Introducing the Program - Additive and 3D Electronics Manufacturing Process Innovation

Why Should You Join TechBlick's The Future of Electronics RESHAPED?

The Future of Electronics RESHAPED conference and exhibition (22 & 23 OCT 2025, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. 

This year the program features a world-class agenda with over 100 superb invited talks from around the world, 12 industry- or expert-led masterclasses, 4 tours, and over 90 onsite exhibitors. 

In this article, we discuss and highlight various innovative talks at the event around the theme of  Additive and 3D Electronics Manufacturing Process Innovation.  In future articles, we will cover further technologies including smart surfaces, sustainable electronics, printed medical electronics, novel materials and beyond.

In previous articles we introduced other innovations in Additive and 3D electronics (see here) and also key material related innovations which will be showcased at the show (see here)

Explore the full agenda now and join the global industry in Berlin on 22 & 23 OCT 2025. Let us RESHAPE the Future of Electronics together, making it Additive, Hybrid, 3D, R2R, Soft, Flexible, Wearable, Textile and Sustainable.

Explore the Full Agenda and Register before 12 September 2025 for the best rates

Agenda and Registration

GE Aerospace – Felippe Pavinatto presents additive electronics for aerospace applications in harsh environments. Examples include direct-write 3D printed passive RF sensors operating up to 1000 °C and fully additive embedded die packaging. Both demonstrate how additive methods enable non-planar, embedded devices beyond the limits of conventional semiconductor manufacturing.

Mesoline – Thomas Russell presents microchannel particle deposition (MPD) for MEMS and sensor applications. This wafer-scale technology enables micron-precision material deposition on 6- and 8-inch wafers. Demonstrated use cases include uniform low-power gas sensors, high-resolution glass frit bonding lines (~20 µm), and high-aspect-ratio hydrogen getters on CMOS wafers, advancing device miniaturization and performance.

Prio Optics – Dr. Qihao Jin presents inkjet-printed optical coatings for precision photonics. Functional inks are deposited with nanoscale accuracy to tune layer thickness, refractive index, and patterns for applications such as anti-reflective layers, spectral filters, and optical intensity control. Compared to vacuum deposition, the additive process reduces waste, accelerates prototyping, and scales from small to large-area optics for imaging, displays, sensors, and solar control.

X-Fab – Tino Jaeger presents micro-transfer printing for integrating ultra-thin ASICs. The technology enables precise, high-throughput transfer of free-standing chiplets from CMOS and III-V wafers onto flexible foils and other substrates. The talk covers CMOS post-processing flows, tether/anchor structures, and heterogeneous integration approaches, highlighting applications where ultra-thin chiplets unlock advanced functionality.

Explore the Full Agenda and Register before 12 September 2025 for the best rates

Agenda and Registration

Enjet – Doyoung Byun presents innovations in electrohydrodynamic (EHD) inkjet multi-nozzle printing. The talk outlines advances that overcome electrical crosstalk and interference, enabling stable, high-throughput jetting of viscous functional materials with micron precision. This scalable architecture positions EHD printing as a key technology for next-generation semiconductors, displays, and bioelectronics.

Sonojet – Mehrzad Roudini presents SAW-based aerosol printing for next-generation electronics. Using surface acoustic waves on piezoelectric chips, this solid-state, nozzle-free approach enables low-power, tunable droplet generation from submicron to tens of microns. Integrated with on-chip microfluidics, the compact printheads are clog-free, compatible with a wide range of inks, and offer precise, energy-efficient deposition for high-resolution, multi-material additive manufacturing.

HighLine Technologies – Maximilian Pospischil presents scalable deposition solutions from microextrusion to coating. The company’s high-speed dispensing achieves homogeneous fine lines below 20 µm at >500 mm/s, with expanded capabilities for cathode layer coating and other applications. Modular nozzle kits, multi-head systems, and AI-driven process optimization enable flexible, automated solutions for PV metallization and large-scale manufacturing.

Explore the Full Agenda and Register before 12 September 2025 for the best rates

Agenda and Registration

Fraunhofer ILT – Adam El-Sarout presents laser-controlled optimization of local conductivity in printed electronics. The approach uses selective laser sintering to correct printing-induced conductivity variations in thin silver layers, achieving resistance fluctuations below 1 Ω. This two-step process enhances the performance and reliability of digitally printed strain gage sensors, offering a cost-efficient alternative to conventional lithography.

NanoPrintek – Masoud Mahjouri-Samani presents inkless multimaterial printing directly from raw materials. This dry-printing process bypasses costly ink formulation and post-processing, generating pure nanoparticles in situ and sintering them with lasers onto diverse substrates. Capable of printing metals, semiconductors, insulators, and composites, the approach reduces cost, pollution, and supply-chain dependence while enabling hybrid, multifunctional structures for electronics, energy, healthcare, and aerospace applications.

Akoneer – Tadas Kildušis presents multilayer glass HDI PCBs enabled by laser processing. Glass substrates offer advantages for electronics and semiconductor packaging, and Akoneer demonstrates methods for creating high-density interconnections in multilayer glass PCBs using advanced laser technologies.

Hamamatsu – Alexander Görk presents laser processing for sustainable printed electronics. The talk highlights energy-efficient laser sintering, encapsulation, and soldering of NIR-absorbing materials, demonstrating how laser thermal processing supports greener materials and sustainable manufacturing through collaborations with material suppliers, institutes, and integrators.

Explore the Full Agenda and Register before 12 September 2025 for the best rates

Agenda and Registration

Myrias Optics & University of Massachusetts Amherst – James Watkins present printed metaoptics for AR/VR and photonics. Using additive nanoimprint lithography with nanoparticle inks, wafer-scale fabrication of inorganic metalenses, metasurfaces, and AR/VR waveguides is demonstrated, achieving >80% efficiency and excellent uniformity. The process enables high-index, stable, and low-cost optical devices, paving the way for scalable integration of metaoptics on glass and silicon platforms.

Hummink – Elisa Duquet presents High Precision Capillary Printing (HPCaP) for next-generation manufacturing. Inspired by AFM, HPCaP uses capillary forces and resonant micropipettes to achieve resolutions from 50 µm down to 100 nm without external energy input. Capable of depositing polymers, conductive inks, and biomaterials—including high-viscosity formulations—it enables high-aspect-ratio structures and fine interconnects for applications in semiconductor packaging, display repair, biosensors, and precision devices.

Fuji Corporation – Ryojiro Tominaga presents additively manufactured multilayer and stacked circuits with embedded components. Using inkjet-printed silver nano-inks on UV-curable resin substrates combined with ultra-low temperature SMT, Fuji demonstrates 3D encapsulated devices with novel geometries. This approach highlights the potential of additive manufacturing to transform electronic device design and production.

Explore the Full Agenda and Register before 12 September 2025 for the best rates

Agenda and Registration