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Speaker: Tommy Höglund | Company: DP Patterning | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Malte von Krshiwoblozki | Company: Fraunhofer IZM | Date: 24-Jun-22 | Full Presentation Fraunhofer IZM is an electronic packaging institute providing solutions for new electronics manufacturing. Fraunhofer IZM is focusing on miniaturization, new materials and new form factors for electronics. Adhesive bonding for electronic textiles was developed and evolved at IZM during several projects. This pitch will introduce the technology that allows the assembly of electronic modules on textiles through creating an electrical and mechanical connection within the same process. Adhesive bonding allows the integration of any kind of PCB, flex PCB or stretchable electronics based module e.g sensor module, light module etc. into a textile circuit. Therefore, Fraunhofer IZM developed a prototype bonding machine with a working area of 1 by 1 m that is able to handle any kind of textile substrate. A hug variety of textile integrated conductors are supported by adhesive bonding, even insulated conductors if the insulation is thermoplastic. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Mahmoud Tavakoli | Company: University of Coimbra | Date: 24-Jun-22 | Full Presentation Stretchable electronics have many applications in wearable technology, and health monitoring. But to find their way out of the labratories, fundamental problems had to be solved. In this presentation, I´ll explain how we addressed t hese problems, and how this enables us to move toward scalable fabrication of 3R electronics that are Resilient, Repirable and Recylable. Taking advantage of our novel liquid metal composites, and innovative chip integration processes, i explain direct digital printing of liquid metal based stretchable circuits, and demonstrate examples of microchip integrated soft-matter electronics with record-breaking maximum strain value of >1000% strain. As the whole process is perfomed at the room temperature (even the soldering), 3R electroncis pave an importatn step toward green manufacturing, and sustinable development in electronics. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: David Dewey | Company: Fujikura Kasei | Date: 24-Jun-22 | Full Presentation As stretchable inks improve, the possibility of a fully stretchable medical device is realized with silicone-based stretchable inks utilizing AgCl filler for medical electrodes. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Armin Wedel | Company: Fraunhofer IAP | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Aart-Jan Hoeven | Company: DoMicro | Date: 24-Jun-22 | Full Presentation DoMicro has developed a printer (the DM50-ENP) with a novel technology for printing wires with nanoscale dimensions. The technology is based on the electrohydrodynamic effect. This effect enables a submicron additive technology, in which an electric field is used for pulling an inkjet into a very narrow shape. The effect can reduce the line width from about 30 microns, as can be obtained with industrial inkjet technology, down to 1 micron or less. Applications are in various fields, such as displays, micro fluidics, batteries and photo voltaics. The presentation highlights the opportunities in these application areas, as well as results from trials with the DoMicro printer. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Thomas Kolbusch | Company: Coatema | Date: 24-Jun-22 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Shahzad Khan | Company: Keiron Printing Technologies | Date: 24-Jun-22 | Full Presentation Laser-Induced Forward Transfer could replace traditional digital printing methods such as Inkjet for printed electronics applications. Whereas materials must be tailored to Inkjet’s limited range of functionality, LIFT can work with commercially available inks typically known for screen printing. This feature reduces the cost of production and waste for a more sustainable and flexible electronics manufacturing plant. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Gregor Scheipl | Company: Joanneum Research | Date: 24-Jun-22 | Full Presentation Imprint lithography is a versatile technology for the replication of micro- and nanostructures. It is widely used in high-tech areas such as optics, electronics, photovoltaics, sensor technology, in the medical field ("lab-on-chip") or in surface finishing. As a European pioneer, JOANNEUM RESEARCH Forschungsgesellschaft mbH operates a roll2roll (R2R) UV coating and imprinting system since 2010 and is developing and using resins that are biodegradable and thus sustainable. Required structures can be produced on a meter-per-minute scale, similar to newspaper printing. With a strong focus on the product, processes are developed and optimized for: (i) Environmentally friendly production of high-resolution conductive structural elements for organic electronics (fine conductor paths, nanoscale electrodes for organic transistors) (ii) Precise production of optical 2.5D structures for the management of light in films (coupling and decoupling, light conduction) for applications in photonics (iii) Large-scale realization of 3D-structured bionic surfaces and complex nanostructures that make effects from nature technically usable (shark skin, lotus effect, gecko effect, structural colors) (iv) Cost-effective production of complex microfluidic elements in foil as the basis of biosensors for lab-on-foil analysis systems (v) Continuous production of refined high-tech film surfaces for packaging, decoration, security and labelling, which have improved optical, mechanical and chemical properties due to micro- and nanostructure. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Jonathan Waldern | Company: META (Metamaterial) | Date: 24-Jun-22 | Full Presentation Meta Materials Inc. is developing discrete platform specific proprietary technologies for large-surface-area lithography, allowing the manufacture of nanostructures to be carried out in a cost-effective manner. Each platform employs a massively parallel patterning scheme, designed to be scalable to large areas of either rigid substrate materials and rolls of flexible films. In certain cases we use a phase-shift mask approach and in others, cast plasmonic printing – all allowing the creation of structures with feature sizes down to 50 nm. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Vahid Akhavan | Company: PulseForge | Date: 24-Jun-22 | Full Presentation Many prototypes have been developed in the flexible hybrid electronic space that do not go to production due to poor longevity of the final design. One of the big challenges remains how to connect conventional component to a flexible architecture, while maintaining the expected longevity in the circuit. Anisotropic conductors are the current benchmarks for these devices, but their performance is lacking as compared to standard soldering processes. PulseForge has devised a new photonic soldering process that enables attachment using standard solder pastes onto components and substrates that cannot withstand the oven reflow temperatures. Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidous temperature using radiative energy transfer, and light is converted to heat through optical absorption. This process is selective by exploiting selective absorptivity of active regions or with the aid of shadow masks. The optical flash can be modulated digitally, with high temporal resolution, to enable highly customizable temperature profiles, ranging from traditional to highly innovative. Photonic soldering is compatible with standard high temperature lead free solder alloys (e.g. SAC305) in combination with temperature-sensitive substrates (e.g. PET). The nonequilibrium nature of the heating process enables thermal isolation of active regions from temperature sensitive regions. The resulting flexibility in material selection gives designers significant freedom and unconventional options in device architectures. The innovative approach enables a production flow that better lines up with the next generation of electronics. This presentation highlights the advantages of the new technology and discusses the application space for the photonic soldering technology. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Valentijn von Morgen | Company: DuPont Teijin Films UK Ltd | Date: 24-Jun-22 | Full Presentation Continued advances in the Flexible and Formable Electronics is driving the material suppliers such as DuPont Teijin Films to provide functionality to meet wide ranging demands for applications such as displays, TFT backplanes, energy harvesting and storage, sensors and Human Machine Interfaces. This talk will give a brief overview of DTF’s PET and PEN product range meeting wide ranging application needs. Thereby the focus will be on the recent progress made with the development of PEN substrates for extreme processing requirements, formable PETfilms for in-mold electronics, films with ultra clean and smooth surfaces for ultra barrier and high resolution structures and combining UV absorption, weather resistance or fire retardancy whilst also offering more sustainable solutions with the incorporation of recycled materials in the substrates. DTF has launched many films through collaborations with partners in the flexible electronic industry as our organisation is proving to be uniquely capable of offering customised and affordable polyester substrate solutions. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda