Speeding up printed electronics medical device piloting

New equipment for producing 3D- printed structures with electrical and fluidic pathways traveling through different layers of materials has been acquired. Novel hybrid assembly processes like surface mounting technology, chip bonding and sealing are complementing printed structures for further integration.
As an outcome multilayer elastic printed circuits can be fabricated, and market mitigation is made easier due to compatibility of traditional multilayer rigid printed circuits design rules.
Technologies are addressed to build the bridge between research and industrial sector. Applicable practices are followed and documented according to ISO13485 medical device requirements. This ensures faster development and mitigation of new technologies in the medical domain.