How microLED display development can benefit through versatility of adhesives

Despite most microLED application are currently at prototype stage the race for miniaturization is already ongoing towards 10-micron edge length and even below. This necessitates new solutions for the transfer and connecting these microLED chips to the main substrate. A promising material class are functional polymers or adhesives. These materials can be tailored in certain ways to comply with the demands of the display manufacturers.

In this talk we will present the capabilities of adhesives for electrical connection under the assumption of a non-monolithic flip chip design. It will be shown that the adhesive can be applied in multiply ways, while printing seems to be a promising option, yet. The tests have been conducted under lab scale conditions with two different pick & place tools (automated and manual). Moreover, two different substrates have been investigated, one is a wafer the other is rigid PCB.

The presented test results will show that adhesives are a versatile material candidate to enable the further development of microLED displays.