Soldering Advanced Packaged Components to low Temp Flexible Substrate PCB

Harry is an Engineer at PulseForge working on Applications and R&D. His industry experience includes startup and entrepreneurship ventures with novel nanomaterials, as well as in characterization and analysis with semiconductors. Harry has published and reviewed dozens of articles for scientific journals and holds a PhD in Materials Science and Engineering from the University of Texas at Austin where he researched synthesis, characterization, and applications of novel nanomaterials.