Advancing Micro-Printing: High-Precision Gravure Offset for Next-Generation Electronics

Using gravure offset technology under development, we have created an advanced micro-printing process capable of producing fine patterns with high positional accuracy (±5 µm, 3σ) and feature sizes down to 5 µm. This approach enables precise alignment for multilayer printing, allowing controlled thickness build-up without defects. It is optimized for micro-solder and copper paste deposition, supporting next-generation applications such as high-density surface-mount components, micro-bumps, and micro-LED assembly. By eliminating plating processes, it offers an eco-friendly alternative while ensuring high reliability and strong resistance to migration. Ongoing developments include nano-copper pastes with excellent conductivity and fine-line capability, expanding the potential for dense, high-performance interconnects in advanced packaging and printed electronics.