Exposing The Anatomy Of Functional Surfaces
Printed, Flexible, Hybrid, & InMold Electronics 2021
9 March 2021
Online
TechBlick Platform
Driven by the desire for ever more compact and sophisticated devices, increasing demands for improved functionality and for more customization options, OEMs are turning to functional integration. Thin, three-dimensional parts which were previously simply thought of as covers, or “skins” can now incorporate diverse functionality. This presentation will explore different means of achieving the above goals through the use of materials from Covestro.
John Skabardonis
High-Tech Materials for Electronics @ Covestro
Bio
John Skabardonis is a Chemist-turned-Marketer-Communicator in the Polycarbonates business unit at Covestro, LLC. He is responsible for technical marketing for electronics, electrical and appliances in the Americas region. John is fascinated by the rapid evolution of technology and is focused on materials and techniques which enable this evolution. He is also intensely interested in social media as a means of helping make information easily accessible. John received a Ph.D. in Physical/Organic Chemistry from Case Western Reserve University. He is a design advocate & a member of the Industrial Designers Society of America, a Distinguished Toastmaster and a chairholder in the Color Marketing Group.






