Thin, Flexible Alumina Ribbon Ceramic and its Application in 5G mmWave Filter
Electronics Packaging Symposium 2021 (organised by Binghamton University)
4 November 2021
Online
Online
Device manufacturers need innovative new materials to develop smarter, faster, smaller next-gen electronic devices. Corning has invented a new generation of high-performance ceramic substrates in entirely new form factors that can help with these problems. Thin flexible Alumina Ribbon Ceramic provides a set of attractive attributes with very low dielectric loss, electrical insulation and good thermal conduction. Its thin and large form factor provide an advantage to fit into many unique designs in a broad application space. In this talk, we introduce Alumina Ribbon Ceramic, with its key properties and downstream processing capabilities. We also present our research work on its potential application in 5G mmWave filter with transmission lines characterization in 30-170GHz band range.
Bio: Dr. ChengGang (CG) Zhuang is a project manager in inorganic material research at Corning Incorporate. He obtained his PhD in physics from Peking University and postdoctoral training at the Penn State University. He held a research assistant professor position in physics department at Temple University before joined Corning in 2011. He has 10 years innovation project experience in Energy Storage, Clean Energy, Clean Air, Architecture and Electronics with advanced glass and ceramics. His most recent research focus is application discovery of Corning Ribbon Ceramic, a new platform technology making thin, flexible high-quality ceramic substrate. Dr. Zhuang has published over 46 peer reviewed papers, 16 patent applications.






