HP 3D Printing: Metal Jet Printing and 3D Printed Electronics

Within this talk, I will cover two items: HP’s released product of Metal Jet printing, a metal binder jet printing process, and 3D Printed Electronics with Multi Jet Fusion, a research-level activity led out of HP Labs. Our Metal Jet process is class leading on many metrics like cost and part quality, taking advantage of our decades of R&D on inkjet technology, utilizing a polymeric binder that allows for quick and clean removal during the thermal processing step. We have also leveraged many of the successful approaches used in the MIM industry to produce final metal parts at scale.
For our 3D Printed Electronics (3D PE) research, we have taken advantage of the multi-fluid capabilities of Multi Jet Fusion (MJF, HP’s Polymer 3D Print technology) process to create conductive features within polymeric parts by using a conductive agent, with print speeds and final part strengths similar to MJF. I will present on our research into creating conductive traces, vias and contacts, which can be made anywhere within the printed part. I will also cover the fabrication of active devices, like a strain gauge and USB light device, as well as present on printing of resistors and cover efforts on post-print processing for further performance optimizations.

Bio: Jarrid Wittkopf is the principal investigator for the 3D for Electronics (3D4E) Project in HP Lab’s 3D Print Lab. There he focuses on advancing the core capabilities of 3D4E project as well as investigating applications and opportunities for new business creation utilizing the 3D4E technology. Before joining HP, Jarrid finished his doctorate in chemical engineering at the University of Delaware in 2017. His PhD focused on oxygen reduction reaction catalysts for hydrogen fuel cells, electrochemistry, and nanomaterial synthesis.