Building Circuits from the Ground Up: Materials Innovation for Additive Electronics

As the electronics industry faces new challenges in miniaturization and performance, there is a critical need for innovative materials and processes to drive the next wave of growth. Traditional microelectronics technologies, from photolithography to PCB fabrication, have remained largely unchanged for decades. While additive manufacturing has seen rapid development, primarily on polymers and metals for structural applications, there is a significant opportunity to advance materials specifically
for electronics, such as low-loss dielectrics materials for high-frequency applications. Brewer Science is at the forefront of this innovation, leveraging its extensive expertise in polymer chemistry to develop printable, low-loss dielectric materials that meet the needs of modern electronics. These materials have the potential to revolutionize domestic electronics packaging by enabling new capabilities, reducing costs, and supporting a more resilient domestic supply chain. Additive manufacturing will enable more freedom for integrated and innovative design approaches, such as creating complex 3D traces and vias, and embedded functions like RF and optical waveguides, all within a single manufacturing process. This holistic method allows for the construction of electronic circuits from the ground up, breaking down traditional silos by merging the function of chips, packages, and PCBs into unified multifunctional components. As the U.S seeks to close the gap with global competitors and build a robust domestic infrastructure, additive manufacturing offers a pathway to achieving these goals. With astrong foundation in material science and a commitment to advancing additive electronics, Brewer Science is poised to lead the charge for disruptive change in the electronics industry, just as it did with bottom antireflective coatings 40 years ago.