Jetting and Mounting Solutions for Printed Electronics: Overcoming Process Challenges

With the increasing demand for wearable sensors and smart devices, printed electronics has gained significant momentum in recent years. Offering more flexible, thinner, and lighter products compared to traditional technologies, this emerging field introduces unique process challenges—especially in material transfer and component assembly.

Choosing the right transfer technology for conductive and nonconductive adhesives is critical. Factors such as particle size, form, metal load, and density greatly influence rheology and, in turn, the dispensability of adhesives. The same level of precision and adaptability is required for the accurate mounting of ultra-small and sensitive components on non-traditional substrates.

In this presentation, Essemtec shares its latest innovations in both high-precision jetting and mounting tailored for printed electronics. We will explore how our adaptive all-in-one platforms address common production challenges, from fine-pitch dispensing to component placement on flexible materials. Test cases and real-world examples will be presented, offering a glimpse into our proven solutions and application know-how.