Selective Surface Activation Induced by Laser (SSAIL) – technology of electric circuit formation on various 3D dielectric surfaces

Electric circuit traces formation on 3D-shaped dielectrics is one of the highest challenges in 3D Mechatronic Integrated Devices (3D-MID). The advanced technology of Selective Surface Activation Induced by a Laser (SSAIL) can solve emerged production issues for electric traces. SSAIL contains three main steps: laser modification of the dielectric surface, chemical activation of modified areas and electroless plating of activated parts. Ultrashort pulse laser-induced physical and chemical bonding between dielectric substrate material and plated metal guaranty strong adhesion. The process could be applied almost on any dielectric by adapting laser and chemical parameters. No additives are required into base materialand, therefore, polymers, ceramics, glases, composites or even semiconductors can be used as a substrate. Conductive lines as narrow as 1 micrometer can be fabricated using special beam shaping techniques. High diversity of substrate materials and capability of narrow trace formation extends technology application from standard 3D MID to transparent conductive electrodes.