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Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (21 & 22 OCT 2026, Estrel Congress Centre, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. The event is co-located with Electronic Textiles RESHAPED, Sustainable Electronics RESHAPED, and Perovskite Connect. In this article, we highlight various innovative talks around the theme of material, ink and paste innovations — the formulations that sit at the heart of every printed device. From silver-coated copper and room-temperature copper processing to biosensor inks, graphene formulations, and the substrates and adhesives that everything is printed on. In future articles, we will cover digital deposition, manufacturing and hybrid integration, and printed applications. Explore the full agenda now and register to join the event — one pass gives you access to all four co-located shows, the exhibition, and the TechBlick on-demand library. Conductive Inks & Pastes: The Silver Question and the Copper Answer With silver prices and price volatility at record highs, the search for cost-effective, high-performance conductor materials has never been more urgent. Ames Goldsmith (USA) – Daniel Lacorte presents advances in silver-coated copper materials for high-performance printed electronics. As geopolitical uncertainty drives silver prices to new heights, core-shell silver-coated copper powders and flakes are gaining strong interest as a cost-effective alternative to pure silver. The talk discusses the development of robust silver-coated copper that combats potential reliability issues from copper oxidation, ionic copper leaching, and their influence on pot-life duration. University of Southampton (United Kingdom) – Jessica Pereira presents a patented copper platform enabling room-temperature fabrication of highly conductive, air-stable copper films — no thermal or photonic sintering required. Using biopolymer-stabilised particles and mechanical compression, the technology achieves excellent electrical properties (2.05–2.33 × 10⁻⁸ Ωm) and compatibility with paper, textiles, and other temperature-sensitive substrates using water-based, sustainable formulations. Demonstrated devices include conductive paper circuits and electroluminescent systems, with applications spanning RFID, disposable sensors, papertronics, and e-textiles. The team is actively seeking industrial partners for licensing and scale-up. Henkel (Germany)– Jacqueline Putz presents a masterclass on Electrically Conductive Inks: Formulation, Printing, and Applications. This session covers ink formulations, manufacturing, and key parameters across various printing processes. A special focus will be placed on the importance of ink compatibility testing, complete with real-life examples and troubleshooting strategies for screen printing. Heraeus Electronics – Ryan Banfield presents Ag Inks for Stretchable Electronics. Diving deeper into design considerations for elastic polymer thick film materials, this presentation explores how specialized silver formulations deliver reliable performance under continuous mechanical deformation in wearable and medical applications. Explore the full agenda and register early for the best rates. Functional & Specialty Inks: Biosensors, Graphene, and Beyond Sun Chemical (USA) – Phil Nicholas discusses "The Balancing Act" for electrochemical biosensor inks: the interplay between ink design, processing, and end-use performance, with a focus on the latest advances in materials for screen-printed electrodes (SPE) used in electrochemical sensors — a market spanning glucose test strips to next-generation diagnostics. BLACKLEAF (France) – Anaghim Nasri presents water-based graphene inks as a sustainable innovation for thermal heating elements. BLACKLEAF's approach targets high-performance printed heaters while avoiding solvent-heavy formulations, aligning graphene's exceptional thermal and electrical properties with greener chemistry. ACI Materials (USA) – ACI Materials joins us in Berlin to present its latest functional material innovations. At TechBlick USA 2025, ACI presented advanced printable conductors enabling fully additive manufacturing of durable flexible hybrid electronics, wearables, and e-textiles — offering improved solderability, finer print resolution, and support for smaller surface-mounted devices, while addressing a key reliability weakness of traditional conductive adhesives: galvanic corrosion under damp heat. Built on ACI's patented cavitation-based dispersion process and its Alchemy semi-sintering conductor series, these materials combine the processability of polymer thick films with the electrical performance of sintered inks. The Berlin talk title and abstract are still being finalized — this preview draws on ACI's recent TechBlick presentations. Ercon (USA) – Ercon will present its conductive ink technologies for printed sensing. Established in 1967, Ercon manufactures conductive polymer thick-film inks — silver, silver/silver chloride, carbon, graphite, platinum, and gold, plus insulating layers — used in billions of blood glucose test strips and body electrodes worldwide. Expect deep expertise on materials for electrochemical sensors and medical electrodes. Final talk details to be announced in the agenda. Explore the full agenda and register early for the best rates. Substrates & Material Interfaces: The Unsung Heroes Every printed device is a materials system — and the substrate and adhesive layers are just as decisive as the functional ink. Avery Dennison (USA/Belgium) – Jarne Machiels maps ink/adhesive compatibility in flexible hybrid electronics — "beyond the holy grail." An intensive validation program tested diverse pressure-sensitive adhesive tape technologies in direct contact with various functional inks. The primary finding: there is no single holy-grail adhesive; compatibility is a multi-variable equation dependent on the chemistry of both ink and adhesive matrix. The talk introduces a validated methodology for evaluating ink/adhesive interfaces under accelerated ageing, breaks down the key factors engineers must consider to avoid unexpected field failures, and shares real-world applications where validated combinations even enabled elimination of layers and cost. Covestro (Germany) – Klas-Moritz Kossel presents tailored TPU films for flexible and stretchable printing substrates. As printed electronics and wearables enter markets demanding lightweight, thin, and flexible solutions, thermoplastic polyurethane films can be extensively tailored to each application's requirements — showing particularly promising properties as substrates for printed sensor systems. Kimoto (Switzerland/Japan) – Christoph Bosshard presents carrier and protection films for production processes. These films enable the handling of sensitive surfaces and flexible substrates in industrial processes — a quietly critical role as printed electronics scales up. Backed by Kimoto's decades of expertise in roll-to-roll coated functional films, the talk focuses on production processes and the options for sustainable scaling from lab to fab. Policrom Screens (Italy) – Giorgio Vavassori Bisutti presents TPU as a substrate technology for printed, hybrid, stretchable, and wearable electronics. At TechBlick USA 2025, Policrom introduced ELECROM STRETCH, a TPU-based substrate and encapsulation system designed to maintain elasticity, dimensional accuracy, and conductivity through multi-layer builds — enabling reliable integration of stretchable electronics, such as pressure sensors in gloves, into textiles. The Berlin talk will bring this substrate story to the e-textile audience. The final abstract will be confirmed in the agenda. Explore the full agenda and register early for the best rates. Stretchable, Washable, Sustainable Inks and Substrates Because one pass covers all four co-located shows, materials-minded attendees should also mark these ink, paste, and substrate talks from the Electronic Textiles RESHAPED and Sustainable Electronics RESHAPED Leibniz-Institute for New Materials (Germany) – Christoph Kaiser presents screen-printable hybrid conductive inks for stretchable temperature sensing and heating, based on a hybrid metal–carbon filler network in a stretchable matrix. Characterized from 20 to 120 °C under repeated thermal and mechanical cycling, optimized formulations show a linear resistance response with temperature coefficients enabling thermal sensing or active temperature control even after tens of thousands of strain cycles — a versatile platform for textiles, medical applications like smart wound dressings, and soft robotics. Nagase ChemteX (Japan) – Nagase ChemteX presents stretchable, wearable, and washable inks meeting the requirements of next-generation electronic textiles — where conductive materials must survive not just bending but stretching, sweat, and repeated wash cycles without losing performance. The detailed abstract will follow in the agenda. Fraunhofer IZM (Germany) – Lukas Werft leads a masterclass on gallium-based liquid metal inks for highly reliable printed stretchable electronics — a materials-science deep dive into how formulation governs viscosity, wetting, line formation, and electrical continuity, covering polymer–solvent systems, droplet morphology, oxide-mediated stabilization, and process windows for dispensing and screen printing. Explore the full agenda and register early for the best rates. Join Us in Berlin At the exhibition you will also meet many of the world's leading ink, paste, and substrate suppliers, alongside equipment makers and print houses — the full materials value chain in one place. Explore the full agenda and register now to secure the best rates. Your pass also includes the co-located Perovskite Connect, Electronic Textiles RESHAPED, and Sustainable Electronics RESHAPED — four world-class events, one venue, one ticket.

Why Should You Join TechBlick's MicroLED Connect, AR/VR Connect and Optical I/O Connect? The three co-located events take place on 16 & 17 September 2026 at the High Tech Campus in Eindhoven, bringing together the display, optics, semiconductor and interconnect communities in one venue: MicroLED Connect, AR/VR Connect and Optical I/O Connect. For a decade, microLEDs were a display story. That changed when AI infrastructure ran into a wall: copper is efficient but short-reach, optics reach further but cost power and reliability, and neither scales the way AI clusters now demand. The "wide-and-slow" microLED architecture — many parallel, modest-speed optical channels instead of a few ultra-fast lanes — has emerged as a credible third option, and Eindhoven is where the people building it will gather. In this article we highlight talks around the theme of microLED optical I/O for AI infrastructure: the architecture, the link budgets, and the devices that make it work. In companion articles we cover mass transfer and assembly, emitters and backplanes, yield and metrology, AR waveguides, light engines, and the system-level challenges of AI glasses. Explore the full agenda now and register to join — one pass gives you access to all three co-located events, the exhibition, and the TechBlick on-demand library. The Wide-and-Slow Architecture: Breaking the Interconnect Trade-Off Microsoft (United Kingdom) – Paolo Costa frames the problem precisely: AI workloads, especially inference, are increasingly constrained by memory and network bottlenecks — a consequence of the fundamental limitations of current interconnect technologies. Copper links are power-efficient and reliable but limited to very short distances, while optical links extend reach at the cost of higher power and lower reliability. MicroLEDs combined with a wide-and-slow architecture have emerged as a way to break this trade-off, achieving low power, high reliability, and reach up to tens of metres simultaneously. Realizing the vision, however, requires cross-layer innovation from devices, micro-optics and analogue electronics through to connectors, fibres, packaging and system integration — plus supply-chain scaling and interoperability standards. A talk that doubles as a call to the community. Avicena Tech (USA) – Gregoire Denis presents a comprehensive framework for analyzing optical link budgets in microLED-based communication systems. Having pioneered microLED interconnects through the wide-and-slow approach, enabling low energy-per-bit operation and high-density integration, Avicena extends conventional link budget methodologies to account for the distinct properties of microLED emitters: limited optical output power, wide emission profiles, efficiency droop at high current densities, and strong dependence on device geometry. Particular attention goes to coupling losses, étendue constraints, and the trade-offs between optical power, modulation depth, and bandwidth. Tera Electronics Corp. (Taiwan) – Solomon Chi introduces a manufacturable MicroLED Optical I/O platform targeting next-generation AI interconnects, from pluggable active optical cables and near-package optics to future die-to-die optical architectures. Conventional copper faces severe thermal, signal integrity and scalability limits at 224G PAM4 and beyond, while co-packaged optics and silicon photonics still rely on complex laser integration, cooling, DSP-intensive architectures and costly packaging. The talk demonstrates sapphire-based high-speed microLED technology achieving approximately 1.9 GHz modulation bandwidth with CMOS-compatible wafer-level integration, integrating microLED arrays, photodetector arrays, driver/TIA electronics and image-fibre interfaces. Mojo Vision (USA) – Nikhil Balram shows how a single micro-LED technology platform enables breakthrough applications across both displays and AI infrastructure. Built over a decade, this highly integrated, wafers-in/wafers-out platform brings together advanced 300mm silicon architecture, GaN-on-silicon emitters, efficient photodetectors, proprietary quantum dots, custom micro-lens arrays, highly multicore fibre bundles and software. In displays it enables compact, high-efficiency systems that break conventional trade-offs in brightness, size and power; in AI infrastructure the same platform enables massively parallel optical I/O for chip-to-chip interconnects, dramatically improving bandwidth density, power efficiency and reliability. Explore the full agenda and register early for the best rates. Devices and Platforms: Making the Emitters Fast Enough CEA-Leti (France) – Anthony Cibié addresses the medium-distance gap. Copper serves short reach and silicon photonics serves beyond ten metres, but for one to ten metres GaN microLED-based interconnects are a promising candidate — thanks to their development for microdisplays, GHz-level bandwidth, and capability to be miniaturized to the micron scale, enabling large-scale parallel communication between microLED and micro-photodetector matrices through fibre bundles. The talk presents CEA-Leti's latest figures of merit for both devices, the impact of temperature and high current density, and device modelling to support driver and TIA design. University of California Santa Barbara (USA) – Steve DenBaars reports record-level external quantum efficiencies of 58% for blue micro-LEDs, 30% for green and 21% for red, enabled by novel epitaxial growth, optimized processing and transparent packaging — demonstrating the viability of monolithic full-colour III-nitride platforms. Crucially for interconnects, as device dimensions shrink and current densities rise, micro-LEDs exhibit exceptional modulation speeds: the work demonstrates a 3-dB bandwidth of 612 MHz at 1.4 kA/cm², corresponding to data rates approaching 1.24 Gbit/s under NRZ-OOK modulation, highlighting the dual potential for both high-brightness displays and high-speed optical communication. ALLOS Semiconductors (Germany) – Burkhard Slischka argues that in both microdisplay and optical interconnect markets, superior device performance and strong IP are necessary but may not be sufficient for commercial success — the winners may ultimately be determined by manufacturing strategy and supply-chain scalability. Although these are fundamentally different markets with distinct requirements, they share remarkably similar manufacturing challenges. The talk compares both applications and explores why silicon-fab compatibility, integration with CMOS and silicon photonics processes, wafer-level manufacturing, and the ability to scale production rapidly may become the decisive factors. Tyndall National Institute, University College Cork (Ireland) – Vitaly Zubialevich presents a micro-LED architecture for enhanced emission directionality in displays and optical interconnects — addressing one of the properties that most directly determines coupling efficiency into both waveguides and fibres, and therefore system-level power budgets in either application. The detailed abstract will follow in the agenda. Explore the full agenda and register early for the best rates. Emitters Built for Both Worlds: Display Innovations with Interconnect Impact Two emitter talks from the MicroLED Connect program are equally at home here, because their device physics directly serves the interconnect case. Aledia (France) – Pierre Tchoulfian's 3D GaN nanowire platform, grown on large-area silicon, is presented primarily as a display technology — but the nanowire architecture also introduces a disruptive approach to optical interconnects. By exploiting non-polar emission properties, the platform enhances carrier recombination dynamics, enabling high-speed modulation at reduced power consumption and positioning the technology as a key enabler for data communication systems requiring high bandwidth density and energy efficiency. (Full display-side coverage in our emitters article.) Ingantec (USA) – Alan Yeung's talk on red InGaN microLEDs and monolithic full-colour integration explicitly extends beyond consumer displays: high-density, high-brightness native red and RGB microLED arrays are uniquely positioned for AI optical interconnects alongside AR and medical imaging — and the single-substrate architecture that bypasses mass transfer matters just as much for interconnect array manufacturing as for displays. Explore the full agenda and register early for the best rates. Join Us in Eindhoven From data-centre architecture and link budgets to record-efficiency epitaxy and directional emitters, this is the most concentrated gathering yet of the microLED optical I/O community — alongside the display and AR ecosystems that share its supply chain. Explore the full agenda and register now to secure the best rates. Your pass covers all three co-located events — MicroLED Connect, AR/VR Connect and Optical I/O Connect — plus the exhibition, at the High Tech Campus in Eindhoven on 16 & 17 September 2026.

Isotropic ALE is able to remove sidewall damage and has potential benefits in many applications, including microLEDs. MicroLEDs, LEDs with dimensions from 1 µm to a few hundreds of microns, are currently receiving a lot of attention. With much higher light output and lifetime, and lower operating powers than OLEDs, if two or three challenges can be overcome, microLEDs could empower the next generation of displays in areas including AR/VR, automotive, wearables, phones and large displays. The main challenges revolve around cost, though it has been predicted that they will be at a similar cost to the (2024) cost of OLEDs by 2026. There are also challenges around the fabrication of red LEDs and reducing the loss of light output as dimensions shrink. We are exhibiting at MicroLED Connect and AR/VR Connect in Eindhoven, The Netherlands on 16-17 September 2026 Please register to meet us in person and see our technology in action. It is known that the plasma etch process, that is used to define GaN LED mesa structures, damages the sidewalls and creates non-radiative recombination (NRR) states, which reduce the light output, usually quantified as external quantum efficiency (EOE). Oxford Instruments Plasma Technology has an active programme in producing a low damage mesa etch, but also an etch capable of removing the damage in the mesa sidewalls. Early results show promising increases in luminescence of bulk material, and further work on LED structures is planned. The images below show the effect of isotropic ALE on the (Cathodo-) luminesence of a damaged n-GaN mesa. In Fig. 1, the mesa top, which is protected by the mask during the etch,shows no damage and gives a bright luminescence, whilst there is damage in the GaN around it, hence giving out low luminescence. Fig. 2 shows that after treatment with isotropic ALE, which removes material from the top of the GaN and the sides, the signal is much brighter and the undamaged top is indistinguishable from the previously damaged backgrounds, revealing the damaged part has been removed. Further work is necessary to create a useful process, but this validates the principle of removing etch damage. A further challenge is in the manufacture of red-emitting LEDs. The green and blue GaN-based types are well known and achieve EOEs near to 50%, but for red, the record is <10%. Consequently, red is often made using AlGaInP, as opposed to the alloys of Al, In and GaN used for the other colours. There is an advantage, not least, in the fabrication of monolithic three-colour LEDs (i.e. each LED element has red, green and blue generating structures operating simultaneously). Here, the basic material system has to be GaN and its alloys. InGaN, which is the best candidate for red LEDs, is very difficult to make, though this is at an early stage. Join Us in Eindhoven Explore the full agenda and register now to secure the best rates. Your pass covers all three co-located events — MicroLED Connect, AR/VR Connect and Optical I/O Connect — plus the exhibition, at the High Tech Campus in Eindhoven on 16 & 17 September 2026.

Why Should You Join TechBlick's The Future of Electronic Textiles RESHAPED? The Future of Electronic Textiles RESHAPED conference and exhibition (21 & 22 OCT 2026, Estrel Congress Centre, Berlin) is where technologies and applications meet, accelerating the industrialisation of smart and electronic textiles. The event is co-located with Electronics RESHAPED, Sustainable Electronics RESHAPED, and Perovskite Connect. Smart textiles prove their worth on the body — monitoring health, protecting workers, and performing in environments where conventional electronics fail. In this article, we highlight talks around the theme of wearables that work: health and physiological monitoring, and safety-critical wearables for demanding environments. In a companion article, we cover the manufacturing platforms, materials, and standards behind these products. Explore the full agenda now and register to join the event — one pass gives you access to all four co-located shows, the exhibition, and the TechBlick on-demand library. Health & Physiological Monitoring: From Lab Accuracy to Daily Wear Danish Technological Institute (Denmark) – Zachary J. Davis provides a comprehensive overview of DTI's smart wearable technologies, spanning the full value chain from e-textile manufacturing and standardized IPC test methods (wash durability, abrasion, tensile and stretch behavior, climate exposure) to functional demonstrators: a printed EMG electrode sleeve targeting musculoskeletal disorder prevention with a detachable wireless unit; a cardiovascular monitoring platform fusing impedance cardiography, ECG, and a six-axis IMU in a wearable vest for human activity recognition; and a fully washable printed e-textile heater with integrated material-based temperature control — to name a few. QUS Body Connected (Austria) – Susanne Bracun presents the biometric t-shirt: delivering medical-grade data accuracy in daily-wear textiles. The challenge QUS addresses is the hardest one in wearables — achieving clinically meaningful signal quality not from a chest strap or clinical electrode, but from a comfortable garment worn all day. The detailed abstract will follow in the agenda. Datwyler (Switzerland) – Datwyler offers a glimpse inside: how next-gen wearables are unlocking internal physiological and mental insights. Building on its expertise in high-precision elastomer components and wearable sensor technologies such as dry electrodes, the talk explores how body-worn devices are moving beyond step counts toward genuine physiological and cognitive-state monitoring. Full talk details to be published in the agenda. Explore the full agenda and register early for the best rates. Safety-Critical & Extreme-Environment Wearables Feraru Dynamics (United Kingdom) – Andrei Feraru presents wearable technology for health and safety at work. Hand-Arm Vibration Syndrome (HAVS) remains one of the most prevalent occupational diseases in construction and heavy industry, yet risk assessment still relies on estimated exposure values disconnected from real-world behaviour. HAV-Sentry is a textile-embedded wearable measuring hand-transmitted vibration directly at the palm in real time — integrating MEMS acceleration sensing, grip force measurement, and cloud analytics in a compliant gauntlet. The talk traces the journey from engineering research through Rolls-Royce experience to industrial deployment, examines how UK and EU regulatory landscapes shape adoption, and closes with a vision of PPE evolving from passive protection to active sensing. Protex – Helena Almqvist presents specialized wearables: integrating flexible heaters and sensors for extreme environments — where garments must deliver electronic functionality reliably in conditions that would destroy consumer wearables, from severe cold to demanding industrial settings. The detailed abstract will follow in the agenda. Fraunhofer IZM (Germany) – Malte von Krshiwoblozki presents electronic textiles for soldier systems. Since 2017, Fraunhofer IZM has been developing e-textiles for soldier applications, focusing on textile-based energy and data transfer, physiological health monitoring, and human–machine interaction. The talk provides an overview of past and current developments and outlines general requirements and future needs in one of the most demanding application domains for smart textiles. Explore the full agenda and register early for the best rates. Join Us in Berlin Wood, cellulose, natural fibre, and dissolvable boards; additive copper on biopolymers; carbon-accounted production lines — the PCB is being reinvented before our eyes, and Berlin is where the people doing it will be. Explore the full agenda and register now to secure the best rates. Your pass also includes the co-located Electronics RESHAPED, Electronic Textiles RESHAPED, and Perovskite Connect — four world-class events, one venue, one ticket.

Why Should You Join TechBlick's Perovskite Connect? Perovskite Connect (21 & 22 OCT 2026, Estrel Congress Centre, Berlin) brings together the companies, institutes, and equipment makers turning perovskite photovoltaics from a laboratory success story into a manufacturable, bankable product. The event is co-located with Electronics RESHAPED, Electronic Textiles RESHAPED, and Sustainable Electronics RESHAPED. A perovskite module is a stack of thin layers, and every one of them is a materials problem: transport layers that must be depositable at scale, contacts that survive firing, encapsulants that keep moisture out for 25 years, and electrodes that don't depend on scarce indium. In this article, we highlight talks around the theme of materials innovations — charge transport and interfaces, encapsulation and end-of-life, and transparent electrodes and alternative device concepts. In companion articles, we cover tandems and commercial deployment, and manufacturing equipment and processes. Explore the full agenda and register early for the best rates — one pass gives you access to all four co-located shows, the exhibition, and the TechBlick on-demand library. Charge Transport & Interface Materials TU Dortmund (Germany) – Matthias Grotevent presents a room-temperature synthesis of crystalline tin oxide nanocrystals that is remarkably robust: particle size and crystallinity are independent of reaction time, temperature, and precursor concentration. Unlike conventional colloidal syntheses requiring precise parameter control and multi-step purification, this route needs only simple mixing without precise control of fluid dynamics, and transfers monodisperse nanocrystals into a nonpolar dispersion agent with over 98% reaction yield. Solar cells fabricated with these nanocrystals demonstrate competitive efficiencies, confirming the scalable synthesis is directly compatible with high-performance device fabrication. Nano-C (USA) – Henning Richter describes the engineering of fullerenes as electron transport materials for n-i-p, p-i-n, and tandem architectures — covering the production and refinement of unfunctionalized fullerenes, particularly C60, at industrial volumes for vapor-phase deposition, and the role of functionalized fullerene moieties forming self-assembled monolayers and stabilizing the perovskite crystal phase. Advanced derivatives incorporating phosphonic acid or amino/ammonium functionalities enable effective interface passivation, while ongoing hole transport material development targets triphenylamine or carbazole cores with phosphonic groups, including cross-linking approaches to enhance interface durability. Performance data from single-junction and tandem devices is shared, alongside solvent selection for large-scale manufacturing. LinXole (Sweden) – Feng Wang introduces new Spiro-OMeTAD inks with several unique advantages for efficiency and stability. The resulting films show excellent moisture and thermal stability even after aging at 85% relative humidity and 85 °C, large-area printed films show high uniformity, and the films can be used directly without any post-oxidation process in air. They also suppress gold migration into the perovskite layer, further improving device stability. Nanografi Nanotechnology (Turkey) – Duygu Cevher provides an integrated formulation strategy for high-performance silver paste in solar cell metallization, examining how composition influences printing behaviour, firing response, contact formation, and electrical performance. Silver powder characteristics — particle size distribution, morphology, packing and tap density, surface properties — govern dispersion, screen passage, packing, and sintering; glass frit, though present in small amounts, controls the reaction with passivation layers and mechanical adhesion during firing; and the organic binder system determines viscosity, drying, open time, and the thixotropy needed for fine line definition. Current trends point toward finer lines, reduced silver consumption, lower contact resistance, and wider firing windows. Explore the full agenda and register early for the best rates. Encapsulation, Glass & End-of-Life HB Fuller (USA) – David McDougall examines the packaging demands unique to perovskite devices. Compared with conventional photovoltaic technologies, perovskites require lower-temperature packaging materials providing exceptional moisture and oxygen barriers, strong mechanical protection, and high optical transparency — a combination that presents new challenges for material suppliers. The talk reviews emerging polymer solutions and the technical challenges facing material developers as the technology transitions from laboratory-scale devices to field-ready modules. Everlight Chemical (Taiwan) – Yun-Chang Chao notes that while research focuses primarily on absorber and interface optimization, systematic discussion of encapsulation remains limited despite its strong influence on device lifetime and scalable manufacturing. Drawing on industrial validation projects and common failure modes, the talk presents a structured engineering perspective connecting material selection and structural design with long-term performance. Everlight has developed encapsulation materials for emerging PV since the DSSC era, with systems validated by academic and industrial partners across continents and published in internationally recognized journals. Tabernair (United Kingdom) – Martin Stephen presents certified perovskite BIPV glass — structural, transparent, and deployment-ready. Building-integrated photovoltaics demands that a module be a legitimate building material first and a solar device second, meeting structural and safety certification alongside performance. The detailed abstract will follow in the agenda. ZSW (Germany) – Cordula Wessendorf argues that with perovskite and tandem modules already reaching the market, it is time to think about recycling — especially since roughly one gram of lead per square metre must be kept out of landfill, alongside critical materials like indium, caesium, and silver. ZSW has developed an industrial-scale recycling process at 140–160 °C allowing over 96% of perovskite material to be recovered and reused. Crucially, modules are thermo-mechanically separated in one piece, so indium-containing TCO glass is recovered selectively and undamaged and substrate glass avoids the downcycling caused by shredding. Mini-modules made with recycled substrates and recycled PbI₂ achieved over 90% of the efficiency of those built from fresh materials. Explore the full agenda and register early for the best rates. Transparent Electrodes & ITO-Free Architectures PINA CREATION – Maryam Bari presents printable ITO nano inks for low-temperature fabrication of transparent conductive films. Conventional ITO deposition relies on high-temperature, vacuum-based processes that limit compatibility with flexible substrates and raise cost and energy consumption. This solution-processed ink offers controlled particle size, stable dispersion, and optimized rheology for scalable coating such as spin and slot-die, producing films with high optical transparency, good conductivity, and uniform morphology at processing temperatures below 150 °C. Power Roll (United Kingdom) – Neil Spann explores a scalable, ITO-free device architecture designed around ultra-low material usage and compatibility with high-throughput roll-to-roll production. A micro-structured substrate architecture enables efficient charge collection with no ITO or TCO, eliminating reliance on scarce or geopolitically constrained inputs, and by decoupling electrical performance from thick transparent conductive layers it supports flexible, lightweight photovoltaic films for large-area deployment. Experimental results demonstrate leading bifacial performance, improved angular and shading response, and resistance to pinholes — with a closing discussion of how such architectures enable cost-competitive perovskite PV at scale. Join Us in Berlin Robust tin oxide synthesis, industrial-volume fullerenes, air-stable Spiro inks, ITO-free architectures, and a recycling route recovering 96% of the perovskite — the materials layer of this industry is maturing fast. Meet the suppliers and institutes making it happen at the co-located exhibition. Explore the full agenda and register early for the best rates. Your pass also includes the co-located Electronics RESHAPED covering the entire world of R2R and printed electronics

What if the biggest bottleneck holding back the mass commercialization of all-day-wearable AI glasses isn't the display itself, but the way we track the user's eyes? For AR OEMs, display integrators, and product strategists, the trade-off has always been brutal: resource-heavy, power-hungry camera architectures that kill battery life, or subpar, sluggish user experiences. But a massive structural paradigm shift is coming. By stripping the camera out of the equation entirely and replacing it with ultra-low-power, high-frequency temporal sensing integrated directly into the lens, a new commercial pathway is opening up. This breakthrough unlocks true "always-on" natural user interfaces at up to 1000 Hz while keeping power budgets at an absolute minimum—solving a critical hardware hurdle for consumer-grade, lightweight smart glasses and redefining the competitive roadmap for next-generation spatial computing. Join us at MicroLED Connect and AR/VR Connect at the High Tech Campus in Eindhoven (Netherlands) on 16 and 17 Sept 2026 to see how this technology is reshaping the display and AR optics landscape, and catch this presentation: * Who is presenting: Antoine Boniface; * Company: AlphaLum; * Title of the talk: Camera-Free, Low-Power Eye Sensing for AI Glasses Using Self-Mixing Interferometry; * Where they will present: High Tech Campus, Eindhoven (Netherlands); * Event & Dates: MicroLED Connect and AR/VR Connect on 16 and 17 Sept 2026; * Full Program: https://www.microledconnect.com/;

Why Should You Join TechBlick's The Future of Electronics RESHAPED? The Future of Electronics RESHAPED conference and exhibition (21 & 22 OCT 2026, Estrel Congress Centre, Berlin) is set to be the most important event of the year focused on additive, hybrid, 3D, sustainable, wearable, soft and textile electronics. The event is co-located with Electronic Textiles RESHAPED, Sustainable Electronics RESHAPED, and Perovskite Connect, bringing the entire ecosystem together under one roof. In this article, we highlight a series of superb talks around the theme of digital deposition and inkjet printing — from printheads that finally break the viscosity barrier, to complete digital manufacturing platforms, to technologies that push additive precision down to the sub-micron level. In future articles, we will cover further themes including material, ink and paste innovations; manufacturing and hybrid integration; and printed electronics applications. Explore the full agenda now and register to join the event — one pass gives you access to all four co-located shows, the exhibition, and the TechBlick on-demand library. Breaking the Viscosity Barrier: Next-Generation Inkjet Printheads For decades, inkjet in electronics has been confined to low-viscosity, near-Newtonian fluids, leaving most functional pastes to analogue screen printing. In Berlin, four leading printhead makers will show how this decades-old limit is finally falling. XAAR (United Kingdom) – Karl Forbes examines how recent advances in inkjet technology are overcoming the low-viscosity constraint that has limited inkjet's role in production electronics manufacturing. The talk shows how innovations in printhead design and fluid management enable reliable deposition of high-viscosity functional materials such as polymer thick films, adhesives, and protective coatings, addressing the engineering challenges of scale-up including fluid handling, jetting stability, layer uniformity, and process repeatability — a step change positioning inkjet as a viable production platform. Seiko Instruments (Japan) – Fabio Tallarico presents results from a modified RC1536 piezoelectric printhead achieving stable, high-frequency jetting of an undiluted pseudoplastic fluid with rheological properties far beyond the traditional inkjet operating window. The talk explores how shear-thinning behavior influences droplet formation and jet stability, demonstrating that tailored printhead architectures can unlock reliable deposition of high-viscosity complex fluids for printed electronics and advanced material processing. KYOCERA Europe (Japan) – Daisuke Hozumi introduces a piezoelectric bend-mode inkjet printhead architecture developed for stable ejection of high-viscosity, non-Newtonian functional inks while retaining high resolution and high nozzle density. Combining a high-output piezoceramic actuator with an optimized internal flow-path design, the printhead has demonstrated stable jetting of a non-Newtonian ink exceeding 50 mPa·s (at 1000 s⁻¹) at room temperature — opening a wider operating window for conductive, insulating, and structural inks. Konica Minolta (Japan) – Kenji Mawatari shares new printhead driving technology for jetting higher-viscosity fluids using commercially available Konica Minolta printheads. Testing fluids between 10 and 50 mPa·s, the team confirmed that improved jetting efficiency using bi-polar waveforms and meniscus refilling control are key to ejecting higher viscosity fluids — extending the reach of proven industrial printheads without hardware redesign. Explore the full agenda and register early for the best rates. Digital Deposition Platforms & Process Reliability Beyond the printhead itself, industrial adoption demands complete systems: material handling, process monitoring, and production-grade reliability. Quantica (Germany) – Ben Hartkopp makes the case for digital functional material deposition based on direct volumetric displacement and mechanical actuation, overcoming legacy acoustic limitations to enable stable jetting of rheologically complex fluids up to 250 mPa·s. A key focus is processing heavily loaded conductive pastes and dielectrics with particle sizes up to 9 μm (D95) using continuous material recirculation — providing the engineered headroom for a fully flexible, scalable digital workflow. iPrint Institute (Switzerland) – Gioele Balestra addresses the practical "how-to" of high-viscosity jetting: formulating and characterizing highly concentrated non-Newtonian fluids where standard rheology fails, redesigning degassers, filters, and high-pressure ink delivery systems, and — critically — deploying real-time nozzle status sensing. In printed electronics, a single failing nozzle can compromise an entire part; this talk shows how nozzle-level monitoring delivers the process stability required to make inkjet truly fit for Industry 4.0. EPSON (Japan) – Enrico Sowade presents EPSON's "Printing Beyond the Color" activity and roadmap. As a printhead supplier, EPSON has established Inkjet Labs in Japan and Europe as hubs where companies with unique functional fluids can go far beyond drop-watching: comprehensive testing to integrate the fluid into a specific print process under controlled cleanroom conditions, running together as a co-pilot in the "Lab to Fab" concept. The talk covers the labs, typical activities, success stories, and the printhead roadmap for functional fluid applications. Notion Systems (Germany) – Notion Systems will present its digital additive electronic manufacturing platforms, spanning from industrial inkjet to EHD (electrohydrodynamic) printing. Notion Systems' n.jet platforms are already established in production environments for display, PCB, and semiconductor applications, and this talk will outline how the portfolio is expanding towards ultra-fine-feature EHD printing. Speaker and final talk details to be confirmed — watch the agenda for updates. Explore the full agenda and register early for the best rates. Ultra-High Precision: From Microns to Nanometers A third group of talks pushes additive deposition into territory once reserved for photolithography. Hummink (France) – Amr Maaroufi presents High Precision Capillary Printing (HPCaP), an advanced additive manufacturing technology achieving micron and sub-micron resolutions (50 µm down to 100 nm). Inspired by Atomic Force Microscopy, HPCaP operates via capillary forces, ensuring precise, splash-free deposition with minimal waste, and its macro-resonator system enables fine control over line width and thickness. HPCaP supports a wide range of conductive, dielectric, and functional inks on diverse substrates — including flexible and recyclable ones — and beyond high-resolution 2D printing, it enables microbump formation for advanced packaging and interconnect applications, reinforcing its role as a key technology in semiconductor fabrication. XTPL (Poland) – Witold Nawrot outlines recent progress in Ultra-Precise Dispensing (UPD), forming robust high-performance interconnections with feature sizes as small as 1 μm. Bridging the gap between standard inkjet and complex photolithography, this maskless technology dispenses highly concentrated nanoparticle inks — silver, gold, copper — as well as dielectrics, across demanding 3D substrate topographies. The talk demonstrates a transformative approach to Open Defect Repair (ODR) in ultra-fine RDLs for advanced packaging, UHDI PCBs, and next-generation high-resolution displays — maximizing yields and drastically reducing electronic waste. ImageXpert (USA) – ImageXpert will share practical guidance on selecting the right inkjet printhead based on paste properties and application requirements. Drawing on the company's extensive jetting analysis and drop-watching expertise — used across the industry to characterize jetting behavior of functional fluids — the talk will help attendees match fluid rheology and particle loading to printhead capabilities before committing to a platform. The full abstract will follow closer to the event. Explore the full agenda and register early for the best rates. Join Us in Berlin These twelve talks are only one slice of the program. At the co-located exhibition you will meet equipment makers, printhead suppliers, ink formulators, and integrators across the entire digital manufacturing value chain. Explore the full agenda and register now to secure the best rates. Your pass also includes the co-located Perovskite Connect, Electronic Textiles RESHAPED, and Sustainable Electronics RESHAPED — four world-class events, one venue, one ticket.

Why Should You Join TechBlick's Sustainable Electronics RESHAPED? Sustainable Electronics RESHAPED (21 & 22 OCT 2026, Estrel Congress Centre, Berlin) is where the global sustainable electronics industry takes form — reshaping the future of electronics layer by layer, through sustainable materials, efficient manufacturing, and circular designs. The event is co-located with Electronics RESHAPED, Electronic Textiles RESHAPED, and Perovskite Connect. The printed circuit board sits at the heart of electronics — and at the heart of its waste problem. In this article, we highlight talks around the theme of rethinking the PCB: bio-based substrates, additive and recyclable circuit fabrication, and greener production at industrial scale. In a companion article, we cover life cycle assessment, eco-design, and circular business models. Explore the full agenda now and register to join the event — one pass gives you access to all four co-located shows, the exhibition, and the TechBlick on-demand library. Bio-Based PCB Substrates: Wood, Cellulose, and Natural Fibres Holzforschung Austria (Austria) – Boris Forsthuber presents ecoPCBs on wood, developed within the EU-funded HyPELignum project. Conductive paths are printed onto wood substrates via inkjet or screen printing; the plywood ecoPCB concept prints circuitry into each veneer layer before gluing, connecting layers with vias to mimic a conventional multilayer PCB. Waterborne primers homogenize ink penetration on birch wood, and the screen-printing approach extends to timber construction (moisture and strain sensing) and furniture (touch sensing, VOC measurement with novel biomimetic smell sensors). EMPA (Switzerland) – Thomas Geiger presents printed circuit board substrates derived from cellulose nanofibrils. Lignocellulose nanofibrils obtained from lignin-rich pulp are dewatered under pressure and heat into rigid PCB substrates with a flexural strength of ~133 MPa and thermal conductivity comparable to epoxy-glass boards. A complete demonstration — a functioning wired computer mouse with inkjet-printed circuitry on an LCNF substrate and a 3D-printed PLA/wood housing — shows the readiness of these biodegradable substrates and points the way to sustainable eco-electronics. Jiva Materials (United Kingdom) – Steve Driver presents Soluboard — a fully recyclable rigid PCB laminate made from natural fibres and water-soluble polymers. Instead of shredding or incineration, end-of-life boards can be immersed in hot water: the substrate dissolves, releasing components and metals for clean recovery. The detailed abstract will follow in the agenda. Voltera (Canada) – Voltera presents printing PCBs on biodegradable substrates for end-of-life recovery. Known for its desktop electronics printers used across labs and workshops worldwide, Voltera will show how digitally printed circuits pair naturally with biodegradable substrates — putting sustainable prototyping and small-batch production within reach. Speaker and final abstract to be confirmed in the agenda. Explore the full agenda and register early for the best rates. Additive & Recyclable Circuit Fabrication Technische Hochschule Ingolstadt (Germany) – Gordon Elger presents a process-integrated approach for circular flexible electronics: biodegradable polymer substrates (PHB and bio-synthesized Polyamide-4 produced via metabolically engineered E. coli) combined with a particle-free copper complex ink sintered at just 150 °C under nitrogen. Fully additive patterning eliminates subtractive etching and copper waste; printed features reach ~3 µm thick continuous copper layers. Crucially, a solvent-based recycling protocol separates copper residues from the polymer, which is recast into second-generation films — demonstrating closed-loop substrate recovery without energy-intensive reprocessing. University of Maryland (USA) – Huaishu Peng presents dissolvable PCBs, leveraging water-soluble 3D printing and liquid metals for fully recyclable electronics — an approach where the entire circuit carrier is designed from the outset to come apart on demand, releasing components and conductors for recovery. The detailed abstract will follow in the agenda. CEA (France) – Lina Kadura presents the transformation of PCB production from subtractive to additive for sustainable electronics — replacing etch-and-waste process chains with additive fabrication that deposits material only where needed, cutting chemical use, energy, and scrap. Full talk details to be published in the agenda. DP Patterning (Sweden) – Tommy Höglund asks: how can sustainability and cost efficiency combine into a true win-win — and a disruptive force in flexible electronics? DP Patterning's unique mechanical roll-to-roll process eliminates waste-intensive steps for high-performance antennas, sensors, heaters, and interconnects. The talk covers the company's strategic transition from equipment supplier to flex-PCB production partner, its growth across Europe and North America, and its micro-plant strategy for localized, scalable manufacturing — showing that sustainability is no longer a trade-off but a catalyst reshaping business models. Explore the full agenda and register early for the best rates. Greener Production at Industrial Scale AT&S (Austria) – Christof Wernbacher outlines a practical approach to quantifying and reducing the carbon footprint of PCBs, using a Product Carbon Footprint methodology aligned with ISO 14067 combined with PCB-tailored eco-design. A dedicated bottom-up PCF tool enables hotspot identification, scenario analysis, and decarbonization monitoring across materials, processes, and energy — demonstrated through an automotive multilayer PCB use case featuring renewable energy, reduced copper and laminate thickness, material recycling, and bio-based alternatives. The talk emphasizes manufacturer–OEM collaboration to unlock the full potential of green electronics design. Infineon Technologies (Germany) – Moritz Schlagmann presents making electronics greener at the semiconductor level — from design to manufacturing. As one of the world's leading semiconductor makers, Infineon brings the sustainability discussion to the chip itself, where design choices and fab operations set the environmental baseline for everything built on top. The detailed abstract will follow in the agenda. Auburn University (USA) – Pradeep Lall presents AI-driven reliability: predictive life-cycle modeling for sustainable semiconductor packaging. Longer-lasting electronics are greener electronics — and Auburn's world-renowned reliability research shows how machine learning can predict degradation and lifetime, enabling packaging designed for durability rather than disposal. Full talk details to be published in the agenda. Explore the full agenda and register early for the best rates. Join Us in Berlin Wood, cellulose, natural fibre, and dissolvable boards; additive copper on biopolymers; carbon-accounted production lines — the PCB is being reinvented before our eyes, and Berlin is where the people doing it will be. Explore the full agenda and register now to secure the best rates. Your pass also includes the co-located Electronics RESHAPED, Electronic Textiles RESHAPED, and Perovskite Connect — four world-class events, one venue, one ticket.

16 & 17 September 2026 | High Tech Campus, Eindhoven, Netherlands The agenda is LIVE! It is time to explore the full agenda and book your tickets! This event will feature ✅MicroLED Connect,✅ AR/VR Connect and ✅Optical I/O Connect, uniquely bringing together the display, the semiconductor and the AI communities. The agenda is very strong, featuring the likes of Google, Microsoft, Meta, Sony, GlobalFoundries, AppliedMaterials, Samsung Display, EssilorLuxottica, Aumovio, and more. You can explore the agenda below The exhibition floor is also nearly sold out. The ground floor is in fact full and for the first time we have opened the space on the upper floor for exhibition too! ­ 📅When: 16 & 17 Sept 2026 (Masterclasses on 15 Sept 2026) 📍Where: High Tech Campus, Eindhoven, Netherlands 📋Combined Agenda: https://www.microledconnect.com/agenda-2026 Explore LIVE Agenda Now and Book Your Tickets Day1: 16.09.2026 09:15 | Track 1 | Sony | Challenges in democratizing AR glasses 09:35 | Track 1 | Google | Purpose-Driven Pixels: Aligning Display Tech with XR Use Cases 10:10 | Track 1 | Meta | AI glasses 11:15 | Track 1 | Hongshi Intelligence | What’s Next for MicroLED Micro-Displays: Hybrid Bonding, Metasurfaces, and System-Level Iteration 11:15 | Track 2 | Lumus | Synergistic Design of Micro-LED Projectors and Waveguides 11:35 | Track 1 | Adeia | 3D System Integration for MicroLEDs: Hybrid Bonding and Co-Optimization of GaN and Silicon 11:35 | Track 2 | Optinvent | Molded Polymer Reflective 2D Waveguide - A breakthrough for consumer AR 11:55 | Track 1 | WEVE Co., Ltd | Innovations in MicroLED Driver Architectures and System-Level Integration for Wearables 11:55 | Track 2 | Cellid | Displaying the Future: Advancing High-FOV Waveguide Design and Volume Manufacturing 12:15 | Track 1 | GlobalFoundries | Enabling CMOS backplanes for Microdisplays 12:15 | Track 2 | Applied Materials | Turning Breakthroughs into Reality: AI Glasses from First Etched Device to High-Volume Manufacturing 14:15 | Track 1 | Coherent | Fast and flexible - how lasers can solve the current technical bottlenecks for the mass production of microLED displays 14:15 | Track 2 | TriLite Technologies | Beyond mLED and LCoS: Laser beam scanning for high-efficiency AR displays 14:35 | Track 1 | VueReal | MicroLED Displays for Smartphones: Key Technical and Manufacturing Enablers for Commercial Viability 14:35 | Track 2 | vitrealab | Laser-LCoS – The Solution to AR Smart Glasses Challenges 14:55 | Track 1 | Holst Centre | Laser-Based Mass Transfer and Photonic Soldering for High-Yield MicroLED Integration 14:55 | Track 2 | Smith Displays Limited | The Transparency Paradox: Achieving AR in Crystal-Clear Displays 15:15 | Track 1 | Konica Minolta | (No title provided) 15:15 | Track 2 | Seagate Technology | From HDD to AR: Leveraging Wafer-Scale Photonics and High-Volume Manufacturing for Display Engines 16:20 | Track 1 | Avegant Corp. | Power is all you need ! 16:20 | Track 2 | Ingantec | Red MicroLEDs and Monolithic Full-Color Integration for AR, Medical Imaging & AI Interconnects 16:40 | Track 1 | Agency for Science, Technology and Research | One-micron pixel LCoS displays based on metasurface-integrated liquid crystal cells 16:40 | Track 2 | Aledia | High‑Performance Nanowire MicroLEDs for AR and Optical Interconnect Applications 17:00 | Track 2 | QubeDot | Direct-View MicroLED Arrays: Bridging the Gap Between Pixel Pitch and Optical Performance 17:20 | Track 2 | Oxford Instruments | (No title provided) 17:00 to 17:40 | Track 1 | Panel 1: Google AR | Meta | Center for eXtended Reality (CXR) | Display Training Center and Display Skeptics | Karl Guttag | Explore LIVE Agenda Now and Book Your Tickets Day 2: 17.09.2026 09:10 | Track 1 | Samsung Display | Micro LED for Display ; Challenges and Potential 09:30 | Track 1 | Center for Extended Reality / University of Rochester | Beyond Smart Display Glasses: Creating a path to Comfort, Context, and Depth in Spatial Computing. 09:50 | Track 1 | Microsoft | From Displays to Data Centers: The Promise and Reality of MicroLED Optical I/O for Next-Generation AI Infrastructure 10:10 | Track 1 | Mojo Vision | A wafers-in wafers-out Micro-LED Platform for AI* 11:10 | Track 1 | Nanoscribe GmbH & Co. KG | Additive 3D Microfabrication: Enabling Complex Micro-Optics and Compound Lenses for AR Systems 11:10 | Track 2 | Teradyne | Challenges of MicroLED testing 11:10 | Track 3 | CEA-Leti | Towards parallel communication using GaN microLEDs for chip to chip communication 11:30 | Track 1 | Hummink | Printed Metaoptics for AR/VR and Photonics 11:30 | Track 2 | TechnoTeam | Biomimetic Metrology Lenses for Near-Eye Displays: Diffraction-Limited AR/XR Quality Assurance 11:30 | Track 3| Avicena Tech | Wide, Slow, and Efficient: Redefining Optical Link Budgets with MicroLEDs 11:50 | Track 1 | EssilorLuxottica | POPULAR - Prescription Optics Providing a Universal Lens for Augmented Reality Eyewear 11:50 | Track 2 | Instrument Systems | Optical Metrology for MicroLED Displays and Wafers: Optimized Color-Matching Functions for Cross-Technology Product Portfolios 11:50 | Track 3 | University of California Santa Barbara | Development of GaN Based MicroLED Devices for Full Color Displays and High Speed Optical Communication 13:10 | Track 1 | Electronics and Telecommunications Research Institute | From Materials to OSAT: SITRAB Technology for Scalable Micro-LED Transfer and Bonding 13:10 | Track 2 | Eulitha | Displacement Talbot Lithography for Scalable AR Waveguide Manufacturing 13:10 | Track 3 | ALLOS Semiconductors | 300mm GaN-on-Si Epitaxy: Overcoming Cost and Yield Barriers for CMOS-Integrated MicroLEDs 13:30 | Track 1 | Technische Universität Ilmenau | Fluidic Self-Assembly of MicroLEDs: Scaling into the Deep Microscale 13:30 | Track 2 | Morphotonics | Multi-Wafer Nanoimprint Lithography: A Panel-Based Approach to Scalable AR Waveguide Manufacturing 13:30 | Track 3 | Tyndall National Institute, University College Cork | A Micro-LED Architecture for Enhanced Emission Directionality in Displays and Optical Interconnects 13:50 | Track 1 | Pixel-Flo | A scalability breakthrough for microLED mass transfer using a slot-die coating approach 13:50 | Track 2 | EV Group (EVG) | From Nanostructures to New Realities: The Role of Nanoimprint Lithography in AR 13:50 | Track 3 | Tera Electronics Corp. | Wide-and-Slow MicroLED Optical I/O for Al Infrastructure 14:40 | Track 1 | Aumovio | Advances in MicroLED for Automotive Applications 14:40 | Track 2 | Vizon Tech | What it'll take, to make Augmented Reality Glasses a mass adopted Reality. 15:00 | Track 2 | AlphaLum | Camera-Free, Low-Power Eye Sensing for AI Glasses Using Self-Mixing Interferometry 15:00 to 16:00 | Track 1 | Panel 2: Labbet Advice | Imec.xpand | Applied Ventures | Photonventures | LIFTT S.p.A | 15:20 | Track 2 | Vuzix | (No title provided) Global Program The program is truly global, bringing together all the key players from across North America, Europe and Asia at the High Tech Campus in Eindhoven. You can not afford to miss this event! Learn more here. Explore LIVE Agenda Now and Book Your Tickets ­ Exhibition Floor The exhibition floor is also nearly full. In fact, the ground floor is fully sold out and we are not opening the upper floor for the very first time. We encourage you to learn more about our packages here and book now. Contact khasha@techblick.com Explore LIVE Agenda Now and Book Your Tickets The MicroLED Connect + AR/VR Connect + Optical I/O Connect 2026 show offers a truly remarkable experience, full of networking, interactions, and superb talks. See some images from our 2026 event below. Explore LIVE Agenda Now and Book Your Tickets

Future of Electronics RESHAPED: USA conference arrives in Mountain View, California, on 10-11 June 2026. Held at the Computer History Museum, this global gathering focuses on the commercialization and technical advancement of additive, printed, 3D, and wearable electronics. This is the most important and the largest conference and exhibition of the year dedicated to printed electronics, additive electronics, 3D electronics, wearable electronics, flexible electronics and hybrid electronics. The 2026 agenda features deep-tech presentations from industry leaders covering material innovations, scalable roll-to-roll (R2R) manufacturing, and novel hardware applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link High-precision capillary printing, roll-to-roll VIA printing, and electrochemical additive manufacturing (ECAM) for thermal management. Sub-Micron Printing, Scalable FHE, and Next-Gen AI Cooling? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Keynote Presentations covering high-precision capillary printing, roll-to-roll VIA printing, and electrochemical additive manufacturing (ECAM) for thermal management. Hummink | Pascal Boncenne Topic: HPCaP (High Precision Capillary Printing) : A Technology for Advanced Packaging. Pascal explores the strict micron-scale limitations of traditional inkjet printing, which relies on external lasers, pressure, or UV energy and struggles with high-viscosity materials. The presentation reveals High Precision Capillary Printing (HPCaP), an AFM-inspired glass micropipette mechanism that leverages natural capillary forces and controlled resonance to deposit polymers and conductive inks down to 100 nanometers. This solution delivers a sustainable, sub-micron patterning alternative tailored for semiconductor packaging, display repair, and biosensors. TracXon | Thomas Kolbush Topic: Scaling Roll-to-Roll Flexible Hybrid Electronics: From Patented VIA Fabrication to Mainstream Manufacturing. The session explores the heavy infrastructure and resource-intensive constraints of decades-old subtractive PCB technology, which cannot sustainably scale to meet the demand for hundreds of billions of new IoT devices. The talk unveils the industry’s first commercial roll-to-roll VIA printer, an additive technology capable of manufacturing double-sided circuitry on flexible substrates 10x faster than traditional lines. This patented equipment provides a high-throughput, responsible blueprint that slashes CO₂ emissions by 5x and material consumption by 10x. Fabric8Labs | Michael Matthews Topic: Reshaping Thermal Management: How ECAM Unlocks Next-Gen Cooling for AI & High-Performance Computing. Michael explores how traditional skiving and powder-based 3D printing fail to manufacture the complex, high-resolution geometries required to cool AI accelerators pushing power densities beyond 4 W/mm². The talk introduces Electrochemical Additive Manufacturing (ECAM), which uses a micro-electrode array to deposit pure copper atom-by-atom at room temperature without thermal stress. This technology delivers a 90% lower greenhouse gas footprint while providing optimized cold plates that achieve an 8.2°C reduction in maximum temperature for data center cooling. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Next-Gen Wearable Electronics & Invisible Monitoring? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 2 covering wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Genentech (Roche Group) | Paul Upham Topic: Wearables in Pharma. Paul explores how traditional pharmaceutical development often lacks continuous, real-world data from the patient's home environment to establish stronger clinical endpoints. The talk highlights how integrating wearable technologies across multiple disease domains captures high-utility patient data. This work offers a powerful framework for utilizing wearables to improve clinical trial accuracy and accelerate drug development. GE Healthcare | Gurvinder Topic: Sustainability-to-Scalability in FHE: Screening LCA Insights and AI/ML-Enabled Manufacturing. Gurvinder explores the high environmental impacts and slow qualification cycles that limit the scale-up of conventional flex circuitry. The presentation reveals a life cycle assessment (LCA) proving printed flex reduces fabrication impacts by up to 80%, paired with an AI/ML workflow for in-line defect detection. This solution provides an optimized, low-emission roadmap for mass-producing vital sign monitoring patches. Datwyler Switzerland Inc. | Mattia Lucchini Topic: A Glimpse Inside: How Next-Gen Wearables are Unlocking Internal Physiological and Mental Insights. Mattia explores the current limitation of wearable devices, which have historically focused on superficial, external behavioral tracking rather than deeper internal states. The talk demonstrates how breakthrough functional materials and advanced sensor fusion unlock continuous access to complex biosignals like EEG and EMG. This work offers a transformative method for objectively assessing a user's true mental and physiological status unobtrusively. Linxens Heealthcare | Bryce Hinkson Topic: From Invasive to Invisible, How Wearable Technologies Transform Our Practices. Bryce explores the patient burden and clinical limitations associated with invasive, episodic healthcare monitoring solutions. The session outlines how advancements in flexible electronics and skin-contact sensors enable continuous, "invisible" physiological tracking without compromising medical accuracy or regulatory compliance. This solution provides healthcare providers and medtech innovators with a scalable pathway toward truly patient-centric care. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link The Future of Electronics RESHAPED: High-resolution 3D printing, advanced in-situ material annealing, and microgravity electronics manufacturing. High-Resolution 3D Printing & Space-Based Manufacturing of Electronics? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 3 covering high-resolution 3D printing, advanced in-situ material annealing, and microgravity electronics manufacturing. Holst Centre | Hylke Akkerman Topic: 3D Microelectronics Without Limits: High Resolution Printing for the Next Generation of Integration. Hylke explores how planar manufacturing constraints limit the transition to fully spatial, ultra-miniaturized electronic systems. The presentation details foil laminated stereolithography (f-SLA), which combines high-resolution UV structuring with vertical interconnects formed directly during printing. This work offers a highly sustainable, short-lead-time platform for embedded bare die integration at a 10–20 µm scale. Rice University | Yong Lin Kong Topic: Near-field microwave 3D printing of electronics. Yong explores a fundamental limitation in electronic 3D printing where the inability to selectively anneal materials destroys temperature-sensitive substrates. The talk reveals how focusing microwaves using a metamaterial-inspired near-field electromagnetic structure (Meta-NFS) achieves rapid, highly selective volumetric heating in situ. This solution provides a method to locally program electronic properties, broadening the material palettes compatible with 3D printing. Notion Systems | Simon Rihm Topic: From Subtractive to Additive: Shaping the Future of R&D with the new n.jet evo. Simon explores the complex manufacturing challenges that arise when trying to replace traditional subtractive process chains with additive steps. The session demonstrates how the n.jet evo desktop inkjet system allows R&D labs to evaluate new processes, functional inks, and substrates under industrial standards. This work offers a simple, efficient bridge to push additive manufacturing from lab concepts to industrial scale. NASA Marshall Space Flight Center | Cadre Francis Topic: In-Space Manufacturing of Electronics. Cadre explores the logistical risks of long-duration space missions that rely entirely on earth-supplied electronics rather than autonomous, on-demand fabrication. The presentation evaluates how material formulation and deposition behave in microgravity environments without gravity-assisted flow. This solution provides critical insights into establishing real-time print stabilization, enhancing the resilience of future space exploration architectures. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Multi-layer R2R mass production, high-resolution flexographic printing, and sustainable rotary screen printing for RFID. Roll-to-Roll (R2R) Mass Production of Printed Electronics? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 3 covering multi-layer R2R mass production, high-resolution flexographic printing, and sustainable rotary screen printing for RFID. Smooth & Sharp Corporation | Alan Wu Topic: A Proven R2R Production Solution of NFC Antenna. Alan explores the complexity barriers that usually prevent additive manufacturing from moving beyond single-layer UHF antennas to sophisticated electronic functions. The talk reveals successful large-scale mass production techniques for multi-layer RFID/NFC circuits. This work offers proof that complicated circuit designs are now possible at scale using additive R2R processes. Eastman Kodak Company | Carolyn Ellinger Topic: Flexography for High-Resolution Roll-to-Roll Manufacturing. Carolyn explores the boundaries of expanding volume production for high-resolution designs using traditional screen printing, which currently dominates printed electronics. The presentation provides an overview of how transitioning to roll-to-roll flexography can optimize the mass fabrication of highly replicated circuitry. This work offers a strategic analysis of the precise benefits and operational challenges of adopting flexo lines for high-volume manufacturing. SPG Prints | Daan Dekubber Topic: Mass-Producing Sustainable RFID: How the Basalt Printer Delivers High-Capacity Innovation. Daan explores the heavy material waste and high environmental costs associated with traditional aluminum-etched RFID manufacturing. The session introduces a roll-to-roll rotary screen printing process utilizing paper substrates and graphite-based conductive inks to cut production costs by up to 25%. This solution provides an affordable, highly scalable, and completely aluminum-free pathway for mass-producing eco-friendly tags. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Stretchable low-temperature Ag inks, micro-transfer printing of liquid metal, liquid metal elastomer thermal interfaces, and silver MOD inks. High-Performance Inks & Stretchable Electronic Materials? Here we introduce the talks to be given in Mountain View at Day 1, Track 2, Session 2 covering stretchable low-temperature Ag inks, micro-transfer printing of liquid metal, liquid metal elastomer thermal interfaces, and silver MOD inks. Heraeus Electronics | Sai Vijayaraghavan Topic: Ag Inks for Stretchable Electronics. Sai explores the critical design and processing trade-offs required to ensure low-temperature silver inks maintain robust and reliable performance under mechanical deformation. The presentation evaluates how material selection and cure parameters directly influence electromechanical properties. This work offers a validated framework for optimizing ink performance in next-generation stretchable devices. University of Southern California | Hangbo Zhao Topic: High-Resolution Liquid Metal-Based Stretchable Electronics Enabled By Colloidal Self-Assembly and Micro-Transfer Printing. Hangbo explores the manufacturing limitations that prevent liquid metal-based electronics from achieving scalable, high-resolution patterning below traditional macro-scales. The talk reveals an integrated method combining colloidal self-assembly and micro-transfer printing to achieve liquid metal particle features as small as 5 µm. This solution provides ultra-stretchable, low-impedance microelectrode arrays capable of high-resolution cardiac mapping under extreme deformations. Arieca Inc | Navid Kazem Topic: Liquid Metal Embedded Elastomer Composites for Thermal Management of Next Generation High Performance Computing. Navid explores the extreme thermal and warpage challenges in AI semiconductor packaging where power densities are outstripping conventional thermal interface materials. The presentation demonstrates how translating liquid metal embedded elastomer (LMEE) technology into packaging provides a unique combination of high thermal dissipation and soft mechanical compliance. This work offers a reliable material architecture to reduce power consumption in next-generation high-performance computing centers. Electroninks | Mitchell Smith Topic: Silver MOD Inks: Advancing Performance Beyond Particle Pastes. Mitchell explores the cost vulnerabilities and performance limits of traditional silver particle-based pastes facing volatile market pricing and high curing temperature requirements. The session breaks down the chemical mechanisms of metal organic decomposition (MOD) inks, which form denser conductive films using significantly less metal. This solution provides a lower-temperature curing pathway that opens high-performance conductive circuits to temperature-sensitive plastic substrates. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Embodied AI, intelligent cardiac monitoring, elastic multilayer printed circuits, and flexible ceramic battery solutions. Data, AI, and Advanced Materials for Next-Gen Wearables? Here we introduce the talks to be given in Mountain View at Day 1, Track 2, Session 3 covering embodied AI, intelligent cardiac monitoring, elastic multilayer printed circuits, and flexible ceramic battery solutions. Stanford University | Angela McIntyre Topic: Wearables as Embodied AI. Angela explores how traditional wearable devices often operate as passive trackers rather than closed-loop, physical agents that interpret and anticipate human intent. The session outlines how merging advanced machine learning with physical biological feedback allows AI to become physically "embodied." This framework provides the foundational hardware-software loop necessary to anticipate human movement and seamlessly bridge real-world biological feedback with physical hardware. Medtronic | Rohan Sonawane Topic: Data and AI in Cardiac Monitoring. Rohan explores the challenge of turning massive streams of continuous physiological data into timely, meaningful insights without overwhelming care teams with false alerts. The talk demonstrates how AI can interpret continuous cardiac data within context to highlight critical patient risks early. This solution provides an intelligent, proactive monitoring system that helps anticipate deterioration in heart failure care and guide personalized interventions outside the hospital. VTT | Tuomas Happonen Topic: Elastic Multilayer Printed Circuits. Tuomas explores the difficulty of manufacturing sensitive, interference-tolerant elastic circuits that can withstand the physical requirements of mixed-signal and RF applications. The presentation details a sheet-based manufacturing method that stacks pre-perforated TPU films and cures screen-printed conductive circuits with filled vias layer by layer. This work offers a robust architecture for integrating surface-mounted devices onto highly flexible, multilayer laminates. NGK Insulators LTD | Masahiro Furukawa Topic: Ceramic-Based Li-ion Rechargeable Battery Solutions Optimized for Close-Contact Remote Health Monitoring. Masahiro explores the need for ultra-safe, thin, and flexible battery solutions that can fit body contours without the safety risks of traditional organic components in skin-contact applications. The session introduces a semi-solid, ceramic-based Li-ion rechargeable battery featuring low self-discharge and high over-discharge resistance. This technology provides a highly reliable, fast-charging power source tailored for remote health monitoring patches and medical devices. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Yarn-sensor smart apparel, conductive silver ink printing on cotton, and mass-market scalability for wearables. Smart Apparel, Textile Printing, and Scaled Production? Here we introduce the talks to be given in Mountain View at Day 1, Track 2, Session 4 covering yarn-sensor smart apparel, conductive silver ink printing on cotton, and mass-market scalability for wearables. Texavie | Peyman Servati Topic: Empowering Personalized Therapy and Wellness Anywhere with Texavie’s MarsWear Smart Apparels. Peyman explores the difficulty of developing comfortable, everyday wearable therapeutics that provide clinicians with highly accurate, objective biometric data. The talk introduces a smart textile platform using advanced yarn sensor technologies and machine learning, alongside integrated patented solar fabrics for green energy harvesting. This solution provides an intelligent, highly versatile system for personalized therapy, gaming, and AR/VR control. Voltera | Giovanni Obando Topic: Wearable Electronics: Printing Silver Conductive Ink on Cotton Fabric. Giovanni explores the processing challenges and setting parameters required to print highly functional conductive inks directly onto rough, absorbent textiles like cotton without losing performance. The presentation evaluates the direct application of silver conductive inks to construct fully functioning heating elements. This work offers a validated manufacturing methodology for creating direct-to-fabric consumer products like heated medical and outdoor apparel. Quad Industries | Wim Christiaens Topic: Scaling wearable printed electronics for mass-market applications. Wim explores the technical bottleneck where high-functioning laboratory wearable prototypes consistently fail to achieve reliable, repeatable replication during mass industrial fabrication. The session analyzes real-world case studies to demonstrate how critical design choices and material selections impact the cost-effective production floor. This work provides an optimized framework for successfully scaling printed electronics into mass-market commercial applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Sustainable board-level additive manufacturing, printed embedded resistors, 3D MEMS IMU additive packaging, and programmable cloud-native PLM software. Additive Packaging, Printed Passives, and Next-Gen PLM Systems? Here we introduce the talks to be given in Mountain View at Day 1, Track 3, Session 2 covering sustainable board-level additive manufacturing, printed embedded resistors, 3D MEMS IMU additive packaging, and programmable cloud-native PLM software. Raytheon | An RTX Business | Daniel Hines Topic: Hybrid Electronics for Environmentally Sustainable Board Level, Additive Manufacturing of Passive Components. Daniel explores the strict size, weight, and power (SWaP) demands alongside traditional PCB material waste challenges that limit eco-friendly domestic electronics manufacturing. The presentation highlights hybrid electronics (HE) design methods used to print passive insulator materials for solder masks and replace bulky, heavy, manually tuned RF filters. This work offers a highly sustainable manufacturing alternative that enables tight, eco-friendly integration of digital and RF circuit card assemblies. UMass Lowell | Guinevere Strack Topic: Printed Resistors for Low-Cost Sustainable, Semi-Additive PCBs. Guinevere explores how current state-of-the-art embedded resistor technologies rely on complex, energy-intensive subtractive processes that generate excessive hazardous waste. The talk outlines an additive manufacturing framework for printing thick-film resistors directly onto PCB substrates using resistive inks. This solution provides a low-cost, scalable pathway to eliminate surface-mounted component counts, reduce parasitics, and seamlessly integrate additive technologies into high-throughput production lines. GE Aerospace Research | David Lin Topic: 3D MEMS IMU enabled by Additive Packaging. David explores how complex, rigid 3D assemblies of traditional MEMS inertial measurement units are highly vulnerable to package-induced stress and long-term thermal drift. The session reveals an innovative aluminum nitride (AlN) based additive packaging process that replaces multi-component frames with a single, compact, direct pick-and-place component. This technology provides an ultra-low SWaP-C IMU that yields a 3X improvement in thermally induced drift, optimized to survive harsh environmental navigation. Altium & Duro | Justin Sears & Michael Corr Topic: When Your Electronics Bend, Your PLM Shouldn't Break. Justin and Michael explore how hardware engineering groups adopting flexible, hybrid, and stretchable form factors are constrained by legacy, rigid Product Lifecycle Management (PLM) architectures. The talk breaks down a modernized approach featuring cloud-native, AI-driven, and API-first architectures that treat product data as an automated, living, and queryable ecosystem. This framework offers electronic hardware teams the infrastructure to accelerate design iterations much like modern agile software teams. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Fine-line screen printing, conductive ink formulations, alternative metal paste equipment, and nano-surface mesh treatments. Fine Line Screen Printing & Material Innovations? Here we introduce the talks to be given in Mountain View at Day 1, Track 3, Session 3 covering fine-line screen printing, conductive ink formulations, alternative metal paste equipment, and nano-surface mesh treatments. Sefar | Mark Pintar Topic: Fine Line Screen Printed Electronics. Mark explores the critical operational gap between lab-scale possibilities and real-world floor practicality in modern screen printing workflows. The presentation breaks down practical manufacturing limits and demonstrates how to optimize current setup assets for high-precision jobs. This work provides attendees with a direct baseline to audit their current printing infrastructure for fine-feature readiness. Nagase ChemteX | Brandon Peters Topic: Materials and Process Innovations in Fine Line Conductive Ink Printing. Brandon explores the complex synchronization needed between ink chemistry, screen engineering, and substrate properties to prevent line blurring at advanced micro-scales. The session reveals how careful adjustments to mesh counts, emulsion profiles, and substrate surface energies dramatically improve electrical performance and line definition. This solution delivers a robust roadmap for achieving highly repeatable ultra-fine feature resolution. Conductive Technologies | Alicen Pittenger Topic: Process Improvements in Materials and Equipment for Printed Electronics. Alicen explores how raw silver market volatility and outdated equipment registration limit cost-sensitive, high-volume production lines. The talk highlights the adoption of alternative silver-carbon blends and copper inks paired with high-speed Sakurai optical registration press hardware. This combination provides a predictable framework to boost print precision, stabilize material costs, and scale production runs with confidence. MicroScreen LLC | Art Dobie Topic: Effect of Hydrophobic/Oleophobic Nano Surface Treatment on the Release of Resistive PTC carbon paste from Emulsion Screens for Screen-Printed Heater Applications. Art explores the poor paste release and sticky screen-peel behavior that degrades print accuracy when using resistive PTC carbon pastes for printed heater elements. The presentation evaluates the transfer of successful stencil nano-coatings directly onto PVA-PVOH emulsion screen cavities to smooth the paste release dynamics. This empirical study delivers quantified deposition data to resolve transfer-efficiency issues in functional paste printing. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Silver-coated copper trace pastes, printed antenna processing, and full silver ink substitution with copper High-Performance Copper Substitutes & Antenna Materials? Here we introduce the talks to be given in Mountain View at Day 1, Track 3, Session 4 covering silver-coated copper trace pastes, printed antenna processing, and full silver ink substitution with copper Tatsuta | Robert Wilson Topic: Silver-Coated Copper Particle Circuit Trace Conductive Pastes. Robert explores how severe oxidation issues in fine copper particles compromise reliability, while pure silver inks remain too expensive for mass additive PCB/FPC workflows. The talk details an innovative silver-coated copper particle trace paste that reduces CO₂ emissions to 18% and liquid waste to 7% compared to subtractive chemical etching. This work offers an economically competitive, eco-friendly solution for high-volume manufacturing lines. Henkel | Julie Ferrigno Topic: Materials & Processes for Printed Antennas. Julie explores the processing trade-offs required to maintain precise feature uniformities and low surface roughness for high-frequency RF antenna structures. The presentation evaluates the performance spectrum of high-conductivity silver inks, lower-cost silver-plated copper (SPC) alternatives, and high-throughput 3D pad printing methods. This work provides an optimized material selection framework for balancing production costs with strict RF performance metrics. Copprint | Ofer Shochet Topic: Silver performance, copper price – the inevitable transition to copper. Ofer explores how massive demand surges from photovoltaics and EVs have turned raw silver into a punishing "silver tax" that heavily threatens the gross margins of printed electronics. The session challenges the long-term viability of silver-coated alternatives, presenting the technical and financial case for full copper ink substitution. This solution maps a realistic transition pathway to help manufacturers manage risk and shield their supply chains from raw material price volatility. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Additive high-temperature antennas, flexible mmWave copper antennas, laser-assisted ultra-high adhesion traces, and inkless dry-additive nanomanufacturing. High-Temperature Antennas, Fine-Line Copper, and Inkless Nano-Printing? Here we introduce the talks to be given in Mountain View at Day 2, Track 1, Session 1 covering additive high-temperature antennas, flexible mmWave copper antennas, laser-assisted ultra-high adhesion traces, and inkless dry-additive nanomanufacturing. Lockheed Martin | Paul Gaylo Topic: Enabling High Temperature Antennas with Additive Manufacturing. Paul explores how extreme heat environments present severe engineering challenges that cannot be resolved by high-temperature materials alone. The presentation outlines how traditional fabrication methods fall short in managing the tight dimensional tolerances, mechanical joints, and metal-ceramic integration required for these devices. This work demonstrates how advanced additive manufacturing provides a preferred path to production by embedding multi-material interfaces and precise microstructural control into complex, heat-resilient antenna geometries. NoiseFigure Research | Manish Ojha Topic: High-Resolution Printed Copper Antennas for Flexible mm Wave Electronics. Manish explores the lack of flexible mmWave antennas capable of high resolution and high production speeds for 24 GHz applications. The talk presents screen printing with copper conductive inks on polyimide and alumina ribbon ceramics to achieve an exceptional 50 µm resolution at a speed of 10,000 sq mm/s. This work offers a proven method for integrating bare die chipsets with flexible antennas, showing strong agreement between simulation and measured performance. Akoneer | Tadas Kildusis Topic: Creating high density and high adhesion Cu traces on any dielectric substrate. Tadas explores the difficulty of achieving high feature density alongside strong trace adhesion when trying to pattern copper across diverse, non-traditional dielectric substrates. The session introduces the SSAIL direct-write method, which utilizes ultrashort pulsed laser and chemical processing to plate electroless copper traces down to 1 µm. This technology provides excellent surface roughness and trace adhesion of 6–30 N/mm², optimized for high-power and high-frequency applications. NanoPrintek | Masoud Mahjouri-Samani, PhD Topic: Beyond Inks: Physics-Driven, AI-Enabled Additive Nanomanufacturing for Standardized Electronics. Masoud explores how reliance on complex, proprietary chemical ink formulations limits process stability, certification, and long-term supply-chain independence. The talk unveils an inkless, dry-additive nanomanufacturing platform that generates pure solid nanoparticles on demand, transporting and laser-sintering them in real time without binders or solvents. This physics-driven approach integrates AI closed-loop optimization to establish a deterministic, qualification-ready manufacturing standard. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Extreme-temperature thermocouple inks, 3D carbon microheaters, pilot-scale graphene printing, and high-purity carbon nanotube AI hardware. High-Temperature Materials & Advanced Carbon Nanomaterials? Here we introduce the talks to be given in Mountain View at Day 2, Track 2, Session 1 covering extreme-temperature thermocouple inks, 3D carbon microheaters, pilot-scale graphene printing, and high-purity carbon nanotube AI hardware. Applied Nanotech Inc | Richard Fink Topic: Novel Ink Development, Characterization, and Tests for Extreme Environments. Richard explores the severe shortage of cost-effective printed electronics capable of surviving oxygen-rich environments above 800 °C. The presentation details the development of Chromel and Alumel inks for Type-K thermocouples, alongside molybdenum materials protected by an oxidation barrier for high-temperature ceramic antennas. This work demonstrates a predictable, linear frequency shift in air, providing a robust sensing framework for extreme thermal environments. iGii (Integrated Graphene) | Michelle Ntola Topic: 3D Carbon Nanomaterials to Change the Landscape of Functional Materials. Michelle explores the supply-chain risks and high costs facing manufacturers heavily reliant on silver and traditional metal-heavy electrode formulations. The talk highlights Gii, a proprietary 3D carbon platform engineered as a metal-lean, drop-in alternative for roll-to-roll microheaters reaching 400 °C and high-reproducibility printed batteries. This solution provides a highly scalable, low-temperature fabrication method capable of producing millions of robust, cost-stable components annually. Graphene Engineering Innovation Centre | Andrew Strudwick Topic: Graphene and 2D materials printed electronics. Andrew explores the technical gap between early laboratory excitement for 2D materials and the commercial scale-up required for practical industrial deployment. The session outlines how pilot-scale printing equipment and collaborative research frameworks accelerate the transition of graphene into next-generation products. This work provides an established engineering pathway for integrating 2D materials into environmental health sensors, flexible electronics, and energy-efficient heating elements. NanoIntegris Technologies | Jefford Humes Topic: Beyond Silicon: High‑Purity Semiconducting Carbon Nanotubes as a Foundation for Next‑Generation AI Hardware. Jefford explores the physical and economic boundaries of conventional silicon, which currently constrain the energy efficiency needed for modern AI computing workloads. The talk reveals how high-purity semiconducting single-walled carbon nanotubes (s-SWCNTs) remove metallic degradation pathways to enable low-power, high-mobility field-effect transistors. This technology provides a printable, low-temperature fabrication standard for building reconfigurable edge devices, neuromorphic hardware, and energy-efficient in-memory computing systems. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Electroactive P(VDF-TrFE) coatings, capacitive keyboard production, printed trace PFAS detection sensors, and in-line R2R laser ablation patterning. Functional Surfaces, Smart Interface Printing, and Real-Time Environmental Sensing? Here we introduce the talks to be given in Mountain View at Day 2, Track 3, Session 1 covering electroactive P(VDF-TrFE) coatings, capacitive keyboard production, printed trace PFAS detection sensors, and in-line R2R laser ablation patterning. ALQIO | Fabien Resweber Topic: Empowering Scalable Innovation in Functional Surfaces. Fabien explores the challenge of transitioning flexible electroactive applications from experimental design to reliable, high-volume industrial processing. The presentation focuses on advanced formulation and coating capabilities utilizing piezoelectric P(VDF-TrFE) copolymers. This work offers a robust manufacturing pathway to integrate flexible haptic interfaces, heating surfaces, and medical instrumentation seamlessly into mass-market product architectures. INO, d.o.o., Žiri | Matjaz Finzgar Topic: Printing Touch: Equipment and Process Perspectives on Capacitive Keyboard Production. Matjaz explores the critical process bottlenecks of capacitive keyboard manufacturing, where multi-layer registration errors and improper ink curing routinely threaten mechanical and electrical reliability. The talk outlines targeted equipment and process adjustments designed to maintain highly precise pattern geometries during scale-up. This solution provides a practical manufacturing blueprint to stabilize high equipment and material costs during the shift from prototyping to production. Brewer Science | Shane Gumm Topic: Printed Electronics Solutions for Trace PFAS Detection and Measurement. Shane explores the major logistical bottleneck in environmental monitoring where dangerous, trace-level PFAS contaminants can only be identified via slow, expensive, centralized laboratory mass spectrometry. The session introduces a species-selective, low-cost printed sensor platform capable of executing rapid, real-time field testing. This advanced thin- and thick-film deposition technology delivers a decentralized monitoring model to empower utilities and communities with instant environmental data. Intellivation LLC | Mark George Topic: R2R Platform for Deposition of Active and Passive Thin Films and Patterning for Flexible Electronic Sensors and Devices. Mark explores the high cost and labor-intensive constraints of using traditional mask lithography for patterning flexible active and passive thin films. The presentation demonstrates a high-throughput roll-to-roll sputtering platform paired with in-line laser ablation to pattern multilayers without causing sub-surface substrate degradation. This physics-driven solution combines digital laser annealing and subtractive patterning to manufacture fully functional flexible sensors rapidly and cost-effectively. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Solvent-free vapor jet printing, roll-to-roll printed OLED light films, and interactive organic electronic smart packaging. Mask-less Deposition & Printed OLED Technologies? Here we introduce the talks to be given in Mountain View at Day 2, Track 1, Session 2 covering solvent-free vapor jet printing, roll-to-roll printed OLED light films, and interactive organic electronic smart packaging. Universal Display Corporation | Mike Hack Topic: Universal Vapor Jet Printing (UVJP) - a Transformative Dry, solvent-free Printing and Deposition Technology. Mike explores the processing vulnerabilities of printing organic electronics via methods dependent on aggressive solvents and complex, multi-step lithography. The presentation unveils a digitally programmable, mask-less UVJP deposition platform that jets functional materials at low temperatures without any solvents. This technology provides a highly sustainable manufacturing alternative that protects solvent-sensitive substrates and unlocks previously unattainable device architectures. Sinovia Technologies | Whitney Gaynor Topic: Roll-to-Roll Printed Light Film. Whitney explores how heavy reliance on expensive, ultra-high-vacuum deposition processes restricts organic light-emitting diodes (OLEDs) from achieving widespread, affordable commercial scale. The talk details the core fluid dynamics and layer uniformity principles required to successfully manufacture OLEDs via high-throughput flexographic printing lines. This work offers a strategic roadmap for using proprietary transparent conductive films to scale low-cost light films for Human-Machine Interface (HMI) applications. Inuru | Speaker Marcin Ratajczak Topic: Seamless Integration of Printed OLEDs into Smart Packaging and Consumer Surfaces. The session explores how inkjet printing OLED lighting can create fully new use cases and applications. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link FHE-enabled soft robotics, electrohydraulic artificial muscles, and multimodal printed tactile sensors. Soft Robotics & Human-Like Tactile Sensing? Here we introduce the talks to be given in Mountain View at Day 2, Track 2, Session 3 covering FHE-enabled soft robotics, electrohydraulic artificial muscles, and multimodal printed tactile sensors. GE Aerospace | Deepak Trivedi Topic: FHE Enabled Soft Robotics: Scaling Intelligence Beyond Compute. Deepak explores the scaling limitations of conventional robotics, which concentrate functions in rigid assemblies with centralized processing and suffer from exponential control burdens as degrees of freedom multiply. The presentation demonstrates an emerging paradigm where flexible electronics shift robots from assembled subsystems into unified functional materials with co-located sensing, actuation, and memristive neuromorphic computing. This work leverages materials science and electronic manufacturing to manage continuous deformation fields and enable edge-level feedback loops. Artimus Robotics | Eric Acome Topic: From Rigid Motors to Flexible Artificial Muscles: The Development of Polymer-Based Electrohydraulic Actuators. Eric explores how physical AI is structurally limited by standard electric motors, which suffer from poor adaptability, high heat generation, and complex miniaturization. The talk details HASEL electrohydraulic actuators that utilize thin polymer films, flexible printed conductors, and liquid dielectrics to serve as true artificial muscles. This technology delivers direct linear motion and high power-to-weight ratios for dexterous robotic hands, wearables, and bio-inspired machinery. Yamagata University | Shizuo Tokito Topic: Flexible Printed Sensors for Robotic Hands: Toward Human-Like Tactile Sensing. Shizuo explores the lack of lightweight, conformable tactile arrays needed to give humanoid robotic platforms human-like skin sensitivity and precise object manipulation. The session outlines a printing-based fabrication process using printed silver electrodes and porous, carbon-based piezoresistive and piezoelectric polymer inks. This advanced integration of materials science and flexible electronics enables robotic hands to detect subtle pressure, shear force, texture, and temperature for delicate object handling. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Dual-use hybrid validation frameworks, circular IoT hardware recycling, and viscous-jet drop-on-demand digital printing. Manufacturing Readiness, Circular IoT, and High-Viscosity Jetting? Here we introduce the talks to be given in Mountain View at Day 2, Track 3, Session 2 covering dual-use hybrid validation frameworks, circular IoT hardware recycling, and viscous-jet drop-on-demand digital printing. NextFlex | Dan Gamota Topic: Manufacturing Readiness for Hybrid Electronics. Dan explores how a lack of standardized industrial data and validated qualification pathways currently slows the transition of hybrid electronics from lab innovations to mass deployment. The presentation identifies critical manufacturing challenges and roadmaps the technical requirements for conformal RF and integrated sensing systems across defense and commercial sectors. This work offers improved validation frameworks to accelerate cross-sector collaboration and secure distributed production lines. Boeing | Kalsi Kwan Topic: Sustainable Additive Electronics for IoT Devices. Kalsi explores the massive global waste and fragile supply chains associated with conventional subtractive, un-recyclable microcontroller assemblies used in IoT devices. The talk details early-stage product design optimized for low-volume additive print chemistries, biodegradable substrates, and specialized repairable manufacturing processes. This solution outlines a circular framework to safely recover, test, and reuse expensive, reliably sourced microcontroller components at a product's end-of-life. Printed Electronics Limited | Neil Chilton: Topic:Printing with High Viscosity Fluids In this session, Neil explores the dominance of screen printing in fabricating printed electronics, driven by its ability to process highly-loaded functional inks (exceeding 5,000 cP) for single-pass performance. After evaluating the strengths and limitations of state-of-the-art screen printing, Neil addresses the challenges of transitioning these viscous inks to a digitally-defined process, where traditional inkjet printing is fundamentally limited to low-viscosity fluids (under 100 cP). To bridge this gap, the presentation will showcase innovative processes and systems developed at PEL. By highlighting Piezovalve viscous-jet deposition and other advanced drop-on-demand methods, Neil will demonstrate several viable technologies for digitally printing extremely viscous functional materials. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Plasma jet conformal printing, single-step surface tuning and sintering, and in-flight aerosol plasma reduction. Single-Step Plasma Printing & Aerosol Metallization? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 3 covering plasma jet conformal printing, single-step surface tuning and sintering, and in-flight aerosol plasma reduction. Space Foundry | Ram Gandhiraman Topic: Plasma Jet Printing of Conformal Electronics for Electronic Warfare. Ram explores how conventional planar manufacturing cannot easily embed sophisticated electronics onto the curved body panels and nose cones of large, airborne RF structures. The talk reveals a gravity-independent plasma jet printing technology that uses electromagnetic fields to achieve in-situ chemical reduction of metal ions like copper and silver. This solution provides an industrially feasible path to print antennas and frequency-selective surfaces directly onto non-planar military drone surfaces without post-cure processing. Oregon State University | Harish Subbaraman Topic: Plasma-Assisted Processing for Surface Property Tuning, Sintering, and Pattering: Towards Applications in Flexible Hybrid Electronics. Harish explores the efficiency bottlenecks of traditional flexible electronics printing methods, which are bound to a slow, multi-stage workflow of substrate pretreatment, material printing, and separate sintering. The presentation outlines the unique capacity of plasma-jet printing to condense this three-step process into a single step while tandem-depositing multiple materials. This work offers a hybrid approach to pattern sub-micron metal features on-demand, reducing waste and cost for high-performance flexible devices. New Mexico State University | Chaitanya Mahajan Topic: Single-step aerosol printing of metallic nanostructures via in-flight plasma reduction. Chaitanya explores how traditional direct-write metallic printing rarely achieves functional conductivity in a single step, requiring heat-intensive post-processing that destroys temperature-sensitive substrates. The session details a low-temperature, plasma-assisted aerosol deposition process that achieves direct in-flight metallization and co-deposition of nickel and copper biphasic alloyed films. This work establishes a clear process-structure framework optimized for rapid space manufacturing and biocompatible electronic coatings. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link Smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Intelligent Labels, Biosensing Patches, and Multi-Modal Tracking? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 1 covering smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Tapecon | Brad Hull Topic: The Evolution of Smart Labels: From Identification to Intelligent Interaction. Brad explores how standard barcoded identification no longer satisfies the data demands of modern logistics, healthcare, and retail ecosystems. The presentation outlines a versatile toolbox of emerging technologies designed to transform passive packaging into intelligent devices capable of autonomous authentication, sensing, and communication. This work provides original equipment manufacturers (OEMs) with a practical guide to speed up distributed workflows and enable real-time interactive product tracking. DuPont | Julia Kozhukh Topic: Skin-Friendly Biosensing Patches for Excellent Signal Quality and Patient Comfort. Julia explores the medical and technical challenges of remote cardiac monitoring, where standard patch materials cause skin irritation and suffer from signal degradation during extended patient wear. The talk details an innovative patch design utilizing silicone pressure-sensitive adhesives combined with specialized, silicone-based dry electrodes. This solution delivers an ultra-comfortable, skin-friendly architecture that maintains excellent signal quality to support early clinical detection of post-operative cardiac anomalies. University of North Carolina | Wubin Bai Topic: Multi-modal noninvasive in vivo biosensing system to leverage sensor-algorithm synergy for enhanced accuracy. Wubin explores the physical limitations of current muscle tracking devices, which are constrained by superficial surface measurements or rigid ultrasound hardware requiring specialized skin coupling. The session introduces a wireless wearable system combining deep-penetrating near-infrared (NIR) light sensors with an integrated inertial measurement unit (IMU). Powered by a recurrent neural network (RNN), this multi-modal platform filters out motion artifacts to deliver highly accurate, non-invasive tracking for rehabilitation feedback and neuromuscular disease diagnostics. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link

Intelligent Labels, Biosensing Patches, and Multi-Modal Tracking? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 1 covering smart interactive label technologies, silicone-based dry electrode biosensing, and AI-boosted neuromuscular tracking. Tapecon | Brad Hull Topic: The Evolution of Smart Labels: From Identification to Intelligent Interaction. Brad explores how standard barcoded identification no longer satisfies the data demands of modern logistics, healthcare, and retail ecosystems. The presentation outlines a versatile toolbox of emerging technologies designed to transform passive packaging into intelligent devices capable of autonomous authentication, sensing, and communication. This work provides original equipment manufacturers (OEMs) with a practical guide to speed up distributed workflows and enable real-time interactive product tracking. DuPont | Julia Kozhukh Topic: Skin-Friendly Biosensing Patches for Excellent Signal Quality and Patient Comfort. Julia explores the medical and technical challenges of remote cardiac monitoring, where standard patch materials cause skin irritation and suffer from signal degradation during extended patient wear. The talk details an innovative patch design utilizing silicone pressure-sensitive adhesives combined with specialized, silicone-based dry electrodes. This solution delivers an ultra-comfortable, skin-friendly architecture that maintains excellent signal quality to support early clinical detection of post-operative cardiac anomalies. University of North Carolina | Wubin Bai Topic: Multi-modal noninvasive in vivo biosensing system to leverage sensor-algorithm synergy for enhanced accuracy. Wubin explores the physical limitations of current muscle tracking devices, which are constrained by superficial surface measurements or rigid ultrasound hardware requiring specialized skin coupling. The session introduces a wireless wearable system combining deep-penetrating near-infrared (NIR) light sensors with an integrated inertial measurement unit (IMU). Powered by a recurrent neural network (RNN), this multi-modal platform filters out motion artifacts to deliver highly accurate, non-invasive tracking for rehabilitation feedback and neuromuscular disease diagnostics. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link

Next-Gen Wearable Electronics & Invisible Monitoring? Here we introduce the talks to be given in Mountain View at Day 1, Track 1, Session 2 covering wearables in pharma, sustainable FHE manufacturing, internal physiological insight tracking, and body-integrated medical sensors. Genentech (Roche Group) | Paul Upham Topic: Wearables in Pharma. Paul explores how traditional pharmaceutical development often lacks continuous, real-world data from the patient's home environment to establish stronger clinical endpoints. The talk highlights how integrating wearable technologies across multiple disease domains captures high-utility patient data. This work offers a powerful framework for utilizing wearables to improve clinical trial accuracy and accelerate drug development. GE Healthcare | Gurvinder Topic: Sustainability-to-Scalability in FHE: Screening LCA Insights and AI/ML-Enabled Manufacturing. Gurvinder explores the high environmental impacts and slow qualification cycles that limit the scale-up of conventional flex circuitry. The presentation reveals a life cycle assessment (LCA) proving printed flex reduces fabrication impacts by up to 80%, paired with an AI/ML workflow for in-line defect detection. This solution provides an optimized, low-emission roadmap for mass-producing vital sign monitoring patches. Datwyler Switzerland Inc. | Mattia Lucchini Topic: A Glimpse Inside: How Next-Gen Wearables are Unlocking Internal Physiological and Mental Insights. Mattia explores the current limitation of wearable devices, which have historically focused on superficial, external behavioral tracking rather than deeper internal states. The talk demonstrates how breakthrough functional materials and advanced sensor fusion unlock continuous access to complex biosignals like EEG and EMG. This work offers a transformative method for objectively assessing a user's true mental and physiological status unobtrusively. Linxens Heealthcare | Bryce Hinkson Topic: From Invasive to Invisible, How Wearable Technologies Transform Our Practices. Bryce explores the patient burden and clinical limitations associated with invasive, episodic healthcare monitoring solutions. The session outlines how advancements in flexible electronics and skin-contact sensors enable continuous, "invisible" physiological tracking without compromising medical accuracy or regulatory compliance. This solution provides healthcare providers and medtech innovators with a scalable pathway toward truly patient-centric care. Final early bird rates expire on 30 May. Register Now! Agenda: Link Registration: Link