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Speaker: Jan Lossen | Company: ISC Konstanz | Date: 9-10 March 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

and their applicability for successful manufacturing strategies. Speaker: Marco De Angeli | Company: Flex | Date: 9-10 March 2022 | Full Presentation The presentation will provide an overview of proven paths to improve time to market, cost of ownership and user experience in scaling up production of Flexible Hybrid Electronics for the Industrial, Medical and Automotive markets. Beginning with material choice and available manufacturing schemes and concluding with proposed applications, we will touch on available technologies and their governing design rules. We will review recent developments that enable finished products to improve user experience and some key learnings from a conductive ink sensor design. Finally, we will provide a couple of examples of scalable FHE applications that meld the use of existing capital assets with the rapidly evolving industry options to deliver improved products. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Philipp Hölzl | Company: ELANTAS Europe GmbH | Date: 9-10 March 2022 | Full Presentation This presentation will show you a short overview of the newest inks at ELANTAS Europe for printed electronics. Starting with the new fine line ink for different applications, like conductive pattern, sensors and more. Going ahead with a UV curable silver conductive ink for screen printing. This could be interesting for a roll to roll production to print RFID Antennas efficient and flexible. At least we would like to introduce our silver conductive ink for InMold electronics with an outstanding performance in the field of thermoforming. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Ralph Birnbaum | Company: IO Tech 3D Printing | Date: 9-10 March 2022 | Full Presentation The electronics industry is characterized by a multitude of steps involving many technologies and materials, from the naked PCB to the packaging and assembly of semiconductor devices. All these steps and applications are carried out by many different machines and processes. But at the root of them, several of these steps involve one form or other of depositing a material on a substrate. There are subtractive processes, e.g. etching, additive processes, such as screen printing, and digital processes, such as jet dispensers. In this paper we present a Continuous Laser Assisted Deposition (C.L.A.D.) technology that combines the benefits of all these approaches in advanced manufacturing. It has the productivity of screen printing, with the flexibility of dispensing and the precision of jetting. C.L.A.D. technology can deposit highly viscous materials on large areas. The technology is mesh-free, nozzle-free and contactless, meaning lower maintenance costs. As an additive manufacturing technology, it involves less material wastage, and enables new designs. Combining multiple steps into one station is less labour-intensive, and most importantly of all, it uses standard materials.” Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Samuel Stremsdoerfer | Company: Jet Metal Technologies | Date: 9-10 March 2022 | Full Presentation Jet Metal Technologies is a company created in 2007 in Lyon, France, that provides metallization turnkey solutions. The Jet MetalTM technology uses the simultaneous spraying of 2 water-based solutions that instantly grows a very thin layer of metal directly onto the surface thanks to a chemical oxidoreduction reaction. This metallization principle only requires spraying equipment at ambient pressure and temperature. Due to the use of painting tools (booth, spraying gun, pump...), this unique technology perfectly suits in-line production and can be considered as environmentally friendly as it only uses water-based solutions (CMR & solvent free) but also no curing step. Recently, a need has been identified concerning patterns metallization and so the Jet MetalTM traditional process evolved towards selective metallization with the patented JetSelectiv® process, relying on the use of a negative mask applied with traditional ink printing methods (screen printing, inkjet, flexography...) then removed during the metallization process to reveal fine metallic patterns. Fig 1: Spraying technology to create a metallic film Fig 2: R2R JetSelectiv® process equipment Regarding printed electronics, JetSelectiv® is particularly interesting as it deposits, without any curing step, a pure silver layer that has a conductivity as high as 90% of silver’s bulk conductivity (63 MS/m). With a layer thickness varying from 10nm to 1μm, sheet resistance can be as low as 40 mΩ/□, which covers most applications for printed electronics (signal tracks, LED powering, electrodes...). For applications dealing with high-current, electroless or electrolytic plating thickening can be performed. JetSelectiv® can produce very precise patterns, with a resolution under 20μm depending on the printing technique, which can satisfy very high-demanding application such as metallic micromesh. While keeping its optical transparency, thin patterns can be deposited to produce metamaterial that has frequency-selection capability for example. JetSelectiv® is also adapted to realize sub-micron patterns to replace heavy lithography process for microelectronics application. For industrial application, JetSelectiv® is adapted from sheet-to-sheet process to roll to roll process (R2R) which offer a bunch of high outputs industrial options. Current developments on radio-frequency subjects suggest that JetSelectiv® metallic pattern are relevant for some sub- GHz application (RFID UHF tags notably with reading ranges similar to what traditional 9μm aluminum etched tags are capable of but most importantly with future mmWave devices operating in the sub-100GHz domain. In fact, JetSelectiv® delivers thin, very smooth and highly conductive patterns that can meet high frequency requirements. Jet Metal pure silver coatings can be used for thermal insulation purposes as confirmed by its reflectivity that is greater than 97% in the IR spectrum. Also heating elements can be produce from various substrates including PET, polyimide films, leather or even textile. Experiments made on Kapton® film showed that very high amount of heat can be generated (more than 7500 W/m2) thus reaching very high temperature (greater than 380°C for instance). Micromesh patterns allows to achieve optically transparent heating elements without compromising its performance. Until now, Jet Selectiv® only applied to 2D substrates but recent developments led to the realization of selective metallization onto 3D shaped films using thermoforming that can be part of a 3D injection part. Such process is currently in patent pending as it Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Melbs LeMieux | Company: Electronink | Date: 9-10 March 2022 | Full Presentation EMI shielding is a critical aspect of semiconductor packaging and chip/wafer manufacturing that ultimately enables OEMs to provide more communication and performance features using less space, weight, and providing more form factors in their products Sprayable metal-complex films developed and commercialized by Electroninks and Merck/EMD offer high performance metalization allowing OSATS and EMS ease of production with more sustainable manufacturing. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Hikaru Uno | Company: Merck | Date: 9-10 March 2022 | Full Presentation EMI shielding is a critical aspect of semiconductor packaging and chip/wafer manufacturing that ultimately enables OEMs to provide more communication and performance features using less space, weight, and providing more form factors in their products Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Rafael Michalczuk | Company: Swarovski | Date: 9-10 March 2022 | Full Presentation Swarovski will showcase the development and application of Printed Electronics in combination with Functional Crystals that enable Smart Decorative Surfaces going beyond pure decorative function – e.g. for the automotive interior design Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Aad van der Spuij | Company: Henkel AG & Co. KGaA | Date: 9-10 March 2022 | Full Presentation The ongoing expansion of megatrends such as IoT and digitalization, is driving the demand for printed sensors and antennas that are applicable to differently shaped surface structures. Throughout this presentation Henkel Printed Electronics will showcase latest Loctite ink material innovations for 3D printed electronics. Ranging from conductive silver inks suitable for screen printing and forming, valve jet printing and pad printing. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Sandra Melo | Company: Simoldes | Date: 9-10 March 2022 | Full Presentation The LEIMSA project aims to develop disruptive components for the interior of the car, floor center console and dashboard, allowing the integration of truly innovative and sustainable user centered functionalities. For this purpose, decorative elements and distinctive functionalities will be integrated into the products with as few operations as possible, through the use of emerging and lightweight technologies in the mold (in-mould operations), such as In-Mould Decoration (IMD), or In- Mold Labeling (IML), High Pressure Forming (HPF) and In-Mould Electronics (IME). Modern IM (In-Mould) technologies allow the combination of several stages of traditional production processes in the mold to obtain additional functionalities for the parts or components, but also for aesthetics improvements. As a result, an upgrade of functionalities is achieved, as well as a better aesthetic appearance and a greater durability of the generated products. The development of intelligent and haptic surfaces with an attractive seamless 3D design and an immersive and intuitive HMI (human-machine) interface centered on the user experience are the main goals of LEIMSA. For this purpose, the needs of the users were identified, in order to guide the development of product, design and style to the market. The development of production tools and integration for a pre-industrial level of technological maturity is also contemplated. The LEIMSA project is carried out by a consortium of six highly renowned entities in the national and international automotive industry: Simoldes Plásticos, S.A (leader promoter of the project), Bosch Car Multimedia, Celoplás, Plásticos para a Indústria S.A., DTx, CEiiA and the University from Minho. With a global investment of 4,898,005.06 €, this project is co-financed by the Portugal 2020 Programme, under the Operational Program for Competitiveness and Internationalization (COMPETE 2020) with the amount of 3,036,914.62 €, from the European Fund for Regional development. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Ana Cortez | Company: Celoplás | Date: 9-10 March 2022 | Full Presentation The LEIMSA project aims to develop disruptive components for the interior of the car, floor center console and dashboard, allowing the integration of truly innovative and sustainable user centered functionalities. For this purpose, decorative elements and distinctive functionalities will be integrated into the products with as few operations as possible, through the use of emerging and lightweight technologies in the mold (in-mould operations), such as In-Mould Decoration (IMD), or In- Mold Labeling (IML), High Pressure Forming (HPF) and In-Mould Electronics (IME). Modern IM (In-Mould) technologies allow the combination of several stages of traditional production processes in the mold to obtain additional functionalities for the parts or components, but also for aesthetics improvements. As a result, an upgrade of functionalities is achieved, as well as a better aesthetic appearance and a greater durability of the generated products. The development of intelligent and haptic surfaces with an attractive seamless 3D design and an immersive and intuitive HMI (human-machine) interface centered on the user experience are the main goals of LEIMSA. For this purpose, the needs of the users were identified, in order to guide the development of product, design and style to the market. The development of production tools and integration for a pre-industrial level of technological maturity is also contemplated. The LEIMSA project is carried out by a consortium of six highly renowned entities in the national and international automotive industry: Simoldes Plásticos, S.A (leader promoter of the project), Bosch Car Multimedia, Celoplás, Plásticos para a Indústria S.A., DTx, CEiiA and the University from Minho. With a global investment of 4,898,005.06 €, this project is co-financed by the Portugal 2020 Programme, under the Operational Program for Competitiveness and Internationalization (COMPETE 2020) with the amount of 3,036,914.62 €, from the European Fund for Regional development. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Thomas Nugraha | Company: Motherson Innovations | Date: 9-10 March 2022 | Full Presentation Motherson's customer demand on product innovation Introduction to previous projects that challenges Motherson to be more active in printed electronics. The projects not only cover Automotive projects (which is the core business of Motherson), but also In different area outside of Automotive industry. · Printed electronics introduction to Motherson Products Explanation on the need to implement printed electronics based on above customer demand. Each project requires always require different "recipe" to meet customer expectation, which result in various challenges. · Overcoming challenges on prototyping, production and product reliability Due to each project requires different properties, the combination of substrate, ink and manufacturing steps results in unexpected challenges. We always add one or two additional step compared to our standard development steps to ensure the quality of production and acceptable yield. · Printed electronics : a close collaboration for all players in the ecoystem Same as other product and technology. Each player need to understand what is the demand of end customer, while also providing information regarding what was previously impossible, become possible by printed electronics. With this, the customer, may come up with new product idea and innovation by implementing this new possibilities. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda