Search Results

Speaker: Nikolaj Eusebius Jakobsen | Company: Novo Nordisk | Date: 12-13 October 2022 | Full Presentation Novo Nordisk A/S supplies nearly 50% of the world’s insulin for treatment of diabetes, and 34 million people are using our diabetes care products. On top of this we are also supplying medicine for growth disorder, haemophilia, and obesity. In Device and Delivery Solutions, we develop delivery solutions, combining Drug, Data, Diagnostics, digital solutions, and devices to make a meaningful treatment for our end users. Most of our drugs are formulated in a liquid state, so an injection device is needed for administration. To make a link between injection data and digital solution, we need to integrate sensors and communication in our devices. Integrating electronics in the injection devices gives data directly to the user who can use the data together with a health care professional to optimize the treatment. To get at true mass producible connected device, we have had a couple of projects with printed electronics over the last years. The presentation will take you trough a printed electronics project and share some learnings, opportunities and struggles in making a printed connectivity solution for a mass-produced medical device. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Philippe Prieur | Company: Schneider Electric | Date: 12-13 October 2022 | Full Presentation Schneider Electric / Company presentation Mechatronics physical integration, constraints & compacity Context and Proof of concept on 3D electronics applications (IME, LDS, Printed 3D) Industrial mission profile, robustness Antenna use case / validation plan Sensor use case / validation plan Perspectives and next Steps Questions mark Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Nouhad Bachnak | Company: Sunway Communication | Date: 12-13 October 2022 | Full Presentation The traditional LDS (laser direct structuring) process is fantastic but only works on special plastic substrates containing sub-surface activation particles. This limits the choice and functionality of materials. Firstly, it typically does not work with glass, ceramics, PET or thermosets. Furthermore, the addition of activation particles can render a transparent material opaque or eliminate bio-compatibility. Furthermore, the linewidth resolution is typically around 80-100um (but can be pushed further down) with surface roughness of 20-30um In this talk, Nouhad Bachnak unveils a new process, which promises to overcome these limitations. Here, the process first involves a special laser structuring process followed by a so-called chemical activation step. After this step, the structured and activated part undergoes typical plating (Cu-NiP-Au) This is an important development and advancement of the technology, because it greatly lessens the limits on the choice of materials which can be 3D metallized with bulk-like properties and solderable surfaces Furthermore, it will be shown that this process- when optimized- will achieve 5um linewidths with a surface roughness of just 2-3um (great for antennas, for example). It can also plate within vias with 40um diameter. This is still not the full production level for all substrates. The most advanced development is for thermoset, which is production ready. The other substrates like glass, PET, and ceramics are still in development. Nonetheless, it is a good space to watch. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Juha Virtanen | Company: GE Healthcare | Date: 12-13 October 2022 | Full Presentation Continuous ward monitoring is expected to improve patient outcome. Respiration rate has been recognized as a promising early indicator for deterioration of patient status. Department-wide solution is needed to make full benefit of the solution. Data quality and patient comfort are key factors in acceptance of a new monitoring modality. This talk will address the key technical choices behind our newly released wearable ward monitoring solution. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Wim Christiaens | Company: Quad Industries | Date: 12-13 October 2022 | Full Presentation This talk will provide insights into printed electronics, a platform technology to create electrical devices on various substrates. Printed circuits have been used since more than 20 years for the production of user interfaces, including membrane switches and capacitive touch sensors, but the biggest opportunity in the field of printed electronics is that many new applications are emerging. Quad Industries is a leading innovator in this field, and by means of highly accurate screen-printing techniques, smart functionality is integrated on a wide range of materials such as flexible and stretchable films, textiles and paper. Some of our recent developments and applications include smart electrode patches, PTC film heaters, force sensors and in-mold electronics. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Martin Hedges | Company: Neotech AMT | Date: 12-13 October 2022 | Full Presentation Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Alan Wu | Company: Smooth & Sharp | Date: 12-13 October 2022 | Full Presentation TELETENTO® has innovations in FHE and POCT aspects. In FHE aspect, ●Integrated Printed Electronics from NFC antenna, MCU socket to Biosensor All the major parts are printed R2R on same substrate. ●Precise FHE assembling Up to 10 pads MCU chip assembling in R2R operation. ●Fine Line Printing Line width/gap < 100um for MCU socket ●Possible with Paper Substrate Verification of all production conditions with paper substrate. In POCT aspect, ●Further Decentralization via NFC smartphone, testers don’t need to come to hospital or clinic for medical specimen collection. ●Risk Reduction no need medical specimen transportation, avoid latent virus spreading with contaminated medical specimen. Used test stripe with medical specimen e.g body fluids can be disposed onsite. ●Quick Response Test result is informed via APP, SaaS or PaaS. ●Cost Saving No more costly medical specimen required transportation e.g. temperature control, time. Let contaminated medical specimen stay where it is collected. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

and Advanced Packaging for Heterogenous Integration Speaker: Ahmed Busnaina | Company: Nano OPS | Date: 12-13 October 2022 | Full Presentation Current electronic manufacturing processes have high operating and capital costs. These conventional processes consist of a complex series of steps using hundreds of high-energy deposition steps consuming massive amounts of electricity and water. A new scalable and sustainable technique for additively manufacture nano and microelectronics has been developed. The technique eliminates high-energy, chemically intense processing by utilizing direct assembly of nanoscale particles or other nanomaterials at ambient temperature and pressure onto a substrate, to precisely where the structures are built. Although, many of the nanomaterials-based electronics transistors were made using organic materials and/or nanomaterials that do not need to be sintered such as carbon nanotubes and 2D materials, however, to have a commercial impact, traditional semiconductors nanomaterials such as silicon and III-V and II-VI semiconductors, metals and dielectrics need to be printed to produce high performance electronics. In this presentation we show how this technology can print single crystal structures and make transistors using a purely additive (directed assembly enabled) with no etching or vacuum using inorganic semiconductors, metals and dielectrics. The process demonstrates the manufacturing of transistors with an on/off ratio greater than 106. This new technology will enable the fabrication of nanoelectronics while reducing the cost by 10-100 times and can print 1000 faster and 1000 smaller (down to 20nm) structures than inkjet-based printing. Moreover, the nanoscale printing platform enables the heterogeneous integration of interconnected circuit layers (like CMOS) of printed electronics and active and passive components on rigid or flexible substrates. Printed applications such as transistors, inverters, diodes, logic gates, display at the micro and nanoscale using inorganic and organic materials will be presented. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: David Keicher | Company: IDS | Date: 12-13 October 2022 | Full Presentation IDS’ novel, patented approach to aerosol printing has found very good acceptance around the world in multiple market segments and applications. The unique method for in-situ aerosol generation, minimizing transport distance and dual focusing lenses is delivering performance that is making aerosol printing ready for production. Now, IDS will be introducing its next iteration of improvements! IDS will discuss how new standards of daily print performance are being set, accelerated aerosol transport times that exceed conventional standards by multiples, and new novel technology to facilitate rapid cycling of the aerosol stream to serve high speed intermittent applications. These new capabilities will be discussed and data will be presented showing how these improvements affect print performance. Notable measured improvements will be showcased. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Marco Galiazzo | Company: TNO at Holst Centre | Date: Applied Materials | Full Presentation Developments in electronics and sensors have demonstrated the ability to manufacture wearable devices to remotely monitor human health in real-time at reasonable cost. A wide variety of smart sensors are now available, both on rigid and flexibRecentle substrates, to monitor the health and well-being of patients suffering from chronic illnesses. We’ve used our advanced screen-printing capabilities to manufacture medical devices: in particular, we studied and developed the realization of medical sensors entirely by screen printing. Thanks also to the constant improvements of the screen-printing ecosystem (paste, screen, equipment), enabling high processing yields and throughput, manufacturing of such devices by screen printing technology was proven to be a cost-efficient solution, compared to conventional microfabrication techniques, for mass manufacturing of healthcare devices. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

a cost-effective way to create smart plastics solutions Speaker: Pierre Ball | Company: BeLink Solutions | Date: 12-13 October 2022 | Full Presentation This presentation will highlight the key principles of innovation in printed electronics by BeLink Solutions along 3 axes: Equipment Materials Processes Replacing incumbent technologies is usually challenging, but hybrid electronics technologies are opening up new solution and design areas that are driving the migration and expansion of the market from conventional electronics to the printed electronics market. Here we will not only address sensors and traces based on well-known conductive screen-printing techniques, but more importantly how to integrate any variety of SMT components and packages (BGA, fine pitch) with direct PCB-on-film integration. In other words, how to bridge the gap between both technologies (conventional and printed electronics) to foster new designs in 2D and 3D electronics? Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda

Speaker: Shavi Spinzi | Company: Nano Dimension | Date: 12-13 October 2022 | Full Presentation This presentation will describe the industry drivers for increased electronic devices and circuits performance and packing density and how multi-level and multi-material Additively Manufactured Electronic (AME) technology enables corresponding innovative designs and fabrication from DC to mmWave applications. The presentation will focus on AME devices including design, materials, fabrication, and testing. This technology provides for electronic circuits not only in 2D but also in 3D where connections can be made without vias, but direct wiring between the electronic elements. The wires can be shielded and unshielded. Furthermore, the fabrication technology allows for traces with different thicknesses at the same level. Yielding fully functional boards with smaller size and lower weight, as compared to equivalent PCB fabricated ones. The presentation will include also devices with chip first embedded active ICs. Components such as capacitors, coils, band pass filters, and multilevel Fresnel lenses exhibit superior RF performance as compered Surface Mount Technology (SMT) of components. Join TechBlick on an annual pass to join all live online conference or online version of onsite conference access library of on-demand talks (600 talks + PDFs) portfolio of expert led masterclass year-round platform https://www.techblick.com/ And do NOT miss our flagship event in Berlin on 17-18 OCT 2023 focused on Reshaping the Future of Electronics. This event attracts 550-600 participants from all the world and offers a superb ambience and dynamic exhibition floor. To learn more visit https://www.techblick.com/electronicsreshaped To see feedback about previous event see https://www.techblick.com/events-agenda