Eric Wolf | Essemtec: What strategies does Essemtec employ to create varied adhesive structures for optimal component bonding?
00:07:25 - 00:08:21
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What strategies does Essemtec employ to create varied adhesive structures for optimal component bonding?
Essemtec's platform offers multiple strategies for creating varied adhesive structures tailored for optimal component bonding. These include depositing multiple, lower-temperature dots to form taller, cone-like structures that meet the component first during placement. Alternatively, single-shot, donut-like structures can be created, which are faster to produce and often utilize higher temperatures for chip bonding materials, resulting in a flatter adhesive layer on the substrate.
The system allows for precise control over temperature to manipulate surface tension, enabling the creation of either built-up or flattened adhesive profiles. Furthermore, modulating the diameter and number of dots in different locations allows for the development of highly controlled shapes beneath the component, optimizing adhesion and stability.
By adjusting these parameters, Essemtec's platform can generate a wide variety of dot sizes and shapes with a single mechanical setup. The primary trade-off when moving from the smallest, highest-speed dots to larger, built-up structures is speed, which may be a critical factor for high-volume applications but less significant for lower-volume production.
In this short video, you can learn:
* How to create cone-like or donut-like adhesive structures.
* The impact of temperature on adhesive surface tension and profile.
* How to modulate dot diameter and number for controlled shapes.
π **Clip Abstract** This segment details Essemtec's strategies for creating diverse adhesive structures by manipulating temperature, dot size, and dot placement, enabling optimized component bonding. It highlights the trade-off between speed and structural complexity in adhesive deposition.
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#AdhesiveProfiling, #SurfaceTensionControl, #MicroDispensing, #ComponentBondingOptimization, #MicroelectronicsAssembly, #SemiconductorPackaging
This is a highlight of the presentation:
Jetting and Mounting Solutions for Printed Electronics: Overcoming Process Challenges
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00:05:09 - 00:05:47
How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties?
How does Essemtec manage the complexities of dispensing non-Newtonian fluids with varying rheological properties?
Essemtec emphasizes the importance of understanding the rheology of dispensed materials, particularly the concept of shear thinning in thixotropic pastes. These materials, classified as non-Newtonian fluids, exhibit reduced viscosity under higher pressure. This behavior is critical in dispensing applications where pistons force material through an aperture.
The system accounts for variables such as dispensing speed and temperature to determine the optimal open time for achieving desired dot sizes from small apertures. Essemtec collaborates with material companies to qualify specific parameters, acknowledging that these relationships are often non-linear and can result in complex rheological behaviors at different pressure levels.
The shape of the particles within the paste also influences dispensing characteristics. Solder paste typically contains spherical particles, while conductive epoxies often feature silver in flake form, and structural glues may contain colloidal silica. Understanding these particle morphologies is crucial for achieving consistent and reliable dispensing results.
In this short video, you can learn:
* How shear thinning affects dispensing of non-Newtonian fluids.
* The importance of material rheology in dispensing applications.
* How particle shape influences dispensing characteristics.
π **Clip Abstract** This segment highlights Essemtec's approach to understanding and managing the rheological complexities of dispensing various materials, including the impact of shear thinning and particle morphology. It emphasizes the importance of qualifying material parameters for consistent dispensing results.
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#NonNewtonianFluids, #ShearThinning, #ParticleMorphology, #PrecisionDispensing, #SemiconductorManufacturing, #AdvancedPackaging
00:06:30 - 00:07:25
How does Essemtec's dispensing technology address the limitations of fixed-plane stencils in printed electronics?
How does Essemtec's dispensing technology address the limitations of fixed-plane stencils in printed electronics?
Essemtec addresses the design limitations imposed by traditional stencils in printed electronics, where features are typically constrained to a single, fixed plane. While this approach can be effective, it may not always be optimal for achieving desired outcomes, such as ensuring proper glue contact with components during pick and place or pre-filling areas with glue before solder joint formation.
The system offers the flexibility to control the dispensing process to accommodate different application requirements. This includes the ability to deposit glue before component placement or to allow solder joint formation prior to glue application. The choice between these approaches depends on the specific application and the desired level of adhesion and reliability.
The ability to manipulate the dispensing process, whether through the use of different glue types or by adjusting dispensing parameters for a single glue, is crucial for achieving high reliability and good adhesion in component assembly. This level of control allows for tailored solutions that address the specific needs of each application.
In this short video, you can learn:
* The limitations of fixed-plane stencils in printed electronics.
* How Essemtec's dispensing technology overcomes these limitations.
* The importance of controlling glue application for high reliability.
π **Clip Abstract** This segment discusses how Essemtec's dispensing technology provides solutions to the constraints of fixed-plane stencils by offering precise control over glue application, enhancing component adhesion and reliability. It highlights the flexibility to tailor the dispensing process to specific application needs.
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#EssemtecDispensing, #PrintedElectronics, #GlueDispensingControl, #StencilFreeAssembly, #SemiconductorAssembly, #AdvancedPackaging