Challenges and solutions for jetting in printed electronics

With the increasing demand for wearable sensors and smart devices, printed electronics has gained momentum in the recent years. Printed electronics offers more flexible, thinner and lighter products compared with traditional technologies. Choosing the right transfer technology for conductive and nonconductive adhesives is a challenge. Attributes like particle size, form, metal load, density, etc., have an enormous influence on rheology and, consequently, on the dispensability of the adhesives. The parametrization and transfer technology shall be chosen and adjusted accordingly. In this talk, we will discuss how Essemtec can help you choose the right dispensing–jetting technology to address your challenges. Test cases will be presented, along with a glimpse of our solutions and know-how.