Scalable 3D Printed Electronics - from “Fully Additive” to High Volume

This presentation will review the state-of-the-art related to the production of 3D mechatronic systems using Additive Manufacturing (AM) and review developments for scaling the processes through all stages, from one off prototyping to high volume manufacture.

A reconfigurable array of structural and electronics printing, pre- and post processing techniques are combined with SMD technologies to enable digitally driven 3D electronics manufacturing. The resultant flexible process chains can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. Selection of the most appropriate print, pre- and post-processing methods with the subsequent effect on process speed and cost will be discussed.

A brief review of current applications, spanning 3D electronic circuits, antenna, sensor and heater patterns will be conducted along with an update on the progression to First Time Right manufacture of complex devices.