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Polymer Thick Film (PTF) technology has played a significant role in printed electronics for more than forty years . By combining additive printing methods with advanced material innovation, PTF has enabled a wide range of electronic designs across industries. Although the underlying process is straightforward, effective use of PTF materials requires both technical understanding and practical experience.    To support continued learning  in this field, Heraeus Electronics is hosting a two‑day, on‑site workshop  at the Thick Film Application Center in Conshohocken, Pennsylvania. The workshop is open to participants across various roles and experience levels. Sessions will primarily focus on technical topics , including materials, processing, and application‑specific considerations.   The program includes small‑group seminars led by engineering experts, designed to strengthen participants’ understanding of PTF pastes and associated process steps. The workshop emphasizes practical   knowledge that can be applied directly to manufacturing and development activities.   Workshop components include: Technical Sessions:  where we share knowledge, practical insight, and innovative approaches to understanding the extensive world of thick film.  Hands-On Demonstrations:  that allow you to grasp the intricacies of the process and gain practical insights. In-Lab Activities:  guided hands-on exercises using our state-of-the-art equipment. Facility Tour:  highlighting our manufacturing process as well as our R&D capabilities. Networking Activity:  Group outing on the evening of April 21st to connect and engage in meaningful discussions with fellow participants.    To learn more about the workshop, visit: Printed Electronics Workshop 2026 . *Space is limited; submitting the interest form does not guarantee your placement We are exhibiting at The Future of Electronics RESHAPED in California, USA  on 10-11 June 2026  and in  Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action.   Join us at the flagship TechBlick events in California on 10-11 June 2026 + in Berlin on 21-22 October 2026 This event is the global hub for Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the event in California will also feature. The Future of Wearables Reshaped     The event in Berlin will also feature: Perovskite Connect , Sustainable Electronics RESHAPED , Electronic Textiles RESHAPED

In this newsletter you will find short highlights given at various editions of TechBlick's Future of Electronics RESHAPED conference and exhibitions. In particular you can learn about the following: Join us in Mountain View, Silicon Valley, in June at the latest edition of the Future of Electronics RESHARED event. This is the most important event of the year dedicated to Additive, Printed, Hybrid and Sustainable Electronic. Explore Agenda here https://www.techblick.com/electronicsreshapedusa Frederic Güth | Fraunhofer ENAS: How does the substitution of the structural unit in Parylene polymers affect their properties and application-specific fine-tuning? Ryojiro Tominaga | Fuji Corporation: How does the low-temperature sintering process impact the choice of conductive inks and substrate materials? Ryan Banfield | Heraeus Electronics: Why is a solderable polymer necessary when high-temperature fired materials have been available for decades? Paul Gaylo | Lockheed Martin: How does the miniaturization of electronic warfare systems impact mission capabilities? Alejandro Covalin | Spark Biomedical: How can 3D printing and printed electronics overcome the limitations of traditional manufacturing in wearable devices? Eric Wolf | Essemtec: How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties? Allan Neville | Human Systems Integration, Inc.: How does the manufacturing process for integrating electronics into garments differ from traditional electronics manufacturing, and what are the key challenges in bridging these two worlds? Daniel Lacorte | Ames Goldsmith: How can manipulating precipitation process parameters affect the final particle morphology? Jonathan Chang | Panasonic: How does Panasonic's Fine Cross technology differ from conventional copper mesh processes? Ryota Shimizu | Satosen Co.,Ltd: How does repeated stretching lead to electrical failure in conventional stretchable PCBs? Dr. Shenqiang Ren | University of Maryland: How does the performance of this novel copper ink compare to commercially available alternatives under ambient sintering conditions? Denis Cormier | Rochester Institute of Technology: How does molten metal droplet jetting compare to traditional nanoparticle-based conductive inks? Dresden Integrated Center for Applied Physics and Photonic Materials - TU Dresden: What specific etching process is used to remove the basophil from the leaf, and how does this process affect the structural integrity of the remaining lignocellulose? Book before 15 March 2026 when winter early bird rates expire https://www.techblick.com/electronicsreshapedusa How can 3D printing and printed electronics overcome the limitations of traditional manufacturing in wearable devices? The speaker asserts that 3D printing, 3D electronics, and 3D manufacturing offer a distinct advantage in producing wearables. This stems from several key factors that address limitations inherent in traditional manufacturing processes. The ability to create inexpensive, ultra-thin, and flexible devices is paramount. The capacity of 3D-printed wearables to conform seamlessly to the body's contours is highlighted as a significant benefit. This adaptability enhances user comfort and device efficacy, particularly in medical applications where precise sensor placement and consistent contact are crucial. The speaker emphasizes that this approach is the optimal path forward for wearable technology. The convergence of 3D printing, advanced manufacturing techniques, and printed electronics is presented as the future of wearable device production. This synergy enables the creation of devices that are not only functional and cost-effective but also highly personalized and comfortable for the user. This is especially important in the context of women's health, where tailored solutions can address specific physiological needs. In this short video, you can learn: * The advantages of 3D printing and printed electronics in wearable manufacturing. * How these technologies enable the creation of inexpensive, flexible, and body-conforming devices. * The potential of this approach to revolutionize wearable technology, particularly in women's health. 📋 **Clip Abstract** The speaker advocates for 3D printing and printed electronics as the superior method for producing wearables due to their cost-effectiveness, flexibility, and ability to conform to the body. This approach is particularly relevant for women's health applications, where personalized and comfortable devices are essential. #3DPrinting, #PrintedElectronics, #WearableElectronics, #FlexibleElectronics, #DigitalHealth, #Bioelectronics This presentation was given by Alejandro Covalin from Spark Biomedical at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties? Essemtec emphasizes the importance of understanding the rheology of dispensed materials, particularly the concept of shear thinning in thixotropic pastes. These materials, classified as non-Newtonian fluids, exhibit reduced viscosity under higher pressure. This behavior is critical in dispensing applications where pistons force material through an aperture. The system accounts for variables such as dispensing speed and temperature to determine the optimal open time for achieving desired dot sizes from small apertures. Essemtec collaborates with material companies to qualify specific parameters, acknowledging that these relationships are often non-linear and can result in complex rheological behaviors at different pressure levels. The shape of the particles within the paste also influences dispensing characteristics. Solder paste typically contains spherical particles, while conductive epoxies often feature silver in flake form, and structural glues may contain colloidal silica. Understanding these particle morphologies is crucial for achieving consistent and reliable dispensing results. In this short video, you can learn: * How shear thinning affects dispensing of non-Newtonian fluids. * The importance of material rheology in dispensing applications. * How particle shape influences dispensing characteristics. 📋 **Clip Abstract** This segment highlights Essemtec's approach to understanding and managing the rheological complexities of dispensing various materials, including the impact of shear thinning and particle morphology. It emphasizes the importance of qualifying material parameters for consistent dispensing results. #NonNewtonianFluids, #ShearThinning, #ParticleMorphology, #PrecisionDispensing, #SemiconductorManufacturing, #AdvancedPackaging This presentation was given by Eric Wolf from Essemtec at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the manufacturing process for integrating electronics into garments differ from traditional electronics manufacturing, and what are the key challenges in bridging these two worlds? The speaker highlights a significant challenge in the field: the integration of electronics into garments, specifically addressing the cultural and technological gap between the garment industry and the electronics industry. Garment manufacturing floors are not typically equipped or accustomed to handling electronics, which require different processes and expertise compared to traditional textile work. This disconnect poses a major hurdle in the seamless production of smart garments. The speaker emphasizes that the textile world lags behind the electronics industry by approximately 30 to 40 years in terms of technological advancement. However, there's a growing recognition and desire for collaboration between these two sectors. Organizations like NextFlex and AFFOA (Advanced Functional Fabrics of America) are actively promoting this integration, aiming to bridge the gap and foster innovation in the wearable technology space. The concept of Soft Electronics Assembly is introduced as a solution to streamline the integration process. This approach involves pre-assembling sensors and electronics into a single, manageable component before it reaches the garment manufacturing floor. This simplifies the manufacturing process and reduces the need for garment workers to handle individual electronic components, thereby mitigating potential errors and improving overall efficiency. In this short video, you can learn: * The challenges of integrating electronics into traditional garment manufacturing. * The technological gap between the textile and electronics industries. * The role of organizations like NextFlex and AFFOA in promoting collaboration. 📋 **Clip Abstract** This segment discusses the challenges of merging electronics manufacturing with garment production, highlighting the cultural and technological differences between the two industries and the efforts to bridge this gap through initiatives like Soft Electronics Assembly. It emphasizes the need for collaboration and innovation to advance the field of wearable technology. #SmartGarments, #WearableElectronics, #SoftElectronicsAssembly, #FunctionalFabrics, #WearableTech, #SemiconductorIntegration This presentation was given by Allan Neville from Human Systems Integration, Inc. at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How can manipulating precipitation process parameters affect the final particle morphology? The process begins with aqueous silver, typically silver nitrate, which is then reduced to form brown-based silver atoms. This reduction is generally achieved through a wet-based precipitation process, where nuclei are initially formed. These nuclei then develop into primary crystallites, which can be further grown using different surfactants or reducing agents. The manipulation of these surfactants and reducing agents allows for the creation of various morphologies and particle size distributions. By carefully controlling these parameters, the characteristics of the resulting silver particles can be tailored to specific application requirements. This level of control is crucial for optimizing the performance of the silver particles in printed electronics. The presenter highlights the ability to influence whether the resulting material is crystalline or polycrystalline in nature. This control is achieved by precisely manipulating the precipitation process parameters. This level of control is crucial for optimizing the performance of the silver particles in printed electronics. In this short video, you can learn: * The role of silver nitrate reduction in particle formation. * How surfactants and reducing agents influence particle morphology. * The impact of precipitation parameters on crystalline structure. 📋 **Clip Abstract** This segment details the wet-based precipitation process used to manufacture silver particles, emphasizing the control over particle morphology through manipulation of surfactants, reducing agents, and process parameters. It highlights the ability to create both crystalline and polycrystalline materials tailored for specific applications. #SilverNitrateReduction, #WetPrecipitationSynthesis, #ParticleMorphologyControl, #CrystallineStructureTuning, #PrintedElectronics, #SemiconductorMaterials This presentation was given by Daniel Lacorte from Ames Goldsmith at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does Panasonic's Fine Cross technology differ from conventional copper mesh processes? Panasonic's Fine Cross technology involves a unique process of creating grooves on PET or PC materials. Copper is then deposited within these grooves. This is achieved through a roll-to-roll manufacturing process, enabling the production of very long rolls of the material. The process also supports the creation of two-layer structures, with patterns on both the top and bottom layers. The key differentiator of this technology is the embedding of the copper within the substrate, as opposed to conventional copper mesh processes where the copper sits on top. This embedding results in a smoother surface. Furthermore, the technology allows for the creation of very narrow, two-micron width lines, contributing to higher transparency compared to conventional solutions. The roll-to-roll nature of the process allows for scalability and cost-effectiveness in manufacturing. The ability to create customizable patterns and multi-layer structures expands the range of potential applications for the technology. This approach offers a balance between conductivity, transparency, and surface smoothness, making it suitable for various applications. In this short video, you can learn: * The core manufacturing process of Fine Cross technology. * How Fine Cross differs from traditional copper mesh. * The advantages of Fine Cross in terms of surface smoothness and transparency. 📋 **Clip Abstract** This segment details Panasonic's Fine Cross technology, highlighting its unique groove-based copper embedding process and its advantages over conventional copper mesh. The roll-to-roll manufacturing and customizable patterns are also discussed. #FineCrossTechnology, #CopperEmbedding, #RollToRollManufacturing, #MicronLineWidth, #TransparentConductors, #FlexibleElectronics This presentation was given by Jonathan Chang from Panasonic at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does repeated stretching lead to electrical failure in conventional stretchable PCBs? Conventional stretchable PCBs, whether utilizing meandering copper traces or printed silver paste, face durability challenges under repeated stretching. While silver paste allows for straight patterns and higher design density compared to the complex shapes required for copper, both materials exhibit a common failure mode. This failure manifests as an increase in resistance after repeated stretching cycles, ultimately leading to electrical discontinuity. The root cause of this resistance increase lies in the formation and propagation of cracks within the conductive material. As the PCB undergoes repeated stretching, micro-cracks initiate and grow, disrupting the conductive pathways. This crack formation is exacerbated by the inherent limitations of copper and silver paste in withstanding tensile stress, leading to a gradual degradation of electrical performance. The presenter highlights that while the resistance fluctuates with each stretch and release cycle, the critical issue is the continuous upward trend in resistance over time. This trend signifies irreversible damage accumulation, eventually resulting in an open circuit and rendering the PCB unusable. This limitation restricts the lifespan and warranty potential of current stretchable PCB technologies. In this short video, you can learn: * The limitations of copper and silver paste in stretchable PCBs. * How repeated stretching leads to crack formation and increased resistance. * Why current stretchable PCBs have limited durability and short lifespans. 📋 **Clip Abstract:** This segment explains the failure mechanisms in conventional stretchable PCBs due to repeated stretching, focusing on crack formation and resistance increase in conductive materials. It highlights the limitations of current technologies and sets the stage for introducing liquid metal as a solution. #StretchablePCBs, #CopperTraces, #SilverPaste, #ElectricalFailureMode, #FlexibleElectronics, #WearableTech This presentation was given by Ryota Shimizu from Satosen Co.,Ltd at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the performance of this novel copper ink compare to commercially available alternatives under ambient sintering conditions? The speaker presents a comparison between their copper ink and a commercially available copper ink. Both inks were screen-printed onto paper substrates and sintered in open air using lamps. The speaker emphasizes the simplicity of their copper ink's processing, highlighting that it can be cured and dried in less than 30 seconds in ambient conditions. The speaker's copper ink achieved a sheet resistance of approximately 35 milliohms per square after open-air sintering. While acknowledging that this is not yet comparable to silver inks, the speaker notes that there is still room for improvement. In contrast, the commercial copper ink, when subjected to the same printing and sintering conditions, exhibited sheet resistance values in the megaohm range, significantly higher than the speaker's ink. The speaker highlights the visible difference in color between their ink and the commercial ink after sintering, suggesting a difference in the resulting copper film's properties. The speaker also mentions a live demonstration at the exhibits, inviting attendees to observe the printing process firsthand. In this short video, you can learn: * The speaker's copper ink can be sintered in open air in less than 30 seconds. * The speaker's copper ink achieves a sheet resistance of approximately 35 milliohms per square after open-air sintering. * The commercial copper ink exhibited sheet resistance values in the megaohm range under the same conditions. 📋 **Clip Abstract:** This segment showcases a direct comparison between the speaker's copper ink and a commercial alternative, highlighting the superior performance of the speaker's ink in terms of sheet resistance after open-air sintering. The speaker emphasizes the simplicity and effectiveness of their ink's processing. #CopperInk, #AmbientSintering, #SheetResistance, #PrintedElectronics, #FlexibleElectronics, #IoTDevices This presentation was given by Dr. Shenqiang Ren from University of Maryland at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does molten metal droplet jetting compare to traditional nanoparticle-based conductive inks? The speaker describes a metal droplet jetting process where metal wire or rod is fed into a micro-crucible, melted, and then ejected as molten metal droplets onto a moving substrate. This process differs significantly from traditional printed electronics methods that rely on nanoparticle-based conductive inks. The key distinction lies in the material state upon deposition; molten metal solidifies directly, eliminating the need for post-processing steps like drying or curing, which are essential for nanoparticle inks to achieve conductivity. The initial application of this technology was for metal additive manufacturing, specifically aluminum parts, rather than printed electronics. However, the speaker's team began exploring the possibility of using it for printing aluminum traces and subsequently transitioning to copper and silver. This shift required modifications to the system, including software adjustments for path planning based on Gerber files instead of STL files used in 3D printing. The transition to copper and silver also necessitated optimizing print parameters to achieve desired line quality and conductivity. A significant advantage of this method is the potential to achieve conductivity levels comparable to bulk copper, which is crucial for applications requiring high current carrying capacity. This is attributed to the formation of solid core metal lines, contrasting with the often porous and less conductive structures formed by sintered nanoparticle inks. In this short video, you can learn: * The fundamental difference between molten metal jetting and nanoparticle ink printing. * The adaptations required to repurpose a metal AM system for printed electronics. * The potential for achieving bulk-like conductivity in printed traces using this method. 📋 **Clip Abstract** This segment introduces molten metal droplet jetting as an alternative to nanoparticle inks, highlighting its potential for high conductivity and the modifications needed to adapt a metal AM system for printed electronics applications. #MoltenMetalJetting, #DirectMetalPrinting, #BulkConductivity, #NanoparticleInks, #PrintedElectronics, #CircuitFabrication This presentation was given by Denis Cormier from Rochester Institute of Technology at The Future of Electronics RESHAPED USA | Boston 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa What specific etching process is used to remove the basophil from the leaf, and how does this process affect the structural integrity of the remaining lignocellulose? The speaker introduces the motivation behind using leaves as a substrate for printed electronics, driven by concerns about electronic waste. A PhD student's research highlighted the vast amount of untracked e-waste, leading to the exploration of alternative, more sustainable substrates. The initial focus was on finding alternatives for printing processes, eventually leading to the investigation of leaves as a potential source material. The complex structure of a leaf, including the basophil, skin, and vascular structure, presents challenges for direct printing. However, the stable vascular structure, composed of lignin and cellulose, remains after removing the green material (basophil) through etching. This resulting lignocellulose structure exhibits quasi-fractal properties, making it suitable for substrate technology. In this short video, you can learn: * The environmental motivation for exploring leaves as a substrate. * The structural components of a leaf and the process of removing the basophil. * The composition and properties of the remaining lignocellulose structure. 📋 **Clip Abstract** This segment highlights the initial motivation for using leaves as a substrate for printed electronics, focusing on the environmental concerns related to e-waste and the structural properties of leaves that make them a viable alternative. #LeafEtching, #BasophilRemoval, #LignocelluloseSubstrate, #BiomaterialProcessing, #PrintedElectronics, #SustainableSubstrates This presentation was given by Dresden Integrated Center for Applied Physics and Photonic Materials - TU Dresden at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the substitution of the structural unit in Parylene polymers affect their properties and application-specific fine-tuning? Parylene is a group of polymers with interesting properties, including being a dielectric, chemically inert, and biocompatible. The material is based on the same structural unit, but different variants of Parylene can be achieved through substitution. This allows for fine-tuning the material's properties to suit specific applications. The deposition of Parylene is always the same, involving a three-phase gas phase deposition process, specifically chemical vapor deposition (CVD). This process occurs in a chamber at low pressures and room temperature, enabling the coating of temperature-sensitive materials. The result is a thin layer with a thickness that can be varied by adjusting the duration of the process. Due to its gas phase deposition, the coating is highly conformal, allowing for coating of complex 3D structures. These properties, combined with the pinhole-free nature of the thin Parylene layers, make it suitable for various applications. The material can also be structured through laser ablation or oxygen plasma etching to remove Parylene where needed. In this short video, you can learn: * The fundamental properties of Parylene polymers. * How chemical substitution enables property fine-tuning. * The specifics of the Parylene deposition process. 📋 **Clip Abstract:** This segment introduces Parylene, highlighting its tunable properties through chemical substitution and the specifics of its gas-phase deposition process, emphasizing its conformality and suitability for coating temperature-sensitive materials. #ParylenePolymers, #ChemicalVaporDeposition, #PropertyTuning, #ConformalCoating, #SemiconductorManufacturing, #AdvancedPackaging This presentation was given by Frederic Güth from Fraunhofer ENAS at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the low-temperature sintering process impact the choice of conductive inks and substrate materials? The HPM-300DI system utilizes a two-module approach, integrating pick-and-place functionality with a printing module. The printing module initially deposits a UV-curable dielectric material using a 600 DPI inkjet system, followed by UV exposure for hardening. Subsequently, the same inkjet system prints a silver conductive ink onto the dielectric surface. The printed silver ink undergoes a drying and sintering process at a relatively low temperature. This low-temperature sintering is a critical aspect of the process, enabling the creation of conductive circuits on the substrate. The process is repeated to build up multi-layer circuits. This additive manufacturing approach allows for the creation of material circuits through a fully digital process. The system's capabilities are being evaluated with partners to explore various applications, including 2D substrate prototyping and the fabrication of novel 3D geometry devices. In this short video, you can learn: * The two-module architecture of the HPM-300DI system. * The process of printing dielectric and conductive layers. * The importance of low-temperature sintering for circuit formation. 📋 **Clip Abstract** The clip details the core printing and curing process of the HPM-300DI, highlighting the use of UV-curable dielectrics and low-temperature sintered silver conductive inks. It emphasizes the system's ability to create multi-layer circuits through a fully additive digital manufacturing process. #LowTempSintering, #ConductiveInk, #UVCurableDielectric, #AdditiveManufacturing, #PrintedElectronics, #SemiconductorManufacturing This presentation was given by Ryojiro Tominaga from Fuji Corporation at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa Why is a solderable polymer necessary when high-temperature fired materials have been available for decades? The speaker introduces the concept of a solderable polymer material and poses the question of its necessity, given the existing high-temperature fired materials. He highlights his extensive experience in the printed electronics industry, spanning approximately 25 years. He notes that since the advent of the membrane switch in the mid-1970s, the industry has been aiming to replace traditional subtractive technology. However, the speaker argues that the focus should shift from replacement to augmentation and support. He suggests leveraging the knowledge and advancements from the traditional technology industry and integrating them into the printed electronics sector. The core limitation of the polymer thick film industry, according to the speaker, lies in solderability. The ability to attach components directly to the substrate has been restricted to two-part or one-part epoxy-based materials, which present challenges such as long pot life, viscosity changes over time, evolving processing parameters, extended cure cycles, and low attachment rates. The speaker asserts that solder, in every aspect, is superior to epoxy-based materials due to its snap cure, higher conductivity, enhanced mechanical strength, and improved reliability in demanding applications. In this short video, you can learn: * The historical context of printed electronics and its relationship with subtractive technologies. * The limitations of epoxy-based materials in printed electronics applications. * The advantages of solder over epoxy in terms of performance and reliability. 📋 **Clip Abstract:** This segment introduces the need for solderable polymers by contrasting them with existing solutions like epoxies and high-temperature materials, highlighting the limitations of current approaches in printed electronics. It sets the stage for understanding the benefits of the new material. #SolderablePolymer, #PolymerThickFilm, #ComponentAttachment, #EpoxyAdhesives, #PrintedElectronics, #ElectronicPackaging This presentation was given by Ryan Banfield from Heraeus Electronics at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa How does the miniaturization of electronic warfare systems impact mission capabilities? The core enabler of the mission described is the dramatic reduction of size, weight, and power (SWaP) of electronic warfare systems. This involves scaling down systems that once occupied the space of a refrigerator to the size of a hockey puck. This miniaturization is achieved through the integration of state-of-the-art, US-built microelectronics. This advancement allows for the delivery of 21st-century digital technologies, ensuring service members remain ahead of emerging threats. The technology focuses not only on efficiency but also on enhancing the effectiveness of defense systems. This includes faster threat detection, higher accuracy, and advanced electronic defense capabilities. The reduction in SWaP enables the deployment of advanced electronic warfare capabilities on platforms with limited space and power resources. This enhances the overall effectiveness of defense systems by providing faster threat detection, higher accuracy, and advanced electronic defense capabilities. The miniaturized systems act as force multipliers, significantly enhancing the capabilities of service members. In this short video, you can learn: * The impact of SWaP reduction on electronic warfare systems. * The role of advanced microelectronics in achieving miniaturization. * How miniaturization enhances threat detection and defense capabilities. 📋 **Clip Abstract** This segment highlights the significance of miniaturizing electronic warfare systems through advanced microelectronics, enabling enhanced capabilities in smaller, lighter, and more power-efficient packages. The result is faster threat detection, higher accuracy, and improved electronic defense. #ElectronicWarfareMiniaturization, #SWaPReduction, #MicroelectronicsIntegration, #DigitalDefense, #DefenseTech, #MilitaryApplications This presentation was given by Paul Gaylo from Lockheed Martin at The Future of Electronics RESHAPED 2025 conference and exhibition Join us next at the Computer History Museum in California at the largest and most important show in the USA dedicated to Additive, Hybrid, Wearable, Soft, Stretchable, InMold Electronics. Learn more here https://www.techblick.com/electronicsreshapedusa

MicroLED Connect and AR/VR Connect 16 & 17 September 2026 | High Tech Campus, Eindhoven, Netherlands   MicroLED Connect and AR/VR Connect are the most important dedicated conferences and exhibitions in these fields still taking place this year, bringing together the entire industry and applied research community from around the globe.   👉Organised by TechBlick and MicroLED Association 👉Supported by Optica, EPIC Photonics, and Karl Guttag 👉375+ Participants 👉25+ Exhibitors 👉50+ Talks 👉8 Masterclasses 👉3 Tours 👉And a year-round program of curated online events A Look Back to 2025. Significant Growth in MicroLED Connect and AR/VR Connect  MicroLED Connect and AR/VR Connect 2025 was a huge success registrating over 30% YoY growth.   The program was world-class, featuring the likes of Google, Jade Bird Display, Lynx, Avegant, ASML, Swave Photonics, Brilliance RGB, Aledia, Mojo Vision and many more.   The participation was excellent too, including Apple, Meta, GoogleSamsung, Samsung Displays, Tianma, Sony, ASML, Huawei, Applied Materials, Bosch, Sensortec, GlobalFoundries, Lam Research, Thales, BAE Systems, Anduril Industries, Nokia, EssilorLuxotticaValeo, Garmin, ams-OSRAM, Haylo Ventures, ITEC B.V., Jabil Optics,  Fielmann Ventures GmbH, Sioux Technologies, and more A Look Back to 2024. The First Ever MicroLED Onsite Conference & Exhibition  MicroLED Connect 2024 was a huge success with superb participation and fantastic customer feedback - despite the ups and downs of the industry.   The program was world-class, featuring the likes of Google, Continental, Meta, TCL CSOT, Globalfoundries, and others.   The participation was excellent too, including Google, Mercedes-Benz, AUO, Samsung Electronics, Tianma, Swatch Group, Continental Corporation, GlobalFoundries, Huawei Technologies, Kulicke & Soffa, Infineon Technologies, Sony,  TCL CSOT, Konica Minolta, Toray Engineering, Coherent, Aixtron, Jabil Optics, ITEC B.V., ams Osram,  imec.xpand, Omdia, CEA-Leti,  Carux (Innolux),  Samsung Display, Snap Inc, Lam Research, Samsung Venture Investment,  Collins Aerospace, Garmin, Lumileds, and many more 2026: Growth of MicroLED Connect + Launch of AR/VR Connect  In 2026 we expect further growth at both MicroLED Connect and AR/VR Connect. We will also launch Optical I/O Connect! Stay Tuned! This show is now an established high-quality event and a firm fixture of the calender for the industry. Confirmed speakers already include Meta, Google, Sony, Applied Materials, EssilorLuxottica, Avicena, UC Santa Barbara, University of Rochester, Hongshi Intelligence and others. See here . Book Your Exhibition Packages It is time to book your spot to exhibit at MicroLED Connect and AR/VR Connect. The booth spaces are assigned on a first come first served basis. The spaces are very limited.  Our unique packages offer 👉Onsite exhibition 👉Conference attendance 👉Onsite talk (depending on package) 👉Online talk 👉Email marketing 👉Virtual booth 👉Annual passes 👉and moreThe floorplan below shows the available spaces (white). All others are already booked or reserved If interested please contact khasha@techblick.com

Mention droplet dispensing and you may immediately think of lab-on-a-chip (LoC) devices. Indeed, LoC devices rely on droplet dispensing systems or pipettes to distribute liquids for disease diagnostics. However, the application of droplet dispensing extends beyond life sciences. It finds various applications in consumer electronics (home inkjet printers), optics (lens arrays for fiber optics), life sciences (LoC systems, medical inhalers) as well as electronics manufacturing (dispensing solder droplets for flip chip bonding — attaching semiconductor chips to a substrate by flipping them onto tiny solder bumps) [1]. How does droplet dispensing work? Dispensing droplets manually involves using a syringe or micropipette to release individual droplets, and is common in laboratories for liquid handling. Micropipettes are engineered to deliver highly reproducible volumes and can reduce human variability, but achieving this precision requires proper technique and therefore subject to inter‑individual imprecision [2]. Automated droplet dispensing systems, in contrast, offer superior reliability by accurately jetting (drop-on-demand jetting systems ) or extruding ( direct ink writing  systems) single discrete volumes of materials from a nozzle to a precise location. The target volume of each drop can range widely, from picoliters in microelectronics to microliters in lab applications. Achieving consistent volume is crucial in droplet dispensing for accuracy and reproducibility [3]. Droplet dispensing applications Electronics manufacturing Potting electronics Molten lead-free solder droplets dispensed with 100 µm spacing © Wang, C.-H. et al. , CC BY 4.0 Droplet dispensing plays a critical role in electronic packaging. For example, advanced micro droplet dispensers use piezoelectric or magnetostrictive actuation to jet precise adhesive or encapsulant droplets [4]. This has significantly improved the consistency and placement of the smaller droplets, increasing assembly speed and supporting higher-density, miniaturized devices [5]. Another key application in electronics manufacturing is solder droplet printing for circuit assembly. One demonstrated system [6] uses a heated pneumatic printhead to directly jet molten solder droplets onto PCB pads, where they solidify to form electrical interconnects. Such droplet-based metallization methods (including solder jetting and nanoparticle ink printing) avoid the steps of reflow ovens or wire bonding, potentially streamlining electronics assembly [6]. Optics Printed thermally activated delayed fluorescence droplets in 4 × 4 mm 2  square patterns with 200 DPI, adapted from © Kant, C., et al . , CC BY 4.0 In the optics and display industry, droplet dispensing technologies are used to fabricate fine optical structures and deposit light-emitting materials with great control. Inkjet printing of display layers has emerged as a promising alternative to vapor deposition in OLED and quantum-dot displays. Solutions of organic light-emitting or quantum dot materials are dispensed as microliter droplets into millions of pixel wells, then cured to form uniform thin films [7]. Another optical application is making microlens arrays (MLAs), used to enhance light extraction or sensing in miniaturized cameras, 3D displays, and sensors. By jetting or printing UV-curable polymer droplets to form a smooth micro-lens, droplet dispensing bypasses molding steps and allows high fill-factors over large areas, enabling rapid prototyping of optics on flat or flexible substrates [8]. In-vitro diagnostics (IVD) The construction of an immunodiagnostic chip supporting the movement of reagent droplets, adapted from © Hu, X., el al ., CC BY 4.0 In lab-on-a-chip assembly and operation, droplet-based systems precisely manipulate microliter and nanoliter droplets of fluids for assays. For example, a recent platform [9] demonstrated fully automated immunoassays by using magnetic beads to shuttle droplets between processing steps, running multiple tests in parallel on a disposable chip, and achieved sensitivities comparable to conventional lab methods.  Unlike continuous-flow microchannels, droplet-based approaches in point-of-care testing minimize sample volume, cut assay time, and allow in situ integration of functions (mixing, incubation, detection) that would otherwise require bulky instruments. They also provide a controlled, contamination-limited environment for biochemical reactions [10]. We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action. Bioprinting Bioprinting process © Ng, W. L., & Shkolnikov, V ., CC BY 4.0 Beyond diagnostics, droplet dispensing has a broad spectrum of expansive applications in the life sciences. In bioprinting, for example, droplet dispensing systems deposit bioink droplets containing living cells, growth factors, or other biomaterials to fabricate tissues and organoids (lab-grown miniature organs/tissues), achieving precise placement of cells at high speed [11]. This precise spatial control supports the recreation of cellular microenvironments, which is essential for studying cell-to-cell interactions, disease progression, and tissue regeneration [11]. Key considerations of droplet dispensing As seen in the applications above, a wide variety of materials can be dispensed as droplets, from metals and functional nanomaterials to polymers and bioinks. However, dispensing materials at micro to nanoliter scales comes with several important considerations. Clogging: Dried residue from volatile solvents or particulate matter in the fluid can block nozzles. In addition to frequent cleaning, it may be necessary to adjust material viscosity using additives or by changing the temperature. Inconsistency in placement and volume: Droplet volume can drift due to changes in printing parameters (e.g., drawback force) [12]. Air currents, static charge on the substrate, or inconsistent drop velocities can also affect placement. Choosing a high-precision droplet dispenser and implementing environmental controls, such as using an enclosure, are critical for consistent results. To learn more about dispensing best practices, check out How to Dispense Adhesives . Conclusion Droplet dispensing is increasingly important in electronics manufacturing and the life sciences, enabling precise miniaturization. Recent work [13] suggests that adaptive intelligent control will be key to maintaining consistent droplet formation and ejection characteristics, and future advances may allow dispensers to self-tune to different liquids for optimal performance. Ready to learn more about materials dispensing? Explore these resources: Blog: What Is Dot Dispensing? Blog: What Are Precision Fluid Dispensing Systems? Application overview: Solder Paste Printing Looking for proof-of-concept of your droplet dispensing applications? Book a meeting  to speak with one of Voltera’s technical representatives. References [1] Lindemann, T., & Zengerle, R. (2008). Droplet Dispensing. Encyclopedia of Microfluidics and Nanofluidics , 402–411. https://doi.org/10.1007/978-0-387-48998-8_361 .  [2] Lippi, G., Lima-Oliveira, G., Brocco, G., Bassi, A., & Salvagno, G. L. (2017). Estimating the intra- and inter-individual imprecision of manual pipetting. Clinical Chemistry and Laboratory Medicine (CCLM) , 55(7). https://doi.org/10.1515/cclm-2016-0810 .  [3] Nikapitiya, N. Y. J. B., Nahar, M. M., & Moon, H. (2017). Accurate, consistent, and fast droplet splitting and dispensing in electrowetting on dielectric digital microfluidics. Micro and Nano Systems Letters , 5(1). https://doi.org/10.1186/s40486-017-0058-6 .    [4] Zhou, C., Li, J. H., Duan, J. A., & Deng, G. L. (2015). The principle and physical models of novel jetting dispenser with giant magnetostrictive and a magnifier. Scientific Reports , 5(1). https://doi.org/10.1038/srep18294 .  [5] Nature Research Intelligence. (n.d.). Fluid Dispensing and Microelectronics Packaging . https://www.nature.com/research-intelligence/nri-topic-summaries/fluid-dispensing-and-microelectronics-packaging-micro-82301 .  [6] Shu, Z., Fechtig, M., Florian Lombeck, Breitwieser, M., Zengerle, R., & Koltay, P. (2020). Direct Drop-on-Demand Printing of Molten Solder Bumps on ENIG Finishing at Ambient Conditions Through StarJet Technology. IEEE Access , 8, 210225–210233. https://doi.org/10.1109/access.2020.3040035 .  [7] Xiong, J., Chen, J., Li, Y., Yue, X., Fu, Y., & Yin, Z. (2025). Large-area OLED substrate printing path planning method based on multi-head GAT imitation learning to solve partitioned integer programming. Scientific Reports , 15(1). https://doi.org/10.1038/s41598-025-08355-x . [8] Zhong, L., Liu, W., Gong, H., Li, Y., Zhao, X., Kong, D., Du, Q., Xu, B., Zhang, X., & Liu, Y. J. (2025). Electrohydrodynamically Printed Microlens Arrays with the High Filling Factor Near 90%. Photonics , 12(5), 446–446. https://doi.org/10.3390/photonics12050446 .  [9] Hu, X., Gao, X., Chen, S., Guo, J., & Zhang, Y. (2023). DropLab: an automated magnetic digital microfluidic platform for sample-to-answer point-of-care testing—development and application to quantitative immunodiagnostics. Microsystems & Nanoengineering , 9(1), 1–12. https://doi.org/10.1038/s41378-022-00475-y .  [10] Trinh, T. N. D., Do, H. D. K., Nam, N. N., Dan, T. T., Trinh, K. T. L., & Lee, N. Y. (2023). Droplet-Based Microfluidics: Applications in Pharmaceuticals. Pharmaceuticals , 16(7), 937. https://doi.org/10.3390/ph16070937 . [11] Ng, W. L., & Shkolnikov, V. (2024). Jetting-based bioprinting: process, dispense physics, and applications. Bio-Design and Manufacturing , 7(5), 771–799. https://doi.org/10.1007/s42242-024-00285-3 . [12] Wang, W., Chen, J., & Zhou, J. (2016). An electrode design for droplet dispensing with accurate volume in electro-wetting-based microfluidics. Applied Physics Letters , 108(24). https://doi.org/10.1063/1.4954195 .  [13] Jiang, J., Chen, X., Mei, Z., Chen, H., Chen, J., Wang, X., Li, S., Zhang, R., Zheng, G., & Li, W. (2024). Review of Droplet Printing Technologies for Flexible Electronic Devices: Materials, Control, and Applications. Micromachines , 15(3), 333. https://doi.org/10.3390/mi15030333 . Join the flagship TechBlick events in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature. In California: The Future of Wearables Reshaped    In Berlin: Perovskite Connect , Sustainable Electronics RESHAPED , Electronic Textiles RESHAPED

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California Register before 15 March 2026 for early bird rates  The Largest and Most Important Additive Electronics Show in North America! This is the most  important and the largest conference and exhibition  in North America dedicated to additive, printed, flexible, hybrid, wearable, stretchable, soft electronics. Exhibition floor : Almost sold out.  Agenda:  Shaping up to be our strongest yet. Featuring:  NextFlex Innovation Days  Co-locating:  Wearables RESHAPED Exhibition Floor Almost Sold Out ­ The exhibition floor is almost sold out with over 90% of the available spots booked. Act now and book your place! Visit here to download the info package including detailed pricing and benefits descriptions. Tom Keenan will also be your primary point of contact (tom@techblick.com) The Only Truly Global Package Worldwide Our packages are the only truly global option, combining the opportunity to exhibit in the USA and Europe with year-round global digital marketing and engagement. The key benefits include: Onsite exhibition (California  and/or  Berlin shows) 2 or more full onsite conference & exhibition passes 6 or more annual online passes Onsite talk (silver and gold packages only) Online talk Email marketing Social media support Virtual booth

Printed electronics often involve touch applications on flexible transparent films, which creates a demand for transparent conductive materials. Integration of ICs enables the control of capacitive touch functionality, combined with serial communication protocols such as I2C or USB. This allows for much smaller and more efficient connections than traditional solutions using bulky cables. DoMicro is capable of making Flexible Hybrid Electronic touch applications with screen-printed transparent PEDOT electrodes, inkjet printed silver circuitry and Anisotropic Conductive Adhesive ( ACA) bonded components. This paper focusses on the integration processes of printed transparent conductive polymer polyethylene dioxythiophene (PEDOT:PSS).   Human machine interfaces and control displays should be easy to understand for the operator. Highlighting essential information depending on mode or status of the equipment creates a focussed and minimal atmosphere without distraction. Visual appearance and coloured feedback of touch icons by RGB controlled backlight LED’s is featured by transparent capacitive touch technology in Flexible Hybrid Electronics (FHE) circuitry. A FHE-Touch foil integrated with a FPCA-LED assembly enables a fully flat, flexible interface system that can be integrated in curve products and surfaces. Touch icon buttons can be completely hidden or made invisible when backlight is switched off. Figure 1 - User interface by Metafas Application demonstrator Figure 1 shows a user interface with capacitive touch buttons to use with backlighting. The FHE module is placed on top of a flexible FPC with RGB-LEDs that will respond to the touch actuation. The product is made by a combination of screen-printed PEDOT touch electrodes and inkjet printed silver traces. The transparency of PEDOT electrodes allows for the backlighting and lightguide. Figure 2 shows this transparency of the blueish PEDOT electrodes printed on a PEN film. Figure 2 The transparency and conductivity of the PEDOT electrodes depends on the layer thickness. This sample has a PEDOT layer of only 350 nm thickness. This results in a sheet resistance  of 320 Ω/sq. The PEDOT screen-printing paste is commercially available. DoMicro is capable to screen print on films up to 150x150 mm on the Aurel C1010 screen-p rinter. Metafas screen prints series up to 1,000 pieces on 1,000x700 mm.   Around the PEDOT electrodes the electrical circuit is printed with a silver nanoparticle (NP) ink. This circuit is shown in figure 3. The inkjet printing technology allows for small contact pads to interconnect the QFN packaged driver IC. This IC has pad sizes of 250 µm at a pitch of 500 µm. Using this inkjet printing technology, DoMicro is capable of printing at a pitch down to 100 µm. The inkjet printed circuit is a 2-layer circuit with inkjet printed insulator to separate crossing top and bottom silver traces. For this inkjet printing process the SUSS MicroTec PiXDRO LP-50 inkjet printer is used. Both the UV curable insulator ink and silver ink are commercially available. Sintering of the NP is performed in a box oven at 150°C for 30 min. Figure 3 The PEN substrate and silver circuit do not allow for a standard soldering process for integration of components. An ACA is used to make a thermocompression bond between the IC and passive components and the printed circuit. Figure 4 shows an FHE touch module after assembly of the components. The Pick&Place process is performed with a Fineplacer Pico having an alignment accuracy of 5µm. Figure 4 The FHE touch module can, for example, be connected to a flexible LED FPC, such as shown in Figure 1. This interconnection is achieved using ACA through a thermocompression bonding process. The process, carried out with the Fineplacer PICO, enables strong and reliable interconnections at relatively low bonding temperatures of around 160 °C. These bonds ensure high reliability without short circuits, while preserving the flexibility of the transparent printed electronics touch circuit in combination with the LED FPC. We are exhibiting at the Future of Electronics RESHAPED. The event will take place in Berlin  on 21-22 October 2026. Please register for the event, meet us in person and see our technology in action.   Conclusions and outlook Screen-printed electrodes with transparent conductive polymer PEDOT are useful for touch applications in combination with backlight. The presented process steps show how such FHE touch modules could be made. Many designs of these touch button circuits are possible. Besides FHE modules with touch buttons, this printing process also allows for other transparent touch applications, e.g. trackpads or touch screens. DoMicro can support the technology for manufacturing as well as the hardware and system integration . Metafas complements this by bridging the gap towards industrial scalability and manufacturability.   Strong collaboration DoMicro and Metafas have collaborated for many years, supported by their close geographical proximity. DoMicro develops advanced inkjet printing processes and technology for micro assembly and 3D packaging of FHE and micro devices. While DoMicro focuses on R&D and prototyping with transparent PEDOT electrodes, inkjet-printed circuitry, and micro-assembly, Metafas transforms these innovations into reliable products. With expertise in membrane switches, printed electronics, and advanced foil-based HMI applications, Metafas develops and produces small and medium series using advanced techniques.   By combining the capabilities of DoMicro and Metafas, high-performance devices can be made, pushing the boundaries of flexible hybrid and printed electronics. Cleanroom Imagine, create, ACCOMPLISH   DoMicro provides R&D services, small series production, system architecture and project management. Typically for customers exploring new technologies for circuitry on flexible substrates like transparent conductive films, OPV electrodes, OLED, Lab-on-chip, wearables, in-mould electronics, IC and MEMS integrations.   Metafas operates a fully automated INO screen printing line for advanced printed electronics, using in-house screen fabrication and product finishing. A structured product and process launch system enables FHE technologies – such as transparent PEDOT-based HMI foils – to evolve into volume production for industrial, medical, and consumer applications.   If you are challenged by the market and looking for a partner to move your ideas into realization, contact us. We really do IMAGINE, CREATE AND ACCOMPLISH. Let's meet! DoMicro is an exhibitor at several inspiring events this year. We start at Nanotech Tokyo, 26 to 30 January, at the Netherlands Pavilion, booth number AT-L02. From 24 to 26 February, you can find us at LOPEC in Munich, Germany, at Booth B0 514. And through various activities from TechBlick including exhibition at the Future of Electronics RESHAPED Berlin (21 and 22 OCT 2026) we can connect as well and share our mutual passion for innovation. If you are looking for a partner to move your ideas into realization, let’s cross boundaries together! Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

When: 10 & 11 June 2026 Where: Computer History Museum, Mountain View, California https://www.techblick.com/electronicsreshapedusa Join us and 600+ others from around the world next June at the heart of the  Silicon Valley  to RESHAPE the Future of Electronics together, one layer at a time, making it Additive, Printed, Sustainable, Flexible, Hybrid, Stretchable, Wearable, Textile, Structural, 3D... This event stands as the largest show in the USA dedicated specifically to Additive, Printed, Hybrid and 3D Electronics. It unites the entire global community—connecting end-users and manufacturers with equipment providers, material developers, and applied researchers. The 2026 edition is expected to welcome more than  600 attendees  and  80 exhibitors , supported by  three parallel conference tracks , alongside  masterclasses and technical tours  designed to bridge innovation with real-world deployment. A major highlight for 2026 is the partnership with  NextFlex , the US-based consortium at the centre of the Printed and Hybrid Electronics ecosystem. The inclusion of the NextFlex Innovation Day further strengthens the event’s position as the definitive North American meeting point for the community. “Electronics RESHAPED USA has firmly established itself as the premier event for our industry in North America, consistently selling out year after year. This is now the home of Printed, Additive, and Hybrid Electronics. By bringing the show to the heart of Silicon Valley for the first time, we expect record-breaking growth. If you are active in, using, or exploring these technologies, this is the definitive place to be.” Dr Khasha Ghaffarzadeh, CEO

To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick Engineering Functionality: Sensors Sensors are at the heart of modern technology - integrated into devices we use every day to enhance healthcare, fitness, safety, and comfort. From monitoring vital signs to enabling smart industrial systems, sensors are transforming the way we interact with the world. Depending on the application, sensors come in many forms, each with its own materials, requirements, and performance considerations. Below are a few examples of sensors that are key to next-generation sensor innovation. Biosensors & Electrochemical Sensors:  Measure biological and chemical reactions by generating signals proportional to analyte concentration. PTC Heaters:  Regulate temperature through self-limiting properties that enhance safety and efficiency. Temperature Sensors:  Monitor and maintain optimal conditions using precise electrical signals. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend These sensors find use across  wearable ,  diagnostic , and  industrial  applications, each with distinct design and material needs: Wearables Flexible and stretchable materials Stretchable inks Adhesive layers (for housing-to-patch or multilayer adhesion) Conductive skin contact layers Diagnostics Rigid or flexible substrates Microfluidic integration Specialized ink selection Sputtered precious metals Biochemical compatibility Industrial Durability under harsh conditions Long-term stability Resistance to temperature, moisture, and mechanical stress When designing any sensor,  key factors  such as  biocompatibility, sensitivity, selectivity, stability, and durability  must guide every decision. Material Selection Process: Define the use case Identify biological, mechanical, and electrochemical requirements Select candidate materials Prototype, test, and optimize Validate performance Sensors are more than components - they’re the foundation of innovation across industries. As demand grows for smarter, more connected, and more sustainable technologies, material and design choices will define the next generation of performance. We are Exhibiting in California, USA. Visit our booth at the TechBlick event on 10-11 June 2026 . Contact us for your special discount coupon to attend

Electronics encapsulation refers to the process of enclosing and protecting electronic components, circuits, or chips in a durable material or “package.” The encapsulating material (sometimes called a molding compound or potting compound) serves as a barrier against environmental factors like moisture, dust, and harsh chemicals, and shields the device from mechanical stress and vibration. Over the decades, encapsulation approaches have evolved significantly. Historically, hermetic encapsulation (a method of sealing sensitive electronic components inside airtight metal or ceramic enclosures) was common, as it completely blocked moisture and gases. This was especially important in aerospace or military-grade devices [1].  Since the 1970s, the industry has shifted toward polymer-based plastic encapsulation due to its low cost, ease of processing, and high throughput. Today, encapsulating components usually involves applying polymer resins (epoxies, silicones, polyurethanes, etc.) using automated dispensing, molding, or conformal coating systems.  Common types of encapsulation Potting electronics Schematic of an encapsulated PCB assembly, adapted from © Hu C., et al ., CC BY 4.0 In the context of electronics and semiconductors, potting and encapsulation are often used interchangeably. Potting is an encapsulation process where an entire electronic assembly or a larger section of a circuit is placed into a mold (often referred to as a “pot”) and then filled with a potting material (typically a resin) to cure into place. Potting applications include: Submersible or outdoor electronics in harsh environments High-voltage circuits (to prevent arcing) [2] Tamper-resistant  designs Dam and fill A chip partially encapsulated using dam and fill © Tabrizi, H. O., et al ., CC BY 4.0 A less common variant of potting, dam-and-fill involves first dispensing a high-viscosity “dam” around the component, then flooding the enclosed area with a lower-viscosity encapsulant. Unlike potting, which submerges the entire assembly, dam-and-fill targets only specific areas, allowing precise control over material placement while minimizing resin use. This makes it useful for precision applications or components that require partial exposure, such as optical sensors or fluid-contact electrodes, though it is less widely used than potting or glob-top methods. Direct encapsulation A glob of silicone encapsulant dispensed on interdigitated combs, adapted from © Lamont, C., et al ., CC BY 4.0 Direct encapsulation refers to dispensing an encapsulation material directly over a semiconductor die or electronic component mounted on a substrate (e.g., a PCB) and then curing it in place. It is a direct method because the encapsulant is applied only to the needed area on the board, without needing a dam or a pot. Once cured, the dispensed material forms a hardened “glob” that covers the device and its wire bonds. As such, direct encapsulation is also called glob-top encapsulation. It is widely used in: High-density PCBs Miniaturized packages where space and weight are constraints We are exhibiting at The Future of Electronics RESHAPED in California, USA on 10-11 June 2026 and in Berlin  on 21-22 October 2026 . Please register to meet us in person and see our technology in action. Common encapsulation materials Modern electronic devices use a range of encapsulation materials, from rigid thermoset resins to flexible elastomers, chosen based on the application requirements. Epoxy PCBs encapsulated with different materials (PDMS, epoxy and epoxy with hermetic feedthroughs and optional P3HT coating) © Novak, M, et al ., CC BY 4.0 Epoxy resins are rigid thermosetting polymers often filled with silica to improve thermal conductivity and mechanical properties. They are the most widely used encapsulants in both semiconductor packaging and industrial electronics due to their strong adhesion, mechanical strength, and chemical resistance. Pros Epoxy encapsulants form a hard, rigid shell with excellent adhesion, mechanical strength, and chemical resistance. They are electrically insulating and can be formulated for flame retardance and high temperature resistance. Cured epoxies are moisture resistant and have low water permeability, which allows them to protect electronics in humid conditions [3]. Cons The rigidity of epoxy can be a drawback in critical applications with extreme temperature swings or mismatched thermal expansion. Repeated heating and cooling may lead to delamination or cracks in the encapsulation or at the interface [3]. Silicone A pressure and temperature sensor encapsulated with PDMS © Sang M., et al ., CC BY 4.0 Silicones, particularly polydimethylsiloxane (PDMS), are flexible elastomers used when mechanical flexibility or biocompatibility is needed. Common in medical electronics and wearable devices, they can be applied as soft coatings, gels, or flexible encapsulants. Pros Silicone encapsulants are soft and elastic after curing and reduce stress on sensitive components. In one study [3], a silicone encapsulant successfully protected chronically implanted PCBs, maintaining encapsulant integrity and adhesion during 30-day accelerated aging in saline. Silicones have excellent thermal stability and remain functional from roughly -40 °C up to 175 °C  or more, a range over which they maintain consistent properties. Cons Silicone encapsulation is not hermetic – moisture can slowly diffuse through, which can be problematic in very moisture-sensitive devices [4] Silicone doesn’t adhere as strongly to many substrates compared to epoxy, and its low surface energy makes it easy for it to “ wet out ” and flow into crevices, which can lead to poor adhesion if not primed. Polyurethane Neural-stimulating electrodes with a bioresorbable dynamic covalent polyurethane (b-DCPU) encapsulation layer © Choi, Y.S., et al ., CC BY 4.0 Polyurethanes (PU) are polymers formed by reacting diisocyanates with polyols, resulting in urethane linkages [5]. They strike a balance between the hardness of epoxies and the softness of silicones, offering moderate flexibility and toughness, and are useful in soft robotics, wearables, and implantables. Pros Polyurethanes are semi-flexible (softer than epoxies but stiffer than silicone) and offer good electrical insulation and vibration damping. They tend to cure to a less rigid state, putting less stress on delicate parts [5].  PU potting compounds also exhibit good adhesion [5]. Cons PU generally cannot withstand high temperatures  as well as epoxies and silicones.  PU is generally not as impermeable  to water as epoxies. In a humid environment, a PU encapsulate is more likely to allow moisture ingress. Conclusion Encapsulation is a fundamental part of the electronics manufacturing process, providing protection against harsh environmental conditions like moisture, chemicals, and mechanical stress. The choice of encapsulant directly affects device reliability, making it a key design consideration for both conventional and advanced electronic systems. Interested in learning more about electronics encapsulation? Check out these resources: White paper: Printing a Flexible PCB with Silver Ink on PET Application: Adhesive Dispensing Systems Blog: What Is Thermal Interface Material (TIM)? Want to explore dispensing encapsulants with NOVA ? Book a meeting  to speak with one of Voltera’s technical representatives. References [1] Inamdar, A., Driel, V., & Zhang, G. (2025). Electronics packaging materials and component-level degradation monitoring. Frontiers in Electronics , 6. https://doi.org/10.3389/felec.2025.1506112 . [2] Du, S. Baek. Y., Wang, G., & Bhattacharya, S. (2010, November 1). Design considerations of high voltage and high frequency transformer for solid state transformer application. IEEE Xplore . https://doi.org/10.1109/IECON.2010.5674991 .  [3] Adam, C., M Münch, P Kleinschnittger, Barth, T., & Krautschneider, W. H. (2024). Rapid prototyping of molds for the encapsulation of electronic implants using additive manufacturing. Additive Manufacturing Meets Medicine (AMMM) . https://doi.org/10.18416/AMMM.2024.24091858 . [4] Lamont, C., Grego, T., K. Nanbakhsh, A. Shah Idil, Giagka, V., A. Vanhoestenberghe, Cogan, S., & Donaldson, N. (2021). Silicone encapsulation of thin-film SiO x , SiO x N y and SiC for modern electronic medical implants: a comparative long-term ageing study. Journal of Neural Engineering , 18(5), 055003–055003. https://doi.org/10.1088/1741-2552/abf0d6 .  [5] Bonomo, M., Taheri, B., Bonandini, L., Castro-Hermosa, S., Brown, T. M., Zanetti, M., Menozzi, A., Barolo, C., & Brunetti, F. (2020). Thermosetting Polyurethane Resins as Low-Cost, Easily Scalable, and Effective Oxygen and Moisture Barriers for Perovskite Solar Cells.  ACS Applied Materials & Interfaces , 12(49), 54862–54875. https://doi.org/10.1021/acsami.0c17652 .  Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature The Future of Wearables Reshaped  (in California) and  Perovskite Connect  (in Berlin) .

10 Feb 2026 | London | Free event Technology is reshaping every aspect of our lives, and the loan ecosystem is no exception. Advances in emerging technologies within the loan market such as Generative AI, Legal Tech, and Distributed Ledger Technology (DLT) are driving a wave of innovation, automating previously manual tasks, streamlining documentation, and enhancing transparency across transactions. But the critical question remains: how do we adapt, adopt, and utilise these solutions?  LMA Edge is a brand new event dedicated to showcasing new technologies in the lending sector. It prioritises interaction, offering high-impact networking opportunities through exhibition, tech demos, case study and collaboration stage talks, and curated 1:1 meetings. Tomi Popoola, CEO of Slash Finances and Lord Holmes, Member of the UK House of Lords are the confirmed keynote speakers. Tomi will share insights on From Innovation to Operating Model: How AI, Cloud and Automation Are Transforming Corporate Lending for Real-World Impact, exploring how emerging technologies are reshaping lending models and driving tangible outcomes across the market. Lord Holmes will examine the role of emerging technology in the UK, reflect on current trends and the future outlook, and consider the evolving intersection between technology and the loan markets. Why it matters:  Accelerate digital execution, reduce operational cost and risk, and align on standards that improve interoperability across the loan lifecycle. Who should attend:  CTO (loan markets/technology), COO/Head of Loan Operations, Head of Agency/Trustee, Senior Investment & Portfolio Managers, Head of Data/AI. Outcome:  See the vendor landscape, engage on practical use‑cases, and shape near‑term pilots.

Authors: Anaghim Nasri, R&D Engineer Quentin Maerklen, Process Engineer   Water-based graphene inks are emerging as a groundbreaking solution for next-generation heating technology. By leveraging graphene’s exceptional thermal and electrical conductivity, these inks enable thin, flexible heating elements that deliver high heat output with minimal power. Importantly, sustainability is becoming a key market driver, with growing demand for water-based, responsibly sourced graphene inks as eco-friendly alternatives to metal-based conductive materials.   This article explores how water-based graphene inks provide efficient and uniform heating, their environmental advantages over conventional carbon-based inks, and the role of Blackleaf in driving this innovation forward. As the demand grows for eco-friendly heating (from automotive seats to building systems), water-based graphene inks offer a powerful combination of performance, sustainability, and scalability.   Introduction: Blackleaf Inks for Next-Generation Heating One of the pioneers bringing this technology to market is Blackleaf, a French graphene manufacturer and ink developer. Blackleaf has positioned itself as a leading producer of graphene and formulated inks in Europe, with a capacity of over 120 tons per year of graphene products by 2027, all produced in-house in France. Blackleaf’ s product portfolio includes ready-to-use graphene conductive inks for a variety of uses. Notably, the company has focused on graphene-based heating inks as a core offering that can be applied in two complementary forms- as flexible heating films or direct heating coatings on surfaces. This allows integration into diverse scenarios. We are exhibiting at the Future of Electronics RESHAPED. The events will take place in Berlin  on 21-22 October 2026 . Please register for the event, meet us in person and see our technology in action.    Key Properties of Graphene Inks  Graphene inks offer a unique combination of high conductivity, low-temperature processing, and compatibility with industrial printing. The key properties below illustrate why they outperform conventional carbon and metal-based formulations.   2.1. High Electrical Conductivity Graphene’s high charge-carrier mobility enables low-resistance films at low solid content. While conventional carbon inks require >25–30% solids to reach 20–30 Ω/sq/mil, Blackleaf’s water-based formulations achieve 8–15 Ω/sq/mil with only 6–8% solids.This ensures: Efficient Joule heating at low voltage. Lower energy consumption. Resistance tunability via mesh, deposition thickness, and curing profile. 2.2. Low-Temperature Processing Graphene inks cure at <150 °C, reducing energy demand during manufacturing and enabling deposition on flexible polymer substrates. This contrasts with metal-based inks (e.g., silver nanoparticle systems requiring >250 °C sintering) and helps lower the overall carbon footprint of production.   2.3. Tunable Rheology & Broad Printability Formulations can be engineered for multiple coating/printing processes, including screen printing, spray coating, and slot-die/bar coating. Key rheological traits include: Controlled thixotropy. Stable viscosity under shear. Excellent wetting on polymeric surfaces.   2.4. Strong Substrate Adhesion Optimized binder–graphene interactions provide robust adhesion on a wide range of substrates, including PET, PU, PC, textiles, and paper (see Figure 1 ), ensuring mechanical stability under bending, heating cycles, and long-term use.     Figure 1.  Compatibility of Graphene-Based Heating Inks with Rigid and Flexible Substrates Table 1.  Performance Overview of Blackleaf water-based graphene inks. a The curing temperature depends on the target application and the substrate used. A minimum drying temperature of 90 °C  is required to ensure proper film drying.   Table 1  compares the electrical performance of graphene inks processed by different coating and printing techniques, showing that sheet resistance strongly depends on deposition method and film thickness. Spray coating yields thicker films (~25 µm) with lower sheet resistance, while screen printing produces thinner layers (~12–15 µm) with higher resistance. All films were cured on treated PET at low temperatures (120–150 °C), confirming process compatibility. Overall, the results demonstrate that sheet resistance can be tuned by controlling deposition technology, thickness, and curing conditions to meet different heating performance requirements.   High Efficiency Heating with Graphene Inks   3.1 Use-Case Integration of Printed Graphene Heating Films The experimental investigations reported in this work were carried out on flexible graphene-based heater patches specifically designed for high-efficiency surface heating. These ultra-thin devices can be integrated or bonded onto a wide variety of substrates wherever localized heat input is required. Figure 2.  Architecture of a Printed Graphene heating film with Copper Busbars and Polymer Encapsulation. As illustrated in Figure 2 , heaters combine a graphene heating layer with copper electrodes on a polymer substrate, optionally laminated with a polymer topcoat, and are supplied with a pressure-sensitive adhesive to enable straightforward mounting.   They are engineered to deliver surface power densities up to 6 W·cm⁻² with a maximum operating temperature of 250 °C, while maintaining excellent thermal uniformity thanks to the high in-plane conductivity of the graphene ink and the resulting direct thermal transfer to the heated surface.  Figure 3.  Direct Deposition of a Graphene Heating Film for Tank Heating Application. As shown in Figure 3 , patch geometry and overall dimensions are tailored to the application, and the devices remain highly flexible, with a bending radius down to 2 mm, making them suitable demonstrators for the high-efficiency heating performance of the graphene inks evaluated in the following sections.   3.2. Thermal tests – Endurance (8 h at 75 °C) To assess the stability of heaters manufactured with water-based graphene inks, a representative flexible patch was supplied with 160 W under a maximum voltage of 230 V for 8 h. Under these conditions, and with the mounting configuration described above, the device reached a steady-state temperature of 75 °C as displayed in Figure 4 . Figure 4.  Thermal endurance test (8 hrs, T=75°C, P=160W). Figure 4  shows a slight increase in the equilibrium temperature throughout the experiment. This drift is distributed to variations in the ambient temperature, as the external temperature T ext  exhibited the same upward trend as the temperature measured on the heater surface. Table 2 . Statistical Summary of Resistance Data The corresponding evolution of resistance is summarized in Table 2 . Over the 8 hrs period, the resistance decreased by 11.5 Ω, i.e. about 4 %, with values ranging from 280.5 Ω to 269.0 Ω (mean 271.5 Ω, standard deviation 2.3 Ω). This behaviour is consistent with the negative temperature coefficient (NTC) of the graphene-based coating: the resistance decreases slightly as temperature increases, before reaching a stable value. No degradation, delamination or visible damage of the heater was detected after the endurance test, indicating that the integrity of the patch was preserved.   3.3 Thermal tests – Cycling (100 cycles from ambient to 75 °C) Using the same experimental setup, a thermal cycling protocol was applied over 100 cycles between 40 °C and 75 °C, for a total duration of 27 h. To reach 75 °C more rapidly in each cycle, the input power was slightly increased to 180 W ( Figure 5 ). Figure 5 . Thermal cycling illustration: 100 Cycles at 180 W between 40°C and 75°C. Figure 6 . Illustration of thermal cycling over a 3-hour segment (10 cycles). For clarity, Figure 6 presents only the first 10 cycles over a 3-hour window. During these initial cycles, a modest decrease in resistance of approximately 3 % was observed, after which the resistance stabilized and remained constant over the remaining 90 cycles. As in the endurance experiment, no macroscopic damage or change in appearance of the heater was observed at the end of the test, confirming that the patches withstand repeated thermal loading between 40 °C and 75 °C.   Potential application to low-temperature floor heating for energy retrofits The combination of high-power density, mechanical flexibility, and stable operation demonstrated above suggests that heaters based on water-based graphene inks are suitable candidates for low-temperature radiant floor heating, particularly in the context of energy renovation. In such systems, flexible patches can be laminated or bonded onto intermediate substrates (e.g. underlays, boards, or prefabricated panels) and subsequently covered by conventional flooring materials such as laminates, engineered wood or ceramic tiles, provided that appropriate dielectric and mechanical protection layers are implemented (see Figure 7 ). Figure 7. Representation of a graphene-based printed underfloor heating system developed at Blackleaf. The tunability of sheet resistance and heater geometry enables precise control of power density while maintaining safe current and voltage levels. The observed negative temperature coefficient behavior may further contribute to safety by limiting local overheating. Combined with water-based inks and scalable printing processes, these heaters are well suited for large-area, flexible manufacturing, with future work focusing on durability, environmental resistance, and system-level integration for building-scale applications. Further work should therefore address long-term mechanical fatigue under foot traffic, moisture and humidity resistance, dielectric withstand under building-standard test protocols, and system-level integration (insulation layers, floor build-up, control strategies) to fully validate these printed heaters as a viable technology for low-temperature, energy-efficient floor heating in renovation scenarios     Water-Based Formulation: Key Enabler for Sustainable Printed Heating Technologies   Water-based graphene inks represent a major shift in the development of next-generation printed heating solutions. Unlike traditional conductive inks that rely on organic solvents such as NMP, DMF, toluene, or glycol ethers, water-based formulations eliminate volatile organic compounds (VOCs) and significantly reduce toxicity during manufacturing and end-use. This not only improves operator safety but also simplifies processing, waste handling, and regulatory compliance. Beyond their environmental benefits, water-based graphene inks provide significant operational and economic advantages at the manufacturing level. By eliminating organic solvents, they drastically reduce maintenance requirements on printing and coating equipment: no solvent residues, fewer nozzle or mesh obstructions, and faster cleaning cycles. Water replaces costly solvent-based cleaning agents, lowering consumable usage while minimizing operator exposure to hazardous chemicals. Additionally, the absence of aggressive solvents extends the lifetime of pumps, seals, tubing, screens and elastomer components, which are typically degraded by solvent-based formulations. Because water-based inks do not require solvent-extraction systems, safety infrastructure becomes simpler and less expensive. Overall, water-based ink processing enables lower operational expenditure (OPEX), higher equipment uptime, greater throughput stability, and reduced production complexity, which is particularly advantageous for large-scale deployment of printed heating technologies.   Conclusion Water-based graphene inks represent a key enabling technology for next-generation heating elements, combining high electrical performance with low environmental impact. Continued improvements in graphene exfoliation, formulation, and printing compatibility are expected to further expand their functionality toward smart, energy-efficient heating systems. In this context,  Blackleaf  plays a central role by delivering industrially scalable, sustainably produced graphene inks capable of addressing both performance and regulatory requirements. By bridging advanced materials science with real-world manufacturing constraints, graphene-based heating films are positioned to transition from emerging solutions to widely adopted technologies across sectors aerospace (leading-edge anti-icing systems), electric vehicles (interior comfort heating) and building applications (radiant heating panels).   Join the flagship TechBlick event in California on 10-11 June 2026 , and in Berlin on 21-22 October 2026 This event is the global home of the Additive, Printed, Sustainable, Hybrid and 3D Electronics. It is where the global industry connects, where the latest is unveiled and where big products, novel ideas and key projects and partnerships are discussed and forged. This event is not to be missed! ​ This year, the events will also feature the Future of Wearables Reshaped (in California) and  Perovskite Connect (in Berlin) .

Author: Jesus Zozaya, CEO, Voltera, sales@voltera.io It was our pleasure to present a masterclass at TechBlick Berlin on advancements in printed electronics prototyping. As a follow-up, we’d like to share an example of a multilayer flexible circuit we printed on PET. To watch this presentation in full, please purchase TechBlick Annual Pass at https://www.techblick.com/registration  and login to TechBlick platform https://app.swapcard.com/event/techblick MATERIALS USED Voltera Conductor 3 silver ink ACI Materials FS0142 Semi-Sintering Conductive Ink ACI Materials SI3104 Stretchable Printed Insulator Voltera T4 solder paste Voltera solder wire Siraya Tech Tenacious Flexible Resin SUBSTRATES USED Normandy Coating polyethylene terephthalate (PET)  FR1 board TOOLS AND ACCESSORIES V-One PCB printer NOVA materials dispensing system Voltera disposable nozzle   Nordson EFD 7018395 dispensing tip   Nordson EFD 7018424 dispensing tip   Nordson general purpose dispense tips  NE555DR timer LEDs Project Overview Purpose The goal of this project was to prototype a flexible multilayer LED wheel roulette circuit that was traditionally considered rigid and validate the redesign of the circuit. Design This project involves a multilayer flexible PCB for the LED roulette circuit and a traditional control board that powers it. We adapted the design of an LED roulette circuit, originally developed for a 3” × 4” FR4 board by ITIZ, Voltera’s authorized reseller in Korea. This new version is printed on a coated biaxially oriented PET substrate, allowing the circuit to remain flexible - even when populated with components. Figure 1: Original LED roulette circuit design by ITIZ We divided the LED roulette circuit design into three layers: Base conductive layer Dielectric layer Top conductive layer Figure 2: Voltera modified design of the LED roulette circuit Desired outcome We anticipated the circuit would function like a roulette wheel: each time the pulse generator is triggered, the LEDs on the flexible PCB light up in a rapid circular sequence before slowing down and stopping on a single LED. Functionality By printing a dielectric and crossover layer on top of the base conductive layer, we created a compact and lightweight LED roulette circuit without using jumpers. Each layer remained flexible after curing, and the circuit maintained its integrity even after encapsulation and repeated flexing.  When connected to power, pressing the switch on the control board caused the LEDs on the flexible PCB to light up, replicating the behavior of a roulette wheel as intended. We are Exhibiting. Visit our booth at the TechBlick event on June 10-11, 2026, in Mountain View, California, USA . Printing the control board This board controls the pulse signals and powers the LED roulette wheel circuit. We used V-One to print the circuit and reflow the components, which included: NE555DR timer LED Switch 47 µF capacitor 0.1 µF capacitor 10 nF capacitor 100 kΩ resistor 330 Ω resistor Figure 3: Schematic for the control board Figure 4: The control board Printing the flexible PCB This flexible PCB receives signals from the control board and lights up the LEDs as directed.  Base conductive layer This layer consists of a roulette-shaped circuit (90 mm L × 70 mm W) that connects to the control board, as well as power and ground terminals, with designated gaps for dielectric pads. Figure 5: Schematic for the base conductive layer Figure 6: NOVA print settings, base conductive layer Figure 7: Print result, base conductive layer Dielectric layer This layer consists of 29 dielectric pads that provide insulation for the top conductive layer. For better coverage, we printed two passes of dielectric ink. Figure 8: Schematic for the dielectric layer Figure 9: NOVA print settings, dielectric layer Figure 10: Print result, dielectric layer Top conductive layer This layer consists of 29 fine crossover traces that connect the paths to the power terminal and control board. To address potential gaps over height changes, we decreased the trace width to 100 mm to enhance trace continuity. Figure 11: Schematic for the top conductive layer Figure 12: NOVA print settings, top conductive layer Figure 13: Print result, bottom conductive layer Post-processing the flexible PCB Dispensing solder paste and reflowing the components Once the circuit was cured, we dispensed solder paste using NOVA and populated the components before reflowing them in an oven. Figure 14: NOVA print settings, solder paste Figure 15: NOVA dispensing solder paste Because the wires are not heat-resistant, we manually soldered them onto both the companion board and the flexible roulette circuit. Encapsulating the components To reinforce their connection to the substrate, we dispensed encapsulation resin using a syringe onto the components and cured the resin in a UV light box. Figure 16: Encapsulated circuit being cured in a UV light box Once cured, we manually soldered the wires of the control board and the wires of the flexible roulette circuit together. Figure 17: Soldering the wires together Challenges and advice Electrical shorts We encountered issues with shorts due to multiple crossover lines on the dielectric layer. To address this, we recommend printing a second pass of the dielectric layer to achieve a thicker insulating layer that better supports additional layers printed on top. Drastic height changes A second pass of the dielectric layer can result in significant height differences. To handle this, it is advisable to set a low probe pitch to ensure a more accurate height map and print a thicker crossover layer for improved contact on the top layer. Maintaining flexibility with components attached  To ensure the circuit remained flexible after populating components, we opted for smaller, more flexible components. This, combined with the use of a flexible substrate, encapsulant, and inks, allowed the circuit to bend without damaging the connections. Conclusion This project highlights the educational value of converting rigid circuit designs into flexible ones, allowing students to explore diverse materials and optimise print settings through experimentation. It also demonstrates the potential of prototyping flexible PCBs to replace electronics that were considered rigid, achieving lightweight, compact, and resilient designs. As flexible PCBs gain more popularity, hands-on experience with these technologies becomes essential for staying ahead in the rapidly evolving electronics industry. We invite you to explore our other projects  as we continue to explore the possibilities of flexible PCBs and printed electronics. Working with flexible PCBs? Book a meeting  to speak with one of Voltera’s technical representatives. We are exhibiting at the Future of Electronics RESHAPED events in 2026. The events will take place in California and Berlin . Please register for these events, meet us in person and see our machine in action.