanding properties has always been a challenge. Now, the advances in printing and manufacturing technologies open up transformative opportunities. From process supervision to Structural Health Monitoring (SHM) or surface radiation, this approach will revolutionize the way we design and utilize composite materials, driving innovation and creating new market opportunities.

Composites functionalization via printing: adding even more value to fibre-reinforced plastics

12:20 PM

Printed Electronics Ltd
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Printed Electronics Ltd

Experience-Driven Process Selection and Scale-Up in Printable Electronics: Manufacturing-led insights from micron to metre scale.

12:40 PM

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Neil Chilton

Neil Chilton

With decades of experience in printable electronic manufacturing, PEL offers valuable insights into scaling up production processes. This presentation covers key considerations for successful transition from prototype to full-scale production, including machine, process and material selection. Additionally, we introduce our open-access facility, where our team supports customers in their development journey while minimising costs and maximising resource utilisation.

Experience-Driven Process Selection and Scale-Up in Printable Electronics: Manufacturing-led insights from micron to metre scale.

12:40 PM

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Lunch & Exhibition Break

1:00 PM

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Lunch & Exhibition Break

1:00 PM

DECATHLON
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DECATHLON

How Plastronic LDS process can reduce CO² emissions for Electronics devices

2:30 PM

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Christophe Dupuis

Christophe Dupuis

DECATHLON is committed to reducing its CO² impact by 20% by 2026. In order to meet this ambition, we started by actions like to reuse recycled materials or to reduce the weight of our components, but these levers will not be sufficient to achieve our target. We have no other choice but to explore disruptive solutions that break with standard technologies in order to respond to the climate challenge.This presentation aims to present the study of a concrete application of LDS technology on a headlamp product.
We will present first the Environmental evaluation of the LDS process to focus then on the Carbon footprint improvement compared to conventional technologie, without forgetting finally the technical and economic evaluation of LDS technology applied to the case study.

How Plastronic LDS process can reduce CO² emissions for Electronics devices

2:30 PM

Horizon Microtechnologies
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Horizon Microtechnologies

Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications

2:50 PM

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Andreas Frölich

Andreas Frölich

Additive manufacturing technologies with precision and resolution on the micrometer scale (micro AM) today are realistically being looked at as viable production technologies, and are no longer the expensive and slow processes of a decade ago. If properly used, the design freedom of micro AM allows of higher miniaturization, functional integration, better performance, or reduced size, weight and power consumption of parts and components. However, most micro AM technologies work with photopolymers which lack certain functionalities. Combining micro AM-derived parts with coating technologies for non-polymer materials that are able to conformally coat 3D substrates is an efficient approach to overcome the lack of functionalities of bare polymer parts. It brings together the benefits of photopolymer based 3D printing such as precision, repeatability and relatively simple processing with the functionalities which the respective coatings can achieve. This talk will present a process portfolio for depositing thin (<10 µm), conformal, electrically conductive, protective and metallic films on three-dimensional polymer substrates made by micro-AM processes to enhance the functionality of the polymer microstructures and their application in radio-frequency devices and electronics.

Hybrid Microfabrication by 3D printing and subsequent Coating for Electronics and Radio-Frequency Applications

2:50 PM

BotFactory
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BotFactory

Rapid PCB Manufacturing

3:10 PM

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Carlos Ospina

Carlos Ospina

We present a remarkable amalgamation of a conductive and insulating ink printer, solder paste extruder, and pick-and-place machine encapsulated into one singular product, designed to accelerate your PCB prototyping from weeks to mere minutes. Upon uploading your design, our intuitive software navigates you seamlessly through the printing journey, enabling the creation of a fully assembled and functional 3D Printed circuit board swiftly. Explore how our PCB 3D Printer can revolutionize your electronics manufacturing pace!

Rapid PCB Manufacturing

3:10 PM

Exxelia Micropen
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Exxelia Micropen

Functionalization of Medical Devices Using Additive Dispense Technology

3:30 PM

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RJ Greco

RJ Greco

Medical device designs are constantly evolving as the trend to make passive devices functional is taking over the market space. Using additive dispense technology, one can print conductive traces, sensors,and markers on a variety of different medical device products.The direct printing system, Micropen, is a CAD/CAM driven capillary dispensing tool akin to an ultra-precise micro-dispense gun. If a material is flowable and can be loaded into a syringe, the Micropen can print it onto virtually any surface. It’s a non-contact, additive printing technique that dispenses the precise amount of material needed. This makes it beneficial when using novel, expensive or rare inks. The efficient use of materials and the ease of changing them provides product designers with increased prototype control as well as reducing time-to-market. Direct printing is an ideal way to form many different patterns on 2D substrates giving them superior electrical characteristics. However, the capabilities of the Micropen don’t stop at 2D substrates. Printers have been designed with 5-axis of movement. This allows many different medical device form factors to be printed such as thin, flexible,irregular, and highly three-dimensional shapes.This talk will provide an overview of the Micropen additive dispense integration with a variety of products in the medical device arena.

Functionalization of Medical Devices Using Additive Dispense Technology

3:30 PM

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Exhibition & Refreshment Break

3:50 PM

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Exhibition & Refreshment Break

3:50 PM

Track 3