Ceramic-Epoxy Integrated Substrate Structures for E-Field Profiling in Ultra Dense Power

Wide Band Gap (WBG) power semiconductors provide much higher power densities than silicon-based systems, and can accomodate much higher thermal and Electric Field densities. A new approach to analyzing ultra-thin-ceramic/organic integrated structures using dielectric layering will be discussed. Design insights will be provided to reduce the triple-point field, while maintaining high thermal conductance.

Bio: Professor Douglas C. Hopkins, Ph.D. directs the Laboratory for Packaging Research in Electronic Energy Systems (PREES), is an affiliate faculty with the Center for Additive Manufacturing and Logistics (CAMAL), and is with the Department of Electrical and Computer Engineering, at North Carolina State University, since 2011. He is professor Emeritus from the University at Buffalo (SUNY Buffalo, 2011). His Ph.D. is from Virginia Tech (1989). He has held Visiting Faculty appointments with the Army, NASA, Lawrence Livermore, and the Ohio Space Institute, was a reviewer with the Nat’l Academy of Sciences, co-founded DensePower, LLC as president and CTO, and has published over 150 journal and conference articles. His early career was at the R&D centers of General Electric and Carrier Air-Conditioning companies. His primary research is in very high frequency, high density power electronic systems, extreme environment electronics, and recently in organic-based high temperature (>300˚C) systems. Dr. Hopkins cofounded the IEEE/PSMA joint Power Packaging Committee (1994), cofounder of Int’l Wksp on Integrated Power Packaging (IWIPP, 1998), received the IMAPS Outstanding Educator Award (2013), founder of the IEEE/IMAPS/PSMA “Int’l Symp. on 3D Power Electronics Integrations and Manufacturing” (3D-PEIM, 2016), founder and chairs the IMAPS “International Symposium on Advanced Power Electronics Packaging (APEPS, 2021). He is an IMAPS Fellow (2007) and member of the IMAPS Executive Council (2019-).