Laser Pattern Transfer Printing for High-Viscosity Pastes: Enabling Future Challenges in Microelectronics, Advanced Packaging & Photovoltaic.

The miniaturization and complexity of modern microelectronics and advanced packaging present significant manufacturing challenges, often requiring the use of specialized low-viscosity inks and expensive plating processes. To address these limitations, we introduce Pattern Transfer Printing (PTP™), a novel laser-based, non-contact technology capable of microscale printing with high-viscosity pastes.
This technology enables the use of standard metal pastes, such as silver, copper, and solder, to produce high-resolution conductive patterns and electrodes. PTP™ has been successfully implemented in the photovoltaic (PV) industry for high-throughput, mass production, achieving fine-line fingers as narrow as 10 μm for both TOPCon and HJT cell technologies.
Furthermore, PTP™ serves as an effective alternative to costly plating methods in the semiconductor industry, capable of printing solder bumps down to 20 μm for advanced packaging applications. The unique capabilities of PTP™—combining high-resolution patterning, material versatility, and high aspect ratios—make it a key enabling technology for the next generation of semiconductor and microelectronic manufacturing.