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To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick Engineering Functionality: Sensors Sensors are at the heart of modern technology - integrated into devices we use every day to enhance healthcare, fitness, safety, and comfort. From monitoring vital signs to enabling smart industrial systems, sensors are transforming the way we interact with the world. Depending on the application, sensors come in many forms, each with its own materials, requirements, and performance considerations. Below are a few examples of sensors that are key to next-generation sensor innovation. Biosensors & Electrochemical Sensors:  Measure biological and chemical reactions by generating signals proportional to analyte concentration. PTC Heaters:  Regulate temperature through self-limiting properties that enhance safety and efficiency. Temperature Sensors:  Monitor and maintain optimal conditions using precise electrical signals. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend These sensors find use across  wearable ,  diagnostic , and  industrial  applications, each with distinct design and material needs: Wearables Flexible and stretchable materials Stretchable inks Adhesive layers (for housing-to-patch or multilayer adhesion) Conductive skin contact layers Diagnostics Rigid or flexible substrates Microfluidic integration Specialized ink selection Sputtered precious metals Biochemical compatibility Industrial Durability under harsh conditions Long-term stability Resistance to temperature, moisture, and mechanical stress When designing any sensor,  key factors  such as  biocompatibility, sensitivity, selectivity, stability, and durability  must guide every decision. Material Selection Process: Define the use case Identify biological, mechanical, and electrochemical requirements Select candidate materials Prototype, test, and optimize Validate performance Sensors are more than components - they’re the foundation of innovation across industries. As demand grows for smarter, more connected, and more sustainable technologies, material and design choices will define the next generation of performance. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend

Electronics encapsulation refers to the process of enclosing and protecting electronic components, circuits, or chips in a durable material or “package.” The encapsulating material (sometimes called a molding compound or potting compound) serves as a barrier against environmental factors like moisture, dust, and harsh chemicals, and shields the device from mechanical stress and vibration. Over the decades, encapsulation approaches have evolved significantly. Historically, hermetic encapsulation (a method of sealing sensitive electronic components inside airtight metal or ceramic enclosures) was common, as it completely blocked moisture and gases. This was especially important in aerospace or military-grade devices [1].  Since the 1970s, the industry has shifted toward polymer-based plastic encapsulation due to its low cost, ease of processing, and high throughput. Today, encapsulating components usually involves applying polymer resins (epoxies, silicones, polyurethanes, etc.) using automated dispensing, molding, or conformal coating systems.  Common types of encapsulation Potting electronics Schematic of an encapsulated PCB assembly, adapted from © Hu C., et al ., CC BY 4.0 In the context of electronics and semiconductors, potting and encapsulation are often used interchangeably. Potting is an encapsulation process where an entire electronic assembly or a larger section of a circuit is placed into a mold (often referred to as a “pot”) and then filled with a potting material (typically a resin) to cure into place. Potting applications include: Submersible or outdoor electronics in harsh environments High-voltage circuits (to prevent arcing) [2] Tamper-resistant  designs Dam and fill A chip partially encapsulated using dam and fill © Tabrizi, H. O., et al ., CC BY 4.0 A less common variant of potting, dam-and-fill involves first dispensing a high-viscosity “dam” around the component, then flooding the enclosed area with a lower-viscosity encapsulant. Unlike potting, which submerges the entire assembly, dam-and-fill targets only specific areas, allowing precise control over material placement while minimizing resin use. This makes it useful for precision applications or components that require partial exposure, such as optical sensors or fluid-contact electrodes, though it is less widely used than potting or glob-top methods. Direct encapsulation A glob of silicone encapsulant dispensed on interdigitated combs, adapted from © Lamont, C., et al ., CC BY 4.0 Direct encapsulation refers to dispensing an encapsulation material directly over a semiconductor die or electronic component mounted on a substrate (e.g., a PCB) and then curing it in place. It is a direct method because the encapsulant is applied only to the needed area on the board, without needing a dam or a pot. Once cured, the dispensed material forms a hardened “glob” that covers the device and its wire bonds. As such, direct encapsulation is also called glob-top encapsulation. It is widely used in: High-density PCBs Miniaturized packages where space and weight are constraints We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action. Common encapsulation materials Modern electronic devices use a range of encapsulation materials, from rigid thermoset resins to flexible elastomers, chosen based on the application requirements. Epoxy PCBs encapsulated with different materials (PDMS, epoxy and epoxy with hermetic feedthroughs and optional P3HT coating) © Novak, M, et al ., CC BY 4.0 Epoxy resins are rigid thermosetting polymers often filled with silica to improve thermal conductivity and mechanical properties. They are the most widely used encapsulants in both semiconductor packaging and industrial electronics due to their strong adhesion, mechanical strength, and chemical resistance. Pros Epoxy encapsulants form a hard, rigid shell with excellent adhesion, mechanical strength, and chemical resistance. They are electrically insulating and can be formulated for flame retardance and high temperature resistance. Cured epoxies are moisture resistant and have low water permeability, which allows them to protect electronics in humid conditions [3]. Cons The rigidity of epoxy can be a drawback in critical applications with extreme temperature swings or mismatched thermal expansion. Repeated heating and cooling may lead to delamination or cracks in the encapsulation or at the interface [3]. Silicone A pressure and temperature sensor encapsulated with PDMS © Sang M., et al ., CC BY 4.0 Silicones, particularly polydimethylsiloxane (PDMS), are flexible elastomers used when mechanical flexibility or biocompatibility is needed. Common in medical electronics and wearable devices, they can be applied as soft coatings, gels, or flexible encapsulants. Pros Silicone encapsulants are soft and elastic after curing and reduce stress on sensitive components. In one study [3], a silicone encapsulant successfully protected chronically implanted PCBs, maintaining encapsulant integrity and adhesion during 30-day accelerated aging in saline. Silicones have excellent thermal stability and remain functional from roughly -40 °C up to 175 °C  or more, a range over which they maintain consistent properties. Cons Silicone encapsulation is not hermetic – moisture can slowly diffuse through, which can be problematic in very moisture-sensitive devices [4] Silicone doesn’t adhere as strongly to many substrates compared to epoxy, and its low surface energy makes it easy for it to “ wet out ” and flow into crevices, which can lead to poor adhesion if not primed. Polyurethane Neural-stimulating electrodes with a bioresorbable dynamic covalent polyurethane (b-DCPU) encapsulation layer © Choi, Y.S., et al ., CC BY 4.0 Polyurethanes (PU) are polymers formed by reacting diisocyanates with polyols, resulting in urethane linkages [5]. They strike a balance between the hardness of epoxies and the softness of silicones, offering moderate flexibility and toughness, and are useful in soft robotics, wearables, and implantables. Pros Polyurethanes are semi-flexible (softer than epoxies but stiffer than silicone) and offer good electrical insulation and vibration damping. They tend to cure to a less rigid state, putting less stress on delicate parts [5].  PU potting compounds also exhibit good adhesion [5]. Cons PU generally cannot withstand high temperatures  as well as epoxies and silicones.  PU is generally not as impermeable  to water as epoxies. In a humid environment, a PU encapsulate is more likely to allow moisture ingress. Conclusion Encapsulation is a fundamental part of the electronics manufacturing process, providing protection against harsh environmental conditions like moisture, chemicals, and mechanical stress. The choice of encapsulant directly affects device reliability, making it a key design consideration for both conventional and advanced electronic systems. Interested in learning more about electronics encapsulation? Check out these resources: White paper: Printing a Flexible PCB with Silver Ink on PET Application: Adhesive Dispensing Systems Blog: What Is Thermal Interface Material (TIM)? Want to explore dispensing encapsulants with NOVA ? Book a meeting  to speak with one of Voltera’s technical representatives. References [1] Inamdar, A., Driel, V., & Zhang, G. (2025). Electronics packaging materials and component-level degradation monitoring. Frontiers in Electronics , 6. https://doi.org/10.3389/felec.2025.1506112 . [2] Du, S. Baek. Y., Wang, G., & Bhattacharya, S. (2010, November 1). Design considerations of high voltage and high frequency transformer for solid state transformer application. IEEE Xplore . https://doi.org/10.1109/IECON.2010.5674991 .  [3] Adam, C., M Münch, P Kleinschnittger, Barth, T., & Krautschneider, W. H. (2024). Rapid prototyping of molds for the encapsulation of electronic implants using additive manufacturing. Additive Manufacturing Meets Medicine (AMMM) . https://doi.org/10.18416/AMMM.2024.24091858 . [4] Lamont, C., Grego, T., K. Nanbakhsh, A. Shah Idil, Giagka, V., A. Vanhoestenberghe, Cogan, S., & Donaldson, N. (2021). Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: a comparative long-term ageing study. Journal of Neural Engineering , 18(5), 055003–055003. https://doi.org/10.1088/1741-2552/abf0d6 .  [5] Bonomo, M., Taheri, B., Bonandini, L., Castro-Hermosa, S., Brown, T. M., Zanetti, M., Menozzi, A., Barolo, C., & Brunetti, F. (2020). Thermosetting Polyurethane Resins as Low-Cost, Easily Scalable, and Effective Oxygen and Moisture Barriers for Perovskite Solar Cells.  ACS Applied Materials & Interfaces , 12(49), 54862–54875. https://doi.org/10.1021/acsami.0c17652 .  Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature The Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

Printed electronics often involve touch applications on flexible transparent films, which creates a demand for transparent conductive materials. Integration of ICs enables the control of capacitive touch functionality, combined with serial communication protocols such as I2C or USB. This allows for much smaller and more efficient connections than traditional solutions using bulky cables. DoMicro is capable of making Flexible Hybrid Electronic touch applications with screen-printed transparent PEDOT electrodes, inkjet printed silver circuitry and Anisotropic Conductive Adhesive ( ACA) bonded components. This paper focusses on the integration processes of printed transparent conductive polymer polyethylene dioxythiophene (PEDOT:PSS).   Human machine interfaces and control displays should be easy to understand for the operator. Highlighting essential information depending on mode or status of the equipment creates a focussed and minimal atmosphere without distraction. Visual appearance and coloured feedback of touch icons by RGB controlled backlight LED’s is featured by transparent capacitive touch technology in Flexible Hybrid Electronics (FHE) circuitry. A FHE-Touch foil integrated with a FPCA-LED assembly enables a fully flat, flexible interface system that can be integrated in curve products and surfaces. Touch icon buttons can be completely hidden or made invisible when backlight is switched off. Figure 1 - User interface by Metafas Application demonstrator Figure 1 shows a user interface with capacitive touch buttons to use with backlighting. The FHE module is placed on top of a flexible FPC with RGB-LEDs that will respond to the touch actuation. The product is made by a combination of screen-printed PEDOT touch electrodes and inkjet printed silver traces. The transparency of PEDOT electrodes allows for the backlighting and lightguide. Figure 2 shows this transparency of the blueish PEDOT electrodes printed on a PEN film. Figure 2 The transparency and conductivity of the PEDOT electrodes depends on the layer thickness. This sample has a PEDOT layer of only 350 nm thickness. This results in a sheet resistance  of 320 Ω/sq. The PEDOT screen-printing paste is commercially available. DoMicro is capable to screen print on films up to 150x150 mm on the Aurel C1010 screen-p rinter. Metafas screen prints series up to 1,000 pieces on 1,000x700 mm.   Around the PEDOT electrodes the electrical circuit is printed with a silver nanoparticle (NP) ink. This circuit is shown in figure 3. The inkjet printing technology allows for small contact pads to interconnect the QFN packaged driver IC. This IC has pad sizes of 250 µm at a pitch of 500 µm. Using this inkjet printing technology, DoMicro is capable of printing at a pitch down to 100 µm. The inkjet printed circuit is a 2-layer circuit with inkjet printed insulator to separate crossing top and bottom silver traces. For this inkjet printing process the SUSS MicroTec PiXDRO LP-50 inkjet printer is used. Both the UV curable insulator ink and silver ink are commercially available. Sintering of the NP is performed in a box oven at 150°C for 30 min. Figure 3 The PEN substrate and silver circuit do not allow for a standard soldering process for integration of components. An ACA is used to make a thermocompression bond between the IC and passive components and the printed circuit. Figure 4 shows an FHE touch module after assembly of the components. The Pick&Place process is performed with a Fineplacer Pico having an alignment accuracy of 5µm. Figure 4 The FHE touch module can, for example, be connected to a flexible LED FPC, such as shown in Figure 1. This interconnection is achieved using ACA through a thermocompression bonding process. The process, carried out with the Fineplacer PICO, enables strong and reliable interconnections at relatively low bonding temperatures of around 160 °C. These bonds ensure high reliability without short circuits, while preserving the flexibility of the transparent printed electronics touch circuit in combination with the LED FPC. We are exhibiting at the Future of Electronics RESHAPED. The event will take place in Berlin  on 21-22 October 2026. Please register for the event, meet us in person and see our technology in action.   Conclusions and outlook Screen-printed electrodes with transparent conductive polymer PEDOT are useful for touch applications in combination with backlight. The presented process steps show how such FHE touch modules could be made. Many designs of these touch button circuits are possible. Besides FHE modules with touch buttons, this printing process also allows for other transparent touch applications, e.g. trackpads or touch screens. DoMicro can support the technology for manufacturing as well as the hardware and system integration . Metafas complements this by bridging the gap towards industrial scalability and manufacturability.   Strong collaboration DoMicro and Metafas have collaborated for many years, supported by their close geographical proximity. DoMicro develops advanced inkjet printing processes and technology for micro assembly and 3D packaging of FHE and micro devices. While DoMicro focuses on R&D and prototyping with transparent PEDOT electrodes, inkjet-printed circuitry, and micro-assembly, Metafas transforms these innovations into reliable products. With expertise in membrane switches, printed electronics, and advanced foil-based HMI applications, Metafas develops and produces small and medium series using advanced techniques.   By combining the capabilities of DoMicro and Metafas, high-performance devices can be made, pushing the boundaries of flexible hybrid and printed electronics. Cleanroom Imagine, create, ACCOMPLISH   DoMicro provides R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations.   Metafas operates a fully automated INO screen printing line for advanced printed electronics, using in-house screen fabrication and product finishing. A structured product and process launch system enables FHE technologies – such as transparent PEDOT-based HMI foils – to evolve into volume production for industrial, medical, and consumer applications.   If you are challenged by the market and looking for a partner to move your ideas into realization, contact us. We really do IMAGINE, CREATE AND ACCOMPLISH. Let's meet! DoMicro is an exhibitor at several inspiring events this year. We start at Nanotech Tokyo, 26 to 30 January,, at the Netherlands Pavilion, booth number AT-L02. From 24 to 26 February, you can find us at LOPEC in Munich, Germany, at Booth B0 514. And through various activities from TechBlick including exhibition at the Future of Electronics RESHAPED Berlin (21 and 22 OCT 2026) we can connect as well and share our mutual passion for innovation. If you are looking for a partner to move your ideas into realization, let’s cross boundaries together! Our dedicated and flexible team invites you: Do it ‘Do Micro’. We really Imagine, Create, Accomplish.   Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

10 Feb 2026 | London | Free event Technology is reshaping every aspect of our lives, and the loan ecosystem is no exception. Advances in emerging technologies within the loan market such as Generative AI, Legal Tech, and Distributed Ledger Technology (DLT) are driving a wave of innovation, automating previously manual tasks, streamlining documentation, and enhancing transparency across transactions. But the critical question remains: how do we adapt, adopt, and utilise these solutions?  LMA Edge is a brand new event dedicated to showcasing new technologies in the lending sector. It prioritises interaction, offering high-impact networking opportunities through exhibition, tech demos, case study and collaboration stage talks, and curated 1:1 meetings. Tomi Popoola, CEO of Slash Finances and Lord Holmes, Member of the UK House of Lords are the confirmed keynote speakers. Tomi will share insights on From Innovation to Operating Model: How AI, Cloud and Automation Are Transforming Corporate Lending for Real-World Impact, exploring how emerging technologies are reshaping lending models and driving tangible outcomes across the market. Lord Holmes will examine the role of emerging technology in the UK, reflect on current trends and the future outlook, and consider the evolving intersection between technology and the loan markets. Why it matters:  Accelerate digital execution, reduce operational cost and risk, and align on standards that improve interoperability across the loan lifecycle. Who should attend:  CTO (loan markets/technology), COO/Head of Loan Operations, Head of Agency/Trustee, Senior Investment & Portfolio Managers, Head of Data/AI. Outcome:  See the vendor landscape, engage on practical use‑cases, and shape near‑term pilots.

Authors: Anaghim Nasri, R&D Engineer Quentin Maerklen, Process Engineer   Water-based graphene inks are emerging as a groundbreaking solution for next-generation heating technology. By leveraging graphene’s exceptional thermal and electrical conductivity, these inks enable thin, flexible heating elements that deliver high heat output with minimal power. Importantly, sustainability is becoming a key market driver, with growing demand for water-based, responsibly sourced graphene inks as eco-friendly alternatives to metal-based conductive materials.   This article explores how water-based graphene inks provide efficient and uniform heating, their environmental advantages over conventional carbon-based inks, and the role of Blackleaf in driving this innovation forward. As the demand grows for eco-friendly heating (from automotive seats to building systems), water-based graphene inks offer a powerful combination of performance, sustainability, and scalability.   Introduction: Blackleaf Inks for Next-Generation Heating One of the pioneers bringing this technology to market is Blackleaf, a French graphene manufacturer and ink developer. Blackleaf has positioned itself as a leading producer of graphene and formulated inks in Europe, with a capacity of over 120 tons per year of graphene products by 2027, all produced in-house in France. Blackleaf’ s product portfolio includes ready-to-use graphene conductive inks for a variety of uses. Notably, the company has focused on graphene-based heating inks as a core offering that can be applied in two complementary forms- as flexible heating films or direct heating coatings on surfaces. This allows integration into diverse scenarios. We are exhibiting at the Future of Electronics RESHAPED. The events will take place in Berlin  on 21-22 October 2026 . Please register for the event, meet us in person and see our technology in action.    Key Properties of Graphene Inks  Graphene inks offer a unique combination of high conductivity, low-temperature processing, and compatibility with industrial printing. The key properties below illustrate why they outperform conventional carbon and metal-based formulations.   2.1. High Electrical Conductivity Graphene’s high charge-carrier mobility enables low-resistance films at low solid content. While conventional carbon inks require >25–30% solids to reach 20–30 Ω/sq/mil, Blackleaf’s water-based formulations achieve 8–15 Ω/sq/mil with only 6–8% solids.This ensures: Efficient Joule heating at low voltage. Lower energy consumption. Resistance tunability via mesh, deposition thickness, and curing profile. 2.2. Low-Temperature Processing Graphene inks cure at <150 °C, reducing energy demand during manufacturing and enabling deposition on flexible polymer substrates. This contrasts with metal-based inks (e.g., silver nanoparticle systems requiring >250 °C sintering) and helps lower the overall carbon footprint of production.   2.3. Tunable Rheology & Broad Printability Formulations can be engineered for multiple coating/printing processes, including screen printing, spray coating, and slot-die/bar coating. Key rheological traits include: Controlled thixotropy. Stable viscosity under shear. Excellent wetting on polymeric surfaces.   2.4. Strong Substrate Adhesion Optimized binder–graphene interactions provide robust adhesion on a wide range of substrates, including PET, PU, PC, textiles, and paper (see Figure 1 ), ensuring mechanical stability under bending, heating cycles, and long-term use.     Figure 1.  Compatibility of Graphene-Based Heating Inks with Rigid and Flexible Substrates Table 1.  Performance Overview of Blackleaf water-based graphene inks. a The curing temperature depends on the target application and the substrate used. A minimum drying temperature of 90 °C  is required to ensure proper film drying.   Table 1  compares the electrical performance of graphene inks processed by different coating and printing techniques, showing that sheet resistance strongly depends on deposition method and film thickness. Spray coating yields thicker films (~25 µm) with lower sheet resistance, while screen printing produces thinner layers (~12–15 µm) with higher resistance. All films were cured on treated PET at low temperatures (120–150 °C), confirming process compatibility. Overall, the results demonstrate that sheet resistance can be tuned by controlling deposition technology, thickness, and curing conditions to meet different heating performance requirements.   High Efficiency Heating with Graphene Inks   3.1 Use-Case Integration of Printed Graphene Heating Films The experimental investigations reported in this work were carried out on flexible graphene-based heater patches specifically designed for high-efficiency surface heating. These ultra-thin devices can be integrated or bonded onto a wide variety of substrates wherever localized heat input is required. Figure 2.  Architecture of a Printed Graphene heating film with Copper Busbars and Polymer Encapsulation. As illustrated in Figure 2 , heaters combine a graphene heating layer with copper electrodes on a polymer substrate, optionally laminated with a polymer topcoat, and are supplied with a pressure-sensitive adhesive to enable straightforward mounting.   They are engineered to deliver surface power densities up to 6 W·cm⁻² with a maximum operating temperature of 250 °C, while maintaining excellent thermal uniformity thanks to the high in-plane conductivity of the graphene ink and the resulting direct thermal transfer to the heated surface.  Figure 3.  Direct Deposition of a Graphene Heating Film for Tank Heating Application. As shown in Figure 3 , patch geometry and overall dimensions are tailored to the application, and the devices remain highly flexible, with a bending radius down to 2 mm, making them suitable demonstrators for the high-efficiency heating performance of the graphene inks evaluated in the following sections.   3.2. Thermal tests – Endurance (8 h at 75 °C) To assess the stability of heaters manufactured with water-based graphene inks, a representative flexible patch was supplied with 160 W under a maximum voltage of 230 V for 8 h. Under these conditions, and with the mounting configuration described above, the device reached a steady-state temperature of 75 °C as displayed in Figure 4 . Figure 4.  Thermal endurance test (8 hrs, T=75°C, P=160W). Figure 4  shows a slight increase in the equilibrium temperature throughout the experiment. This drift is distributed to variations in the ambient temperature, as the external temperature T ext  exhibited the same upward trend as the temperature measured on the heater surface. Table 2 . Statistical Summary of Resistance Data The corresponding evolution of resistance is summarized in Table 2 . Over the 8 hrs period, the resistance decreased by 11.5 Ω, i.e. about 4 %, with values ranging from 280.5 Ω to 269.0 Ω (mean 271.5 Ω, standard deviation 2.3 Ω). This behaviour is consistent with the negative temperature coefficient (NTC) of the graphene-based coating: the resistance decreases slightly as temperature increases, before reaching a stable value. No degradation, delamination or visible damage of the heater was detected after the endurance test, indicating that the integrity of the patch was preserved.   3.3 Thermal tests – Cycling (100 cycles from ambient to 75 °C) Using the same experimental setup, a thermal cycling protocol was applied over 100 cycles between 40 °C and 75 °C, for a total duration of 27 h. To reach 75 °C more rapidly in each cycle, the input power was slightly increased to 180 W ( Figure 5 ). Figure 5 . Thermal cycling illustration: 100 Cycles at 180 W between 40°C and 75°C. Figure 6 . Illustration of thermal cycling over a 3-hour segment (10 cycles). For clarity, Figure 6 presents only the first 10 cycles over a 3-hour window. During these initial cycles, a modest decrease in resistance of approximately 3 % was observed, after which the resistance stabilized and remained constant over the remaining 90 cycles. As in the endurance experiment, no macroscopic damage or change in appearance of the heater was observed at the end of the test, confirming that the patches withstand repeated thermal loading between 40 °C and 75 °C.   Potential application to low-temperature floor heating for energy retrofits The combination of high-power density, mechanical flexibility, and stable operation demonstrated above suggests that heaters based on water-based graphene inks are suitable candidates for low-temperature radiant floor heating, particularly in the context of energy renovation. In such systems, flexible patches can be laminated or bonded onto intermediate substrates (e.g. underlays, boards, or prefabricated panels) and subsequently covered by conventional flooring materials such as laminates, engineered wood or ceramic tiles, provided that appropriate dielectric and mechanical protection layers are implemented (see Figure 7 ). Figure 7. Representation of a graphene-based printed underfloor heating system developed at Blackleaf. The tunability of sheet resistance and heater geometry enables precise control of power density while maintaining safe current and voltage levels. The observed negative temperature coefficient behavior may further contribute to safety by limiting local overheating. Combined with water-based inks and scalable printing processes, these heaters are well suited for large-area, flexible manufacturing, with future work focusing on durability, environmental resistance, and system-level integration for building-scale applications. Further work should therefore address long-term mechanical fatigue under foot traffic, moisture and humidity resistance, dielectric withstand under building-standard test protocols, and system-level integration (insulation layers, floor build-up, control strategies) to fully validate these printed heaters as a viable technology for low-temperature, energy-efficient floor heating in renovation scenarios     Water-Based Formulation: Key Enabler for Sustainable Printed Heating Technologies   Water-based graphene inks represent a major shift in the development of next-generation printed heating solutions. Unlike traditional conductive inks that rely on organic solvents such as NMP, DMF, toluene, or glycol ethers, water-based formulations eliminate volatile organic compounds (VOCs) and significantly reduce toxicity during manufacturing and end-use. This not only improves operator safety but also simplifies processing, waste handling, and regulatory compliance. Beyond their environmental benefits, water-based graphene inks provide significant operational and economic advantages at the manufacturing level. By eliminating organic solvents, they drastically reduce maintenance requirements on printing and coating equipment: no solvent residues, fewer nozzle or mesh obstructions, and faster cleaning cycles. Water replaces costly solvent-based cleaning agents, lowering consumable usage while minimizing operator exposure to hazardous chemicals. Additionally, the absence of aggressive solvents extends the lifetime of pumps, seals, tubing, screens and elastomer components, which are typically degraded by solvent-based formulations. Because water-based inks do not require solvent-extraction systems, safety infrastructure becomes simpler and less expensive. Overall, water-based ink processing enables lower operational expenditure (OPEX), higher equipment uptime, greater throughput stability, and reduced production complexity, which is particularly advantageous for large-scale deployment of printed heating technologies.   Conclusion Water-based graphene inks represent a key enabling technology for next-generation heating elements, combining high electrical performance with low environmental impact. Continued improvements in graphene exfoliation, formulation, and printing compatibility are expected to further expand their functionality toward smart, energy-efficient heating systems. In this context,  Blackleaf  plays a central role by delivering industrially scalable, sustainably produced graphene inks capable of addressing both performance and regulatory requirements. By bridging advanced materials science with real-world manufacturing constraints, graphene-based heating films are positioned to transition from emerging solutions to widely adopted technologies across sectors aerospace (leading-edge anti-icing systems), electric vehicles (interior comfort heating) and building applications (radiant heating panels).   Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped (in California) and  Perovskite Connect (in Berlin) .

Author: Jesus Zozaya, CEO, Voltera, sales@voltera.io It was our pleasure to present a masterclass at TechBlick Berlin on advancements in printed electronics prototyping. As a follow-up, we’d like to share an example of a multilayer flexible circuit we printed on PET. To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick MATERIALS USED Voltera Conductor 3 silver ink ACI Materials FS0142 Semi-Sintering Conductive Ink ACI Materials SI3104 Stretchable Printed Insulator Voltera T4 solder paste Voltera solder wire Siraya Tech Tenacious Flexible Resin SUBSTRATES USED Normandy Coating polyethylene terephthalate (PET)  FR1 board TOOLS AND ACCESSORIES V-One PCB printer NOVA materials dispensing system Voltera disposable nozzle   Nordson EFD 7018395 dispensing tip   Nordson EFD 7018424 dispensing tip   Nordson general purpose dispense tips  NE555DR timer LEDs Project Overview Purpose The goal of this project was to prototype a flexible multilayer LED wheel roulette circuit that was traditionally considered rigid and validate the redesign of the circuit. Design This project involves a multilayer flexible PCB for the LED roulette circuit and a traditional control board that powers it. We adapted the design of an LED roulette circuit, originally developed for a 3” × 4” FR4 board by ITIZ, Voltera’s authorized reseller in Korea. This new version is printed on a coated biaxially oriented PET substrate, allowing the circuit to remain flexible - even when populated with components. Figure 1: Original LED roulette circuit design by ITIZ We divided the LED roulette circuit design into three layers: Base conductive layer Dielectric layer Top conductive layer Figure 2: Voltera modified design of the LED roulette circuit Desired outcome We anticipated the circuit would function like a roulette wheel: each time the pulse generator is triggered, the LEDs on the flexible PCB light up in a rapid circular sequence before slowing down and stopping on a single LED. Functionality By printing a dielectric and crossover layer on top of the base conductive layer, we created a compact and lightweight LED roulette circuit without using jumpers. Each layer remained flexible after curing, and the circuit maintained its integrity even after encapsulation and repeated flexing.  When connected to power, pressing the switch on the control board caused the LEDs on the flexible PCB to light up, replicating the behavior of a roulette wheel as intended. We are Exhibiting. Visit our booth at the TechBlick event on June 10-11, 2026, in Mountain View, California, USA . Printing the control board This board controls the pulse signals and powers the LED roulette wheel circuit. We used V-One to print the circuit and reflow the components, which included: NE555DR timer LED Switch 47 µF capacitor 0.1 µF capacitor 10 nF capacitor 100 kΩ resistor 330 Ω resistor Figure 3: Schematic for the control board Figure 4: The control board Printing the flexible PCB This flexible PCB receives signals from the control board and lights up the LEDs as directed.  Base conductive layer This layer consists of a roulette-shaped circuit (90 mm L × 70 mm W) that connects to the control board, as well as power and ground terminals, with designated gaps for dielectric pads. Figure 5: Schematic for the base conductive layer Figure 6: NOVA print settings, base conductive layer Figure 7: Print result, base conductive layer Dielectric layer This layer consists of 29 dielectric pads that provide insulation for the top conductive layer. For better coverage, we printed two passes of dielectric ink. Figure 8: Schematic for the dielectric layer Figure 9: NOVA print settings, dielectric layer Figure 10: Print result, dielectric layer Top conductive layer This layer consists of 29 fine crossover traces that connect the paths to the power terminal and control board. To address potential gaps over height changes, we decreased the trace width to 100 mm to enhance trace continuity. Figure 11: Schematic for the top conductive layer Figure 12: NOVA print settings, top conductive layer Figure 13: Print result, bottom conductive layer Post-processing the flexible PCB Dispensing solder paste and reflowing the components Once the circuit was cured, we dispensed solder paste using NOVA and populated the components before reflowing them in an oven. Figure 14: NOVA print settings, solder paste Figure 15: NOVA dispensing solder paste Because the wires are not heat-resistant, we manually soldered them onto both the companion board and the flexible roulette circuit. Encapsulating the components To reinforce their connection to the substrate, we dispensed encapsulation resin using a syringe onto the components and cured the resin in a UV light box. Figure 16: Encapsulated circuit being cured in a UV light box Once cured, we manually soldered the wires of the control board and the wires of the flexible roulette circuit together. Figure 17: Soldering the wires together Challenges and advice Electrical shorts We encountered issues with shorts due to multiple crossover lines on the dielectric layer. To address this, we recommend printing a second pass of the dielectric layer to achieve a thicker insulating layer that better supports additional layers printed on top. Drastic height changes A second pass of the dielectric layer can result in significant height differences. To handle this, it is advisable to set a low probe pitch to ensure a more accurate height map and print a thicker crossover layer for improved contact on the top layer. Maintaining flexibility with components attached  To ensure the circuit remained flexible after populating components, we opted for smaller, more flexible components. This, combined with the use of a flexible substrate, encapsulant, and inks, allowed the circuit to bend without damaging the connections. Conclusion This project highlights the educational value of converting rigid circuit designs into flexible ones, allowing students to explore diverse materials and optimise print settings through experimentation. It also demonstrates the potential of prototyping flexible PCBs to replace electronics that were considered rigid, achieving lightweight, compact, and resilient designs. As flexible PCBs gain more popularity, hands-on experience with these technologies becomes essential for staying ahead in the rapidly evolving electronics industry. We invite you to explore our other projects  as we continue to explore the possibilities of flexible PCBs and printed electronics. Working with flexible PCBs? Book a meeting  to speak with one of Voltera’s technical representatives. We are exhibiting at the Future of Electronics RESHAPED events in 2026. The events will take place in California and Berlin . Please register for these events, meet us in person and see our machine in action.

Conference & Exhibition: 10 & 11 June 2026 | Masterclasses: 9 June 2026 Computer History Museum, Mountain View, California, USA Co-located with the Nextflex Innovation Day Exhibition spaces 75% sold already! Super early bird rate expiring 19 DEC 2025 The next Future of Electronics RESHAPED USA show will  move from the East Coast to the West Coast , taking place at the iconic Computer History Museum in Mountain View, California! Let's RESHAPE the Future of Electronics together, one layer at a time , on 10 & 11 June 2026 in Mountain View, making it Additive, Printed, Sustainable, Flexible, Hybrid, Stretchable, Wearable, Textile, Structural, 3D... Global Agenda Discover key breakthroughs RESHAPING the future of electronics. Discover more here The TechBlick team is currently curating the agenda. To get a sense of the calibre of our events, please explore all our previous events here . All these past events across all locations, technology topics and years are  also available to you with your annual pass. Super early bird attendee rates end on 19 DEC 2025. Secure your spot now Incredible Tradeshow Experience the innovations that will RESHAPE electronics Explore 75+ exhibitors will be joining us onsite, creating a vibrant tradeshow floor that reflects the state-of-the-art across the entire global value chain for additive, printed, hybrid, sustainable, wearable and 3D electronics.  The exhibition floor is already 75% full . Please secure your space now. Learn more and download the package here   Co-located with the Nextflex Innovation Day NextFlex is the linchpin of the printed and hybrid electronics ecosystem in the US, driving the development of a robust industrial base for hybrid electronics manufacturing. Learn more here In 2026, Nextflex will co-locate its popular Innovation Day with TechBlick’s Future of Electronics RESHAPED at the iconic Computer History Museum, creating a single must-attend event for the entire global community. Super early bird attendee rates end on 19 DEC 2025. Secure your spot now

As electronics demand greater miniaturization, multifunctionality, and integration, the materials enabling these advancements require significant consideration. Brewer Science is pioneering a new frontier in additive electronics by developing advanced functional materials, including printable low-loss dielectrics, encapsulants, and optical layers, that empower high-performance sensor systems and advanced packaging solutions. These innovations not only enhance device capabilities but also strengthen the domestic electronics supply chain, positioning the U.S. as a leader in next-generation electronics manufacturing.   The Challenge: Evolving Demands in Electronics Manufacturing Microelectronics manufacturing has long relied on proven techniques like photolithography and PCB fabrication, technologies that have enabled decades of innovation and remain essential to many high-performance applications. However, as the industry pushes toward greater miniaturization, multifunctionality, and integration, new manufacturing paradigms are emerging to meet these evolving demands. Additive manufacturing offers unique advantages in design flexibility, rapid prototyping, and integration of complex 3D structures. Yet, while structural additive manufacturing has matured, the development of functional materials, such as printable dielectrics, conductive materials, and encapsulants, remains a critical frontier. Brewer Science is helping bridge this gap by introducing advanced materials that complement traditional processes and unlock new possibilities for embedded sensing, flexible electronics, and real-time environmental monitoring.   Watch the presentation “Building Circuits from the Ground Up: Materials Innovation for Additive Electronics” by Dr. Adam Scotch at TechBlick 2025. It provides insight into the evolving demands in electronics manufacturing and explains why strategic material innovation is necessary to address the next generation of technology.   Brewer Science’s Breakthroughs in Functional Materials Brewer Science is addressing this gap by leveraging its deep expertise in polymer chemistry and semiconductor manufacturing. The company has developed a suite of functional inks and printable materials tailored for additive electronics, including: Low-loss dielectrics  for RF and high-frequency applications Functional inks  for measuring pressure, strain, temperature, and conductivity Encapsulants for environmental protection and mechanical stability Membranes  for monitoring water quality such as heavy metals and other contaminants These materials are compatible with a range of deposition techniques, including ink jet, microdispense, spray coating, and fine-line screen printing, which enables precision and scalability. Do not miss the flagship TechBlick event in Berlin on 22-23 October 2025 Enjoy a curated world-class agenda and masterclass program with four parallel tracks (over 100 speakers), experience and feel the latest technologies at a tabletop exhibition showcasing 90+ global exhibitors, and connect with customers and partners from around the world.   Real-World Impact: Water Quality Monitoring One of the most compelling applications of Brewer Science’s material innovations is in  real-time water quality monitoring . Using advanced sensor arrays built with these functional materials, Brewer Science has developed systems capable of detecting: Heavy metals: Lead (Pb), Cadmium (Cd), Copper (Cu) Hardness: Calcium (Ca), Magnesium (Mg) PFAS (Per- and Polyfluoroalkyl Substances) [AS1]   Nitrate pH Temperature Conductivity (Total Dissolved Solids, TDS) These sensors operate at  parts-per-billion (ppb)  sensitivity and can be customized to detect a wide range of analytes. When paired with  IoT technology , they enable remote, real-time monitoring of water sources from municipal facilities to rivers and streams. This capability not only improves testing speed and accuracy but also supports public health by identifying contaminants early and preventing exposure. By integrating these sensors into scalable, additive manufacturing workflows, Brewer Science is helping communities access safer water and empowering governments and industries to make data-driven decisions. Learn more about Brewer Science’s InFlect ®  water quality sensor system on their website.   Brewer Science’s 30-second overview video encourages viewers to question, “What is in your water?”    Enabling Domestic Resilience and Innovation With over 40 years of U.S.-based chemical manufacturing experience, Brewer Science is uniquely positioned to support domestic supply chain resilience. Its vertically integrated capabilities from synthesis and blending to packaging and quality control ensure consistent performance and scalability. This infrastructure supports rapid prototyping and commercialization of additive electronics, helping the U.S. close the gap with global competitors.     A Vision for Additive Electronics Brewer Science’s approach enables the construction of electronic circuits from the ground up, merging chips, packages, and PCBs into unified, multifunctional components. This holistic design philosophy opens the door to: 3D printed traces and vias  on complex surfaces Embedded RF and optical waveguides  for advanced sensing and communication Integrated sensor systems  with environmental protection and mechanical flexibility These capabilities are especially valuable for aerospace, defense, medical, and IoT applications where performance, size, and reliability are critical.     Brewer Science is looking forward to collaborating with you! Brewer Science is looking to integrate and bring its real-time water quality monitoring capabilities to the global market. If you have an application that could benefit with real-time water quality sensor system, we are eager to hear more. Please submit a request via the contact form on Brewer Science’s website .  Additionally, our InFlect ®   sensor systems offer customizable analytes. If you’re seeking to detect different analytes, please send us a message and we would like to innovate with you. Join the flagship TechBlick event in Berlin on 22-23 October 2025 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year the event will also feature the co-located  Perovskite Connect , the only event worldwide dedicated to the perovskite industry.  Learn more here Register Now Download Conference Handout

LevSurf™  is a UV‑cured hard-coated polycarbonate (PC) film  engineered to enable three-dimensional forming for IMD/FIM manufacturing — combining scratch resistance and robust chemical durability with material flexibility. The coating is fully cured prior to forming , eliminating the need for post-processing steps like secondary UV curing or lacquer, increasing throughput and reducing defect rates. Tailored for cover-lens substitution in high-resolution displays  (e.g. automotive instrument panels), LevSurf offers optical clarity comparable to glass , with weight savings and potential reductions in CO₂ footprint per vehicle lifecycle. Constructed using polycarbonate substrate , LevSurf features anti-reflective (F18) or glossy (F04)  finishes, each optimized for display readability or aesthetic effect. The hardcoat layer  yields durability — pencil hardness H and full chemical resistance while allowing elongation of up to ~125% during forming without cracking. The film maintains excellent optical performance , with haze as low as ~0.1% and reflectance around 1.4%, paired with anti-fingerprint and anti-glare finishes for improved visual performance. Kimoto applies the UV-curable coating using ISO‑certified clean‑room R2R coating lines , ensuring minimal particulate contamination for high-resolution display optics. After coating, the film can be printed (e.g. for in-mold graphics), then formed via IMD/FIM tooling. As the coating is fully cured, there’s no post-curing required — meaning lower cycle times and higher yield. LevSurf supports seamless design integration into flowing, curved cockpit surfaces , enabling both functional displays and aesthetic continuity in automotive interiors. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Performance Metrics & Technical Benefits Hardness : Pencil hardness up to H, delivering abrasion resistance typically reserved for glass surfaces. Flexibility : Supports elongation up to ~125% during forming operations without delamination or cracking. Optics : Very low haze (~0.1%) and reflectance (~1.4%) in anti-reflective variants; glossy versions deliver high contrast and gloss perception. Durability : UV-cured surface resists chemicals and repeated human interaction without requiring protective overcoats. Applications & Impact Automotive HMI : LevSurf films are popular for dashboards, infotainment panels, and other high-touch surfaces where curvature and display transparency are essential. Lightweight display integration : By replacing traditional glass cover lenses, LevSurf reduces weight and contributes to lower production costs and CO₂ emissions. Large-panel design freedom : Ideal for OEMs and Tier‑1 integrators looking to embed seamless visual continuity across interior trims with multiple display zones. LevSurf™ represents a compelling fusion of precision materials engineering, high-performance optical coating, and process-compatible flexibility . Its ability to replace fragile glass with lightweight, durable polycarbonate, all while maintaining color fidelity and touch performance, positions it as a disruptive solution for next-gen HMI and display systems in automotive and consumer electronics. Figure 1 - Comparison Table (LevSurf F04 and F18) We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

Digital Additive Hybrid Solutions as a Value Driver Authors: Frédéric SOULIER and Viktoriya TESSIER-DOYEN Email authors here   In the era of Smart Factories, IoT, AI and Sustainability Goals, the electronics and industrial sectors are undergoing a profound transformation. Traditional subtractive methods : etching, photolithography, plating still dominate, but they come with high fixed tooling cost, lead times, and material wastage. Digital Additive Manufacturing  — particularly in the domain of Printed Electronics — is emerging as a powerful disruptive lever. Among various solutions in this space, the CeraPrinter , by Ceradrop - MGI Group, offers hybrid digital deposition equipment that combine multiple printing technologies : Inkjet, NanoJet, Aerosol Jet®, Microdispensing  to deliver flexible, precise, and sustainable manufacturing across industrial domains. This article discusses key trends, technical merits, hybrid approaches, and business advantages of digital additive hybrid manufacturing. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Trends & Growth in the Printed Electronics Sector The global printed electronics market is forecast to grow strongly — expected to nearly double by 2030. This expansion is driven by flexible, lightweight, multifunctional electronics for wearables, automotive, sensors, and IoT devices.Key trends include flexibility, sustainability, on-demand customization, hybrid multi-material integration, and the rise of 3D additive electronics. Regional programs in Europe, USA and Asia are also pushing the sector forward.   Technical Landscape: Inkjet, NanoJet, AerosolJet, Microdispensing Each deposition technology has unique characteristics. Inkjet  excels in flexibility, high speed and cost-effectiveness. NanoJet  refines precision and resolution. Aerosol Jet®  enables 3D conformal and fine-feature deposition. Microdispensing offers volumetric precision for thicker films and viscous materials.MGI’s Hybrid Systems combine these advantages, providing unmatched versatility and scalability for industrial R&D and Production. Hybrid Digital Materials Deposition Platform. Industrial Digital Additive Manufacturing Solutions CeraPrinter’s Hybrid Edge: Industrial Multi-Field Applications The CeraPrinter platform integrates Inkjet, NanoJet, Aerosol Jet®, MicroDispensing in a unified modular tool. Users gain hybrid deposition capabilities, scalability, cross-field applications, and sustainable, material-efficient production.Key value propositions include hybrid deposition in one tool, modular scalability, multi-domain flexibility, on-demand production, cost efficiency, and sustainability alignment. Driving Growth Through Innovation Digital additive manufacturing is transforming the printed circuits industries. It removes constraints like masks, tooling, and chemical etching, enabling on-demand fabrication and just-in-time production.This flexibility facilitates efficient small-batch manufacturing, lowers cost, and fosters rapid innovation. Companies can design, test, and deliver new electronic architectures faster while minimizing waste and environmental footprint.   Advanced Simulation stage: Software suite CeraSlice CeraSlice , the exclusive CAD/CAM printing-job software suite by MGI-Ceradrop. CeraSlice is an advanced software suite, alongside DropAnalyser , FabAnalyser . It is used to design, simulate, and generate the printing jobs for: Inkjet, Aerosol Jet®, Nano Jet, Microdispensing, multi‐material / multi‐layer functional devices. Cross-Field Applications: Smart sensors directly printed on various substrates and curved surfaces. Flexible antennas and RF components on foils and molds. In-mold electronics integrated into polymer parts. Rapid PCB & FPC prototyping and interconnect fabrication. Printed power devices and energy modules. Smart packaging and wearables.   Advantages in Practice: Putting the features together, here are what CeraSlice enables in real applications: Faster prototyping:  Because of intuitive CAD import, simulation, patterning + scripting, users can go from design to printed prototype much faster. Material savings:  Early detection of printing issues means fewer wasted prints; pattern and droplet control avoids over‐use of inks/functional materials. Higher precision & consistency:  Detailed control over droplet placement, layer order, per‐subcomponent parameters leads to better uniformity, fewer defects. Flexibility for complex devices:  Printing multilayer, multi-material, 3D functional items becomes feasible. Combinations of materials: conductors, dielectrics, polymers, etc. Scalability from R&D to small production:  With scripting, experiment planning, and standardization of job definitions from lab scale to small batches or pilot lines. Reduced risk:  Simulation and preview steps reduce risk of failure or unexpected behavior; ability to integrate cleaning, curing, etc. helps control process. Conclusions & Call to Action: Digital Additive Hybrid Manufacturing is a strategic enabler for industrial transformation. CeraPrinter’s hybrid systems combine flexibility, sustainability, and scalability. Additive manufacturing redefines how electronics are designed, produced, and delivered — driving innovation, sustainability and competitiveness for the next generation of industrial products. Discover more: Welcome to our Presentation at TechBlick Conference on 23rd of October 2025, at 13h35, Track n°1 We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout

Authors: Laszlo Izso. Matthias Carnoy. Nandan Singh Ruhela. Benjamin Borie. Mira Baraket. Maksym Plakhotnyuk Introduction: ZnO from an Applications point of view Zinc oxide (ZnO) is a versatile semiconductor material that has attracted broad interest in electronics and sensing. It features a direct wide bandgap of ~3.37 eV, making it useful for UV optoelectronic devices like LEDs and photodetectors [1]. ZnO is also abundant, low-cost, and chemically stable, and it can be synthesized via relatively easy methods all contributing to its popularity in research and industry [2]. Beyond optics, ZnO can be doped to achieve high conductivity (transparent conducting films) and used in thin-film transistors (TFTs) as an  n -type semiconductor channel. In microelectronics, ZnO and related oxides have been explored for transparent and flexible transistors, as well as varistors and UV sensors. Its wurtzite crystal structure lacks inversion symmetry, giving ZnO a strong electromechanical coupling it is one of the few semiconductors that is also piezoelectric [3]. This means mechanical strain can induce an electric charge and vice versa, enabling ZnO to serve in mechanical actuators and sensors [3]. In MEMS/NEMS devices, polycrystalline ZnO thin films (often  c -axis oriented) are used for piezoelectric actuators, micro-resonators, and energy harvesters. For example, ZnO thin films form the active layer in surface acoustic wave (SAW) devices and bulk acoustic resonators for filters and sensors [1]. Because of this unique mix of optical, electronic, and piezoelectric properties, ZnO attracts strong interest across multiple industries. In consumer and mobile electronics, it enables transparent and flexible displays, UV photodetectors, and low-power TFT backplanes; in automotive and industrial sensing, its piezoelectric response supports vibration, pressure, and acoustic devices that tolerate harsh environments. Healthcare and wearables benefit from biocompatible, flexible ZnO films for UV monitoring and self-powered (energy-harvesting) sensors, while IoT and smart-building applications leverage ZnO’s transparency and low-temperature processability for unobtrusive, large-area sensing. Combined with compatibility for back-end-of-line and additively patterned deposition, these attributes make ZnO a practical platform material for rapid productization across sectors. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   ZnO Deposition via DALP® 2.1. Direct Atomic Layer Processing (DALP®) ATLANT 3D’s Direct Atomic Layer Processing (DALP®), allows direct-write deposition. In DALP®, a microscale ALD printhead (micronozzle) delivers precursor gases locally to the substrate in a programmable pattern [4]. Fig. 1: Illustration of the DALP® micronozzle; the printhead on top deposits gases onto a moving substrate. This approach translates the well-known ALD chemistry into a patternable format: instead of coating an entire wafer and then patterning, DALP deposits material  only where needed , with features defined by the motion of the printhead. In other words, DALP is essentially maskless, localized ALD [4]. Fig.  2: SEM Image of DALP® deposition of Atlant logo [4]. 2.2. ZnO Deposition with DALP®   ZnO deposition has been successfully demonstrated using DALP® process. In this approach, a safe and non-pyrophoric zinc precursor, bis(dimethylaminopropyl)zinc (Zn(DMP)₂), was used in combination with H₂O as the reactant, replacing the hazardous diethyl zinc (DEZ) typically employed in conventional atomic layer deposition (ALD) [5]. Fig. 3: Optical micrograph of ZnO lines printed by DALP® at 200 °C using Zn(DMP)₂ + H₂O chemistry. Line thickness increases with the number of passes (50 – 800) [5]. We are Presenting in Berlin. Register now to hear our talk at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend Comparing growth rate to traditional ALD, the DALP® ZnO process achieves a growth-per-pass (GPP) of approximately 1.1 Å/pass, nearly identical to the ~0.9 Å/cycle measured in traditional thermal ALD using the same precursor chemistry [5]. Both methods share the same self-limiting temperature window of 200-250 °C, within which stoichiometric and crystalline ZnO films are produced. This close alignment of growth kinetics demonstrates that DALP preserves the core benefits of ALD monolayer precision and reproducibility while adding the ability to pattern directly, greatly improving process flexibility and material utilization. Fig. 4: Comparison of ZnO growth rate between ALD (black) and DALP (red). Both exhibit a constant growth regime (ALD window) between 200–250 °C, yielding stoichiometric ZnO at ~1 Å per cycle/pass [5]. To further validate the precision of the DALP® process, imaging ellipsometry was used to map the thickness profiles of ZnO lines deposited at 200 °C. The results demonstrate excellent uniformity along each printed line and well-defined edges, confirming that film growth remains consistent across the entire patterned area. The cross-sectional profile reveals a smooth, slightly rounded shape typical of self-limiting surface reactions, while the thickness maps for multiple lines show reproducible scaling with the number of passes. These observations underscore DALP’s ability to achieve highly uniform, conformal ZnO layers with nanometer-level accuracy, reinforcing its equivalence to conventional ALD in deposition control [5]. Fig. 5: Thickness profiles and mapping of DALP-printed ZnO lines measured by imaging ellipsometry at 200 °C. (a) Cross-sectional thickness profile across a single line showing smooth curvature and uniformity; (b) thickness map of one printed line (~400 µm width); (c) set of ZnO lines with increasing numbers of passes (50–250), demonstrating reproducible, linear thickness scaling. Source: Stefanovic et al., 2023 [5]. Comprehensive material characterization confirmed that ZnO films produced by the DALP® process are crystalline, stoichiometric, and free of defects, matching the high quality typically achieved by conventional ALD. Microscopic analyses using SEM and AFM revealed dense, homogeneous microstructures with nanoscale surface roughness and grain sizes of approximately 20-30 nm, which remained consistent across the tested temperature range. Grazing-incidence XRD measurements further identified the films as hexagonal wurtzite ZnO, exhibiting a pronounced (002) preferential orientation at around 250 °C, a texture particularly favorable for piezoelectric and electronic device applications. Complementary EDS and XPS analyses confirmed that ZnO layers deposited within the 200-250°C window are stoichiometric (Zn:O ≈ 1:1), while deviations at lower temperatures (150 °C) or higher temperatures (≥ 295 °C) resulted in oxygen-rich and zinc-rich compositions, respectively, attributed to incomplete surface reactions or precursor decomposition [5]. Fig. 6: Microstructure of ZnO printed by DALP at different substrate temperatures (150 °C, 200 °C, 250 °C, 295 °C). SEM (top), AFM (middle), and XRD (bottom) confirm polycrystalline wurtzite ZnO with temperature-dependent orientation. Best crystallinity and stoichiometry occur near 200–250 °C [5]. 2.3. Further developments of ZnO using DALP® and Nanofabricator At ATLANT 3D, we have also conducted extensive development and testing of ZnO deposition using the DALP® process, employing the same Zn(DMP)₂ + H₂O precursor-reactant combination as described in the literature. Our objective was to evaluate the electrical properties, specifically resistivity, of ZnO films grown under varying substrate temperatures and film thicknesses, to benchmark performance and identify optimization pathways. For electrical measurements, ZnO lines were printed on gold-padded wafers, which allowed for direct contact with predefined electrode pads and facilitated resistance testing. For resistance measurements we received help from the Danish Technological Institute (DTI) of these lines, as our in-house potentiostat was not sensitive enough for the task. The setup enabled accurate two-point resistivity measurements across multiple DALP® deposited ZnO lines of different thicknesses and deposition conditions. Fig. 7: Optical micrograph of ZnO lines printed via DALP® on gold-padded wafer for resistivity testing. Au contact pads allow direct measurement of resistance across each line. Our measured ZnO resistivity-temperature curves are ≈3 orders of magnitude higher than the reference values and do not reproduce the characteristic trend reported in the literature. This discrepancy is most likely associated with the open-air deposition environment used in DALP® deposition. Literature indicates that ZnO grown in ambient conditions can exhibit increased resistivity due to oxygen adsorption and defect-related scattering at grain boundaries. A study by Ellmer & Mientus (2008) show that oxygen-rich surface states and grain boundary defects act as electron traps, thereby reducing carrier mobility in ZnO thin films deposited in non-inert atmospheres [6]. Similar behavior has been observed in open-air ALD systems, where uncontrolled oxygen incorporation leads to reduced conductivity compared to inert or vacuum processes. Fig  8: Left: Resistivity of DALP® deposited ZnO lines vs substrate temperature (600–1500 passes), showing a mid-temperature maximum followed by partial recovery at higher temperature. Right: Reference temperature dependence from literature for comparison (c) (highlighted).) [6]. Work is ongoing to further refine ZnO deposition conditions using DALP®. The lithography-free, direct-write nature of the technique allows for rapid, combinatorial optimization by systematically varying process parameters such as substrate temperature, deposition speed, gap distance between nozzle and substrate, and precursor and reactant bubbler temperatures. These tunable factors provide a wide process window to target improved crystallinity, stoichiometry, and electrical performance. Through systematic process mapping and controlled testing, DALP® continues to demonstrate its potential as a rapid prototyping platform for high-quality oxide semiconductors. Fig. 9: Optical image of ZnO DALP® deposition test library printed on a 4-inch Si/SiO₂ wafer. Each line corresponds to a unique combination of parameters: substrate temperature, deposition speed, gap, and bubbler temperatures, all deposited in a single automated run. Positioning DALP® Within the ZnO Fabrication Landscape Alternative Fabrication Methods for ZnO Thin FilmsBeyond DALP®, several fabrication routes have been proven to yield functional ZnO, each trading off precision, throughput, substrate compatibility, and post-processing. Among additive approaches, inkjet printing digitally patterns either nanoparticle dispersions or precursor inks that are converted to ZnO by thermal, UV, or plasma treatments. This enables maskless deposition on rigid or flexible substrates and large-area scalability, though film densification and crystallization typically require post-annealing and careful suppression of coffee-ring effects and porosity. Representative studies and reviews document successful thin films and devices prepared by inkjet, including recent demonstrations on flexible substrates and surveys of process-structure-property relations [7]. Two mature vacuum techniques pulsed laser deposition (PLD) and magnetron/RF sputtering remain benchmarks for dense, uniform ZnO. PLD can deliver highly stoichiometric and even epitaxial ZnO with excellent control of crystallinity via laser energy, oxygen ambience, and substrate temperature, albeit at limited area and higher system cost. Multiple studies and reviews outline PLD’s strength for high-quality ZnO thin films [8]. Magnetron/RF sputtering, by contrast, is industry-proven for large-area coatings at relatively low substrate temperatures; it provides dense, uniform layers suitable for transparent electronics, though patterning still requires masks or lithography and plasma exposure can introduce damage if not tuned [9]. Spray pyrolysis (including ultrasonic/nebulized variants) offers a low-cost, scalable path to ZnO by atomizing precursor solutions onto heated substrates, where thermal decomposition forms the oxide. It is attractive for rapid screening and large-area coatings but generally needs optimization to reduce roughness/porosity and to enhance film density and transport properties. Recent reviews and studies describe ZnO films produced by spray with controllable optical/electrical performance and post-treatments to improve crystallinity [10]. In summary, these methods map a practical spectrum of choices for ZnO: inkjet and spray routes offer low-cost, maskless patterning and rapid scale-up but typically rely on post-conversion to reach device-grade quality [6][9], while PLD and sputtering deliver dense, crystalline films with strong process control at the expense of vacuum infrastructure and added patterning steps [8][9]. DALP® complements this landscape by combining ALD-like, self-limiting growth with direct, lithography-free patterning using safer precursors, enabling fast design-to-device iteration and precise thickness control within the 100-300°C window, with far lower precursor consumption than blanket ALD [5]. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend   Summary & Conclusions  This work outlined why ZnO remains a compelling platform material, combining a wide bandgap for optoelectronics with strong piezoelectric response for sensing and actuation, and showed that DALP® can deliver patterned, device-grade ZnO with ALD-like control. We reviewed literature results, detailed our own DALP-based ZnO growth, thickness uniformity, and microstructure, and discussed electrical measurements that highlight where open-air growth, contact geometry, and defect chemistry can shift resistivity trends. Taken together, the picture is clear: ZnO by DALP® retains the precision of ALD while removing lithography, making it a practical route for rapid, iterative device prototyping. At ATLANT 3D, we are building on this foundation to expand ZnO capabilities in directions that matter for industry adoption: tighter control of stoichiometry and orientation within the 200-250 °C window; systematic de-embedding of contacts via TLM/four-point and Hall measurements; and process libraries that map substrate temperature, nozzle-substrate gap, stage speed, and precursor/reactant conditions to target electrical and piezoelectric figures of merit. The combination of DALP® with our NANOFABRICATOR™ Lite tool enables exactly this kind of rapid development, maskless, recipe-programmable, and combinatorial, so multiple thicknesses, chemistries, and device geometries can be explored on a single wafer in one run. Fig 10: ATLANT 3D NANOFABRICATOR™ LITE: A compact DALP® platform enabling maskless, direct-write deposition with ALD-level control. What to expect in Berlin? Download Conference Handout

Contact: Max Scherf, Maximilian.Scherf@profactor.at     Reimagining the entire life-cycle of electronics—from raw material sourcing to end-of-life management—is essential for building a sustainable economy and society. The EU-funded HyPELignum project addresses this challenge by exploring a holistic approach for manufacturing electronics with net zero carbon emissions, centred around additive manufacturing and wood-derived materials.   Methodology Materials By creating novel materials derived from wood feedstock, such as lignocellulosic composite boards, bio-derived resins, and functional compounds incorporating abundant, low-impact metals, a transition towards green electronics can be realized. These new materials expand the technological possibilities for electronics while maintaining a strong focus on environmental responsibility. A key material in this development is Cellulose Nano Fibrils (CNF), known for its excellent mechanical performance, ease of application, biodegradability, and eco-friendly nature. CNF has emerged as a promising material for eco-electronics due to its unique properties. Initial research at Empa demonstrated the feasibility of using CNF from delignified pulp (ECF) for eco-electronics applications. The prepared CNF samples exhibited robust mechanical strength and stability in indoor environments, providing a strong foundation for further development. While CNF-based ecoPCBs show strong mechanical properties comparable to FR4 PCBs, they face challenges regarding water vapor absorption and dimensional stability under extreme conditions (i.e. Temperatures  above 170°C). The conductive traces on the l-CNF boards were fabricated by inkjet printing a highly conductive, low-viscosity nanoparticle ink (NanoDimension) using the DragonFly™ IV printer (see Figure 1a)). Assembly of electronic components on l-CNF boards was done using curable glue from LOCTITE® AA 3491 from Henkel (mechanical fixation), and conductive paste from LOCTITE EDAG PF 050 E&C from Henkel (conductive bonding).   We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend High-resolution inkjet printing of electronic circuits To understand the behavior of the ink on the substrate, surface contact angle measurements and calculation of the surface energy were performed on the l-CNF board. A good match between surface energies of the surface and ink was observed, which was subsequently confirmed by printing results that exhibit good quality (sufficient resolution, no significant de-wetting or spreading of the ink on the l-CNF substrate).   l-CNF boards were wiped with ethanol to remove grease and dust particles before loading to the printer. The printing pattern was adapted from an open-source project, “Fair Mouse,” from NAGER IT. Next to the printed board for the sustainable mouse, other test structures were printed on l-CNF boards to estimate the adhesion and resistance of printed layers. The printing process includes inkjet deposition of conductive ink layer by layer followed by inline NIR drying of the ink to evaporate the carrying solvent and sintering to achieve good conductivity. The l-CNF board was kept at 120°C (tray temperature) during printing. Figure 1: Test l-CNF board loaded in the DragonFly printer a); Test structure printed on the board to estimate quality of printing and resistance of printed interconnections b). Characterization of printed lines Before printing the mouse electronic design, conductive traces on l-CNF were characterized to confirm that a good resistance of the printed track can be achieved. Layers up to the thickness of 40µm were printed and 3D profiles were measured. Figure 1b) depicts the typical shape of layers of 7µm and 40µm, respectively. 3D profiles were measured by Keyence VK-X3000 laser scanning microscope (see Figure 2a)). Resistance of printed tracks was characterized using a custom-made four-probe point station with source-meter Keithley 2400 and 4-wire measurement using Keysight 34465A (see Figure 2b). Printed interconnections with the thickness of 40 µm exhibit sheet resistance as low as 6,3mΩ/sq. For printing of the demonstrator board, the interconnection pattern with 20 µm in thickness was printed as a compromise between printing time and sufficient conductivity. Line resistances for different line lengths are depicted in Figure 2c) (measured on a line with 150 µm in width). Figure 2:Profiles of conductive layers printed on l-CNF substrate, the 3D profile view was taken in the printing direction a); Test station for resistance measurements b); line resistance vs line length c) Assembly of SMDs The assembly of passive components on the inkjet-printed circuit, built on a lignin-based PCB, was carried out manually. To ensure the mechanical stability of the electronic components, a commercially available UV-curable adhesive was applied to fix the electronic components on the top of the substrate. Electrical connections were made by glueing the components on the bottom (interconnections) side using a low temperature cured conductive paste. Curing to establish good electrical contact was done in convection oven at 120°C for 30 minutes. The functionality test of the whole assembly was done simply by attaching a USB cable and connection to a USB port in a PC.   The inkjet-printed antenna was integrated onto the textile band via heat-seal bonding, utilizing the C-Base bonding system to attach the corresponding chip . The fabricated sustainable printed circuit board was tested and found fully functional after placing it in a 3D printed housing out of wood-filled PLA filament, as it is demonstrated in the video in the supplement information. Demonstrators Mouse demonstrator (conventional, fully printed, ecoPCB) The development of this first working demonstrator, which is 97% based on ecofiendly material (by weight), represents a significant advancement in the creation of eco-friendly devices. This demonstrator not only showcases the feasibility of using biodegradable substrates in electronics but also sets a precedent for future innovations in sustainable technology.  Figure 3: l-CNF PCB with assembled components in mouse housing a); Bottom view of the l-CNF PCB with inkjet printed conductive traces Smart furniture A key demonstration of HyPELignum’s approach is the smart furniture demonstrator, which integrates wood-based electronics, energy-efficient µchips, and sensors into a functional furniture design (see Figure 4). This render illustrates how wood-derived materials can host electronic components in a practical, aesthetically pleasing application, highlighting the synergy of sustainability, design, and functionality.   Figure 4: Smart Furniture Demonstrator Module (Rendered): Showcases integrated wood-based electronics in a functional furniture setting. New wood-derived materials were created from lignocellulosic waste and biopolymers, like lignocellulose printed circuit board. Authors Václav Procházka¹, Yuliia Dudnyk², Pavel Kulha¹, Thomas Geiger², Max Scherf¹ [ 1 ]: Profactor GmbH, Steyr, Austria  [ 2 ] Cellulose and Wood Materials Laboratory, Empa – Swiss Federal Laboratories for Material Science and Technology, Dübendorf, Switzerland Visit us at booth G01 in Berlin and see for yourself the capabilities of inkjet-printed sensors and PCBs. We are Exhibiting in Berlin. Visit our booth at the TechBlick event on 22-23 October 2025 in Berlin . Contact us for your special discount coupon to attend What to expect in Berlin? Download Conference Handout