Printed Electronics Via On-Demand Jetting of Liquid Metal Droplets

This presentation will explore the use of on-demand liquid metal droplet jetting to fabricate printed circuit patterns. Through proper control of drop size, jetting frequency, and drop spacing, solid metal traces whose conductivities match that of the bulk metal have been fabricated on temperature sensitive flexible polymer substrates. The process uses inexpensive wire, rather than nanoparticle ink, as the feedstock material. Pre and post-processing steps normally used with nanoparticle ink processes, such as substrate cleaning and ink drying + curing, are eliminated. The presentation will include examples of non-planar printing as well as 3D printed features without the need for support structures.

Bio: Denis Cormier is RIT’s Earl W. Brinkman Professor and Director of the New York State funded AMPrint Center for Advanced Technology. Dr. Cormier has worked in the area of 3D printing and related additive processes for nearly 25 years. Since joining RIT in 2009, his research has focused on technologies such as multi-material inkjet deposition, direct-write processes including aerosol printing and microdispensing, and pulsed photonic curing. Most recently, he has been focused on development of a liquid metal droplet jetting process for highly conductive flexible electronics with excellent substrate adhesion.