High-Resolution 3D-Printed Conductive Features In Single Micron Scale

We introduce the ultra-precise deposition (UPD) technology for rapid prototyping of microelectronic devices. UPD allows maskless deposition of high-viscosity metallic and non-metallic inks with the printed feature size as small as 1 μm. XTPL technology answers some of the key challenges in the fabrication of high-density microelectronics, including the ability to print on complex 3D substrates and obtain structures with arbitrary shapes, including lines, dots, crosses, and meshes