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Brandon Prior

Senior Consultant

Prismark Partners

USA

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5G and Its Impact on Semiconductor and Packaging Supply Chain

Electronics Packaging Symposium 2021 (organised by Binghamton University)

4 November 2021

Online

Online

As we approach 2.5 years since the release of the first
commercial 5G phone to the market, the impact of 5G is now having considerable impact on the semiconductor and packaging supply chain. Even though 2020 was a down year for smartphone unit shipments, companies engaged in supplying 5G companies experienced their strongest growth in a decade, and the growth has continued at a feverish rate through 1H 2021.
This paper will look back at packaging innovations that have been seen to enable 5G, and also look forward to new requirements for "commodity" 5G products and phones. A brief review of basestations, particularly small cell basestations will provide insight on the increasing content and density of components within the infrastructure side as well.

Bio: Brandon Prior is a Senior Consultant at Prismark Partners. He joined Prismark in 1996 and is the author of their Semiconductor and Packaging Report. Brandon is responsible for the development of Prismark's business practice as it relates to semiconductor packaging technologies, as well as the oversight of research projects within that domain. Over the past twenty years, Prismark has developed business and service relationships with many of the leading electronics, semiconductor, packaging, assembly, equipment and material companies. Brandon has BA and BE degrees from Dartmouth College and the Thayer School of Engineering.

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