top of page

TechBlick Insights: Shear thinning, printed MCUs on PET, Ultrafine metal mesh films, perovskite solar vs Si solar, perovskite stability, microdispensed QDs for microLEDs, and more

In this newsletter we cover the following


  • Shear thinning of jetted solder and glue for assembly 

  • Fully printed double sided MCU on PET substrates?

  • Ultrafine Cu mesh for transparent conductive films for touch, heating, security, etc film applications? 

  • Perovskite solar panels outperform the current silicon-based commercial panels, but what about cost?

  • Perovskite solar panels are highly promising not just for utility-grade, but also for indoor light harvesting.

  • Perovskite encapsulation for enhanced stability

  • Microdispensing quantum dots for color conversion 

  • How will perovskite panels perform in the 'real world'?



We cover these points by sharing short (1min or so) handpicked snippets from their live recent talks at TechBlick, Future of Electronics RESHAPED and Perovskite Connect conferences and exhibitions


Join us at TechBlick’s Future of Electronics RESHAPED conference and exhibitions in Berlin on 22 and 23 OCT 2025. This is the global home of the additive, printed,  3D hybrid and sustainable electronics, bringing the entire value chain together, from innovators to suppliers and end users.


This year as a special theme we will also collocate Perovskite Connect alongside the same show


Explore program here now: The Future of Electronics RESHAPED


Shear thinning of jetted solder and glue for assembly 


Shear thinning is one of the most important physical phenomena in jetting - or in fact in all of printed electronics! This is the physical mechanism on which much of the printed electronics industry relies! Here  Irving Rodriguez from Essemtec explains this behaviour for jetting of solder as well as structural glue, showing how the shear rate increase in the jetting head leads to a drop a significant drop in viscosity




ree

Fully printed double sided MCU on PET substrates?


Lina Kadura from CEA-Liten presented at TechBlick Innovation Day in April 2025, showing a full printed double sided MCU PCB with 4 metal layers and 100+ through vias, accommodating over 40 SMT (400um MCU pitch). 


This is an incredible achievement showing that printed PCBs can lead to complex mullti-layer fully functional electronic PCBs for complex systems, showing that PCBs can be printed leading to greener solutions at lower cost?



Ultrafine Cu mesh for transparent conductive films for touch, heating, security, etc film applications? 


Here Jonathan Chang from Panasonic North America explained at the TechBlick Future of Electronics SHOW USA (Boston, 2025) how they R2R form these films and what the key properties are.

Fist the grooves are embossed into PET or PEC later and then the Cu mesh is formed. The mesh has 2um linewidth and is embedded within the film, yielding a smooth surface. The pattern is customised and the R2R process can do top and bottom layers at the same time giving rise to double sided films




Perovskite solar panels outperform the current silicon-based commercial panels, but what about cost?


In April 2025, during our Perovskite Innovation Day, Utmolight's co-founder

Jesse Zheng said that while perovskites are not competitive yet, there are encouraging signs, and with a 10 GW factory, the company could reach cost parity with silicon.



ree

Perovskite solar panels are highly promising not just for utility-grade, but also for indoor light harvesting.


In January 2024, during our Future of PV event, Halocell's Emanuele Calabró showed the superior performance of indoor light harvesting with its panels.



Perovskite encapsulation for enhanced stability


One of the key challenges that the perovskite industry still faces is the stability of lifetime of perovskite solar panels.


In April 2025, during our Perovskite Innovation Day, Intellivation's Robert Malay introduced the company's encapsulation solutions, and discussed the challenges facing perovskite solar panel makers.



Microdispensing quantum dots for color conversion 


XTPL developed a unique printing technology that offers high-performance and high precision material deposition, with several possible applications in the display industry.


In December 2024, during our Display Innovation Day, XTPL presented their solution for micro bump deposition, and also presented a demonstration of QD deposition for microLED color conversion, a collaboration project with X-Display.



ree

Perovskite materials and exciting researchers and developers all over the world, as the industry is on the verge of mass commercialization starting with solar panels.


In April 2025, during our Perovskite Innovation Day, Noctiluca's Łukasz Sytniewski explained why the company identified the perovskite solar industry as the key next market for the company, and detailed its new material R&D activities.



ree


How will perovskite panels perform in the 'real world'?


Perovskite solar panels are highly promising, but people still wonder just how perovskite panels will perform in the 'real world'.


In April 2025, during our Perovskite Innovation Day, Microquanta's Yang Chen details the latest performance of the company's perovskite panels - showing how they generate more electricity than silicon in harsh environments.



ree

 
 
 

Comments


Subscribe for updates

Thank you!

CONTACT US

KGH Concepts GmbH

Mergenthalerallee 73-75, 65760, Eschborn

+49 17661704139

venessa@techblick.com

TechBlick is owned and operated by KGH Concepts GmbH

Registration number HRB 121362

VAT number: DE 337022439

  • LinkedIn
  • YouTube

Sign up for our newsletter to receive updates on our latest speakers and events AND to receive analyst-written summaries of the key talks and happenings in our events.

Thanks for submitting!

© 2025 by KGH Concepts GmbH

bottom of page