Design and Manufacture of Test Coupons for Risk Reduction Studies of Printed Hybrid Electronics Assemblies

We will present an investigation of risks of failure in a prototype printed hybrid electronics (PHE) Arduino-type circuit to be fabricated using a variety of additive manufacturing technologies including aerosol-jet, syringe, and stereolithography (SLA) printing. The interfaces of different components and materials in this design introduce potential sources of failure including thermal expansion mismatches and silver migration resulting from temperature cycling. We will discuss the design rationale, fabrication methods, and testing conditions of three different test coupons, each of which isolates a different area of interest in the PHE assembly and seeks to identify and prevent the greatest risks.