Minimum Solder Paste Bump Size using Gravure Offset Printing for Micro LEDs

Application of micro-LEDs in a wide range of products is expected and with the ever-increasing trend towards miniaturization, very small and precisely placed print is a requirement. This presentation will examine the smallest diameter bump that can be accurately produced with gravure offset.Current bonding techniques using ACF can be improved by moving to solder paste bonding which is expected. Solder paste itself works very well with gravure offset with the main requirement of small, precise solder bumps.Within the process of gravure offset printing creating and maintaining the minimum possible bump size is determined by two main variables and the presentation examines those variables and reveals the smallest possible bump diameter that can be created using gravure offset and solder paste.